A resist composition which generates an acid upon exposure and changes a solubility in a developing solution under an action of the acid, the resist composition containing a base material component whose solubility in the developing solution changes under the action of an acid and an acid generator represented by general formula (b1). In general formula (b-1), R.sup.b1 represents an aromatic hydrocarbon group having at least one alkyl group having 3 or more carbon atoms as a substituent, Y.sup.b1 represents a divalent linking group containing an ester bond (—C(═O)—O— or —O—C(═O)—), V.sup.b1 represents an alkylene group, a fluorinated alkylene group, or a single bond, m is an integer of 1 or more, and M.sup.m+ represents an m-valent organic cation.

R.sup.b1—Y.sup.b1—V.sup.b1—CF.sub.2—SO.sub.3.sup.−(M.sup.m+).sub.1/m  (b1)

An adhesive bonding method that includes bonding a handling wafer to a front side surface of a device wafer with an adhesive comprising N-substituted maleimide copolymers. The device wafer may then be thinned from the backside surface of the device wafer while the device wafer is adhesively engaged to the handling wafer. The adhesive can then be removed by laser debonding, wherein the device wafer is separated from the handling wafer.

An adhesive bonding method that includes bonding a handling wafer to a front side surface of a device wafer with an adhesive comprising N-substituted maleimide copolymers. The device wafer may then be thinned from the backside surface of the device wafer while the device wafer is adhesively engaged to the handling wafer. The adhesive can then be removed by laser debonding, wherein the device wafer is separated from the handling wafer.

[Objects] Provided is an ionomer resin composition that, when molded into a film shape, is small in both of orientational birefringence and photoelastic birefringence and excellent in transparency, heat resistance, flexibility, and size stability. Additionally, provided are an optical film including the ionomer resin composition, a polarizing plate including the optical film, and a liquid crystal display apparatus including the same. [Solution] An ionomer resin composition according to the present invention is an ionomer resin composition obtained by reacting an acrylic thermoplastic resin (X) including a chain alkyl (meth)acrylate unit (a), an N-substituted maleimide unit (b), and an unsaturated acid and/or unsaturated acid anhydride unit (c) with a metal compound (Y), in which the acrylic thermoplastic resin (X) includes the chain alkyl (meth)acrylate unit (a), the N-substituted maleimide unit (b), and the unsaturated acid and/or unsaturated acid anhydride unit (c) in a total amount of 80% by mass or more, and contents of the structural units (a), (b), and (c) with respect to 100 parts by mass in total of the acrylic thermoplastic resin (X) except for the unsaturated acid and/or unsaturated acid anhydride unit (c) are from 65 to 87 parts by mass, from 1 to 30 parts by mass, and from 0.1 to 5 parts by mass, respectively.

[Objects] Provided is an ionomer resin composition that, when molded into a film shape, is small in both of orientational birefringence and photoelastic birefringence and excellent in transparency, heat resistance, flexibility, and size stability. Additionally, provided are an optical film including the ionomer resin composition, a polarizing plate including the optical film, and a liquid crystal display apparatus including the same. [Solution] An ionomer resin composition according to the present invention is an ionomer resin composition obtained by reacting an acrylic thermoplastic resin (X) including a chain alkyl (meth)acrylate unit (a), an N-substituted maleimide unit (b), and an unsaturated acid and/or unsaturated acid anhydride unit (c) with a metal compound (Y), in which the acrylic thermoplastic resin (X) includes the chain alkyl (meth)acrylate unit (a), the N-substituted maleimide unit (b), and the unsaturated acid and/or unsaturated acid anhydride unit (c) in a total amount of 80% by mass or more, and contents of the structural units (a), (b), and (c) with respect to 100 parts by mass in total of the acrylic thermoplastic resin (X) except for the unsaturated acid and/or unsaturated acid anhydride unit (c) are from 65 to 87 parts by mass, from 1 to 30 parts by mass, and from 0.1 to 5 parts by mass, respectively.

A methacrylic resin composition comprises a methacrylic resin, the methacrylic resin comprising: 50 mass % to 97 mass % of a methacrylic acid ester monomer unit (A); 3 mass % to 30 mass % of a structural unit (B) having a cyclic structure-containing main chain; and 0 mass % to 20 mass % of another vinyl monomer unit (C) that is copolymerizable with a methacrylic acid ester monomer, wherein the methacrylic resin satisfies a specific condition; and the composition has a weight average molecular weight residual ratio of 80% or more upon heating under a nitrogen atmosphere at 280° C. for 1 hour, and has a weight average molecular weight residual ratio of 80% or more upon heating in air at 280° C. for 0.5 hours.

A methacrylic resin composition comprises a methacrylic resin, the methacrylic resin comprising: 50 mass % to 97 mass % of a methacrylic acid ester monomer unit (A); 3 mass % to 30 mass % of a structural unit (B) having a cyclic structure-containing main chain; and 0 mass % to 20 mass % of another vinyl monomer unit (C) that is copolymerizable with a methacrylic acid ester monomer, wherein the methacrylic resin satisfies a specific condition; and the composition has a weight average molecular weight residual ratio of 80% or more upon heating under a nitrogen atmosphere at 280° C. for 1 hour, and has a weight average molecular weight residual ratio of 80% or more upon heating in air at 280° C. for 0.5 hours.

The present invention provides a sealant composition for electronic device, in which the curing does not proceed when heated, which does not cause the problem of use in the mounting process of electronic device. The present invention relates to a sealant composition for electronic device comprising (a) a compound having two or more (meth)acryloyl groups and (c) a nitroxide compound and/or a thiocarbonylthio compound.

A thiosulfate polymer composition includes an electron-accepting photosensitizer component, either as a separate compound or as an attachment to the thiosulfate polymer. The thiosulfate polymer composition can be applied to various articles, or used to form a predetermined polymeric pattern after photothermal reaction to form crosslinked disulfide bonds, removing non-crosslinked polymer, and reaction with a disulfide-reactive material. Such thiosulfate polymer compositions can also be used to sequester metals in nanoparticulate form, and as a way for shaping human hair in hairdressing operations.

Provided are a curable composition including a colorant, a resin, and a thiol compound, in which a thiol value is 6×10.sup.−6 mmol/g to 6×10.sup.−4 mmol/g; a curable composition including a colorant, a resin, and a thiol compound, in which a content of the thiol compound is 1 ppm to 99 ppm; a cured product of the curable composition; a color filter including the cured product; and a solid-state imaging element and an image display device including the color filter.