Patent classifications
C08F222/404
RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
A resin composition of the present invention contains: a maleimide compound (A) having a maleimide functional group equivalent of 300 g/eq. or more, and a transmittance of 1% or more at a wavelength of 405 nm (h-line); a maleimide compound (B) having a maleimide functional group equivalent of less than 300 g/eq.; and a photo initiator (C) having an absorbance of 0.1 or more at a wavelength of 405 nm (h-line).
RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
A resin composition of the present invention contains: a maleimide compound (A) having a maleimide functional group equivalent of 300 g/eq. or more, and a transmittance of 1% or more at a wavelength of 405 nm (h-line); a maleimide compound (B) having a maleimide functional group equivalent of less than 300 g/eq.; and a photo initiator (C) having an absorbance of 0.1 or more at a wavelength of 405 nm (h-line).
Photosensitive microcapsules
A photosensitive microcapsule having a shell encapsulating a core material. The core material can comprise a benefit agent and the shell can comprise a photosensitive polymer. The photosensitive polymer can include one or more photosensitive moieties having a substituted amine and a 1,3 dione moiety. The core material can be released from the photosensitive microcapsule upon exposure to an electromagnetic radiation field selected from the group consisting of infrared radiation, visible light, ultraviolet radiation and mixtures thereof.
Photosensitive microcapsules
A photosensitive microcapsule having a shell encapsulating a core material. The core material can comprise a benefit agent and the shell can comprise a photosensitive polymer. The photosensitive polymer can include one or more photosensitive moieties having a substituted amine and a 1,3 dione moiety. The core material can be released from the photosensitive microcapsule upon exposure to an electromagnetic radiation field selected from the group consisting of infrared radiation, visible light, ultraviolet radiation and mixtures thereof.
Film touch sensor and method for fabricating the same
A film touch sensor includes a separation layer, a protective layer which is disposed on the separation layer and is a cured layer of a polymer having a repeating unit represented by Formula 1 or 2, and an electrode pattern layer disposed on the protective layer, such that it is possible to suppress thermal damage such as wrinkles, or cracks of an protective layer, which may occur in high-temperature deposition and annealing processes, and significantly reduce an occurrence rate of cracks during peeling-off the same from a carrier substrate.
ACTIVE ENERGY RAY-CURABLE RESIN COMPOSITION AND INK FOR THREE-DIMENSIONAL MOLDING SUPPORT MATERIALS
An active energy ray-curable resin composition for three-dimensional molding support materials is provided and includes 0.1 to 90% by mass of a non-polymerizable compound (A) in which inorganic groups/organic groups (I/O value) equals 0.4 to 1.8, and 10 to 99.9% by mass of a polymerizable compound (B) in which inorganic groups/organic groups (I/O value) equals 0.8 to 3.0. By using the active energy ray-curable resin composition, an ink for a support material having well-balanced inorganicity and organicity is obtained, and by using the ink, the support material is easily removed from a roughly molded product without corrosion of ink tanks, ink ejection heads, and similar objects, and a large-sized and highly accurate three-dimensional molded product is obtained.
ACTIVE ENERGY RAY-CURABLE RESIN COMPOSITION AND INK FOR THREE-DIMENSIONAL MOLDING SUPPORT MATERIALS
An active energy ray-curable resin composition for three-dimensional molding support materials is provided and includes 0.1 to 90% by mass of a non-polymerizable compound (A) in which inorganic groups/organic groups (I/O value) equals 0.4 to 1.8, and 10 to 99.9% by mass of a polymerizable compound (B) in which inorganic groups/organic groups (I/O value) equals 0.8 to 3.0. By using the active energy ray-curable resin composition, an ink for a support material having well-balanced inorganicity and organicity is obtained, and by using the ink, the support material is easily removed from a roughly molded product without corrosion of ink tanks, ink ejection heads, and similar objects, and a large-sized and highly accurate three-dimensional molded product is obtained.
Flame-retardant bismaleimide resin and preparation method thereof
Disclosed are a flame-retardant bismaleimide resin and a preparation method thereof comprising: forming an eugenol salt suspensoid from a whole biomass eugenol in the present of a strong alkali metal base, adding dropwisely a solution of phosphorus oxychloride in methyl chloride to react to obtain a biomass-based phosphate flame-retardant; mixing bismaleimide, 2,2-diallylbisphenol with the obtained phosphate, curing and posttreating to obtain the flame-retardant bismaleimide resin. Compared with petroleum-based bismaleimide resin, the flame-retardant bismaleimide resin prepared by the present invention is obtained from eugenol derived from biomass, and the raw material is green and renewable. It maintains mechanical properties and processing properties of the petroleum-based bismaleimide resin and has an excellent flame-retardant property. The preparation method provided by the invention has the advantages of low cost and simple production process, and has wide application prospect in the fields of aerospace, electronic information, electrical insulation and the like.
Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising them
The resin composition of the present invention comprises a prepolymer (P) and a thermosetting component, the prepolymer (P) being obtained by polymerizing an alkenyl-substituted nadimide (A), a maleimide compound (B), and an amino-modified silicone (C).
Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising them
The resin composition of the present invention comprises an alkenyl-substituted nadimide (A), a maleimide compound (B), and an amino-modified silicone (C).