Biodegradable, cross-linked polymer particle embolics and methods of making the same are described. The particle embolics can be used as embolization agents.

The present invention discloses a freezing-illumination method for preparing porous gels, comprising the steps of: (a) synthesizing the gels containing dynamic exchangeable bonds; (b) illuminating the gels under frozen state by certain wavelength light source; (c) elevating the temperature and melt the ice crystals within the gels to get the porous structure. The dynamic exchangeable bonds existing in the gels include double/multi-sulfur bond, hydrazine bond, boronic ester bond. Catalyst is also included in the gel composition to activate the bond exchange reactions under illumination. This new method for preparing porous gels is easy to operate and suitable for most kinds of gels. Meanwhile, it can spatially control the pore structure within the gels by local illumination.

The present invention discloses a freezing-illumination method for preparing porous gels, comprising the steps of: (a) synthesizing the gels containing dynamic exchangeable bonds; (b) illuminating the gels under frozen state by certain wavelength light source; (c) elevating the temperature and melt the ice crystals within the gels to get the porous structure. The dynamic exchangeable bonds existing in the gels include double/multi-sulfur bond, hydrazine bond, boronic ester bond. Catalyst is also included in the gel composition to activate the bond exchange reactions under illumination. This new method for preparing porous gels is easy to operate and suitable for most kinds of gels. Meanwhile, it can spatially control the pore structure within the gels by local illumination.

The present invention relates to compounds according to formula (I) and to heat-curable compositions based on polymaleimide resin systems comprising such compounds as co-monomers: wherein R.sup.1 is hydrogen or an alkenylphenoxy group, R.sup.2 is an alkenylphenoxy group, and R.sup.3 is hydrogen or an alkyl group with 1 to 4 carbon atoms. The present invention also relates to cross-linked resins obtainable by curing such compositions. Compounds of the present invention can be used amongst others in fields like structural adhesives, matrix resins for fiber prepregs, molding compounds, as well as structural and/or electrical composites. ##STR00001##

Disclosed is a vinylbenzyl imide resin useful in conjunction with other components to prepare a resin composition for making such as a prepreg, a resin film, a resin film with copper foil, a laminate or a printed circuit board, having improved one or more properties including resin flow, resin filling property, flame retardancy, glass transition temperature, thermal resistance, dielectric constant, dissipation factor and interlayer bonding strength. Also disclosed is a method of preparing the vinylbenzyl imide resin, its prepolymer, a resin composition comprising the vinylbenzyl imide resin and/or its polymer and an article made therefrom.

Biodegradable, cross-linked polymer particle embolics and methods of making the same are described. The particle embolics can be used as embolization agents.

Biodegradable, cross-linked polymer particle embolics and methods of making the same are described. The particle embolics can be used as embolization agents.

The present invention relates to a pressure-sensitive adhesive composition, a protective film, an optical element, and a display device. A pressure-sensitive adhesive sheet formed using the pressure-sensitive adhesive composition according to the present invention can have proper high-speed and low-speed peel strengths and simultaneously can exhibit an excellent balance between the high-speed and low-speed peel strengths. The pressure-sensitive adhesive sheet formed using the pressure-sensitive adhesive composition according to one exemplary embodiment of the present invention exhibits a proper level of surface resistance and excellent electrostatic discharge characteristics, and has no contaminants with respect to an adherend even when the pressure-sensitive adhesive sheet is peeled from the adherend after the pressure-sensitive adhesive sheet is attached to the adherend for a long period of time. Such a pressure-sensitive adhesive sheet formed using the pressure-sensitive adhesive composition according to one exemplary embodiment of the present invention can be applied to various fields of applications. For example, the pressure-sensitive adhesive sheet can be used as a protective film for optical members such as polarizing plates.

The present invention relates to a pressure-sensitive adhesive composition, a protective film, an optical element, and a display device. A pressure-sensitive adhesive sheet formed using the pressure-sensitive adhesive composition according to the present invention can have proper high-speed and low-speed peel strengths and simultaneously can exhibit an excellent balance between the high-speed and low-speed peel strengths. The pressure-sensitive adhesive sheet formed using the pressure-sensitive adhesive composition according to one exemplary embodiment of the present invention exhibits a proper level of surface resistance and excellent electrostatic discharge characteristics, and has no contaminants with respect to an adherend even when the pressure-sensitive adhesive sheet is peeled from the adherend after the pressure-sensitive adhesive sheet is attached to the adherend for a long period of time. Such a pressure-sensitive adhesive sheet formed using the pressure-sensitive adhesive composition according to one exemplary embodiment of the present invention can be applied to various fields of applications. For example, the pressure-sensitive adhesive sheet can be used as a protective film for optical members such as polarizing plates.

The present invention relates to compounds according to formula (I) and to heat-curable compositions based on polymaleimide resin systems comprising such compounds as co-monomers: wherein R.sup.1 is hydrogen or an alkenylphenoxy group, R.sup.2 is an alkenylphenoxy group, and R.sup.3 is hydrogen or an alkyl group with 1 to 4 carbon atoms. The present invention also relates to cross-linked resins obtainable by curing such compositions. Compounds of the present invention can be used amongst others in fields like structural adhesives, matrix resins for fiber prepregs, moulding compounds, as well as structural and/or electrical composites.

##STR00001##