A propylene-ethylene-diene terpolymer and method of making such comprising from 2% to 25% wt % by weight of ethylene, from 98% to 75% wt % by weight propylene and from 1% to 21% wt % by weight of a diene, wherein the terpolymer has a crystallinity of less than 3%, a melt flow rate (MFR) of less than 10 and a Tg by DSC of from −2° C. to −25° C. and methods to prepare the terpolymer are depicted.

An object of the present invention is to provide a photocurable resin composition that can cope with application by screen printing and can be photocured in a short time. The present invention relates to a photocurable resin composition containing the following components (A) to (D): component (A): a polymer having one or more (meth)acryloyl groups and a polyisobutylene skeleton containing —[CH.sub.2C(CH.sub.3).sub.2]— unit, component (B): a monofunctional monomer containing the following component (b1) and component (b2), component (b1): a monofunctional monomer having a (meth)acryloyl group and a hydroxy group, component (b2): a monofunctional monomer having a (meth)acryloyl group and no hydroxy group, component (C): a radical polymerization initiator, and component (D): organic resin particles.

An object of the present invention is to provide a photocurable resin composition that can cope with application by screen printing and can be photocured in a short time. The present invention relates to a photocurable resin composition containing the following components (A) to (D): component (A): a polymer having one or more (meth)acryloyl groups and a polyisobutylene skeleton containing —[CH.sub.2C(CH.sub.3).sub.2]— unit, component (B): a monofunctional monomer containing the following component (b1) and component (b2), component (b1): a monofunctional monomer having a (meth)acryloyl group and a hydroxy group, component (b2): a monofunctional monomer having a (meth)acryloyl group and no hydroxy group, component (C): a radical polymerization initiator, and component (D): organic resin particles.

In an aspect, a method of synthesizing a graft copolymer comprises the steps of: copolymerizing a first macromonomer and a first reactive diluent; wherein said first macromonomer comprises a first backbone precursor directly or indirectly covalently linked to a first polymer side chain group; wherein said reactive diluent is provided in the presence of the first macromonomer at an amount selected so as to result in formation said graft copolymer having a first backbone incorporating said diluent and said first macromonomer in a first polymer block characterized by a preselected first graft density or a preselected first graft distribution of said first macromonomer. In some embodiments of this aspect, said preselected first graft density is any value selected from the range of 0.05 to 0.75. In some methods, the composition and amount of said diluent is selected to provide both a first preselected first graft density and a first preselected first graft distribution.

The present invention provides a light curable (meth)acrylate resin composition for thermoplastic elastomer bonding. The light curable (meth)acrylate resin composition of the present invention comprises: a (meth)acrylic monomer, a polyolefin (meth)acrylate oligomer having a viscosity of 200 000 to 2 500 000 mPa*s at 25° C., and a photoinitiator. The present invention also provides a cured product of the light curable (meth)acrylate resin composition and a use of the composition.

The present invention provides a light curable (meth)acrylate resin composition for thermoplastic elastomer bonding. The light curable (meth)acrylate resin composition of the present invention comprises: a (meth)acrylic monomer, a polyolefin (meth)acrylate oligomer having a viscosity of 200 000 to 2 500 000 mPa*s at 25° C., and a photoinitiator. The present invention also provides a cured product of the light curable (meth)acrylate resin composition and a use of the composition.

The present disclosure relates to a composition for encapsulating an organic electronic element and an organic electronic device comprising the same, and provides an encapsulation composition which can form an encapsulation structure capable of effectively blocking moisture or oxygen introduced from the outside into the organic electronic device, thereby securing the lifespan of the organic electronic device and implementing endurance reliability of the encapsulation structure at high temperature and high humidity, and has high shape retainability, and an organic electronic device comprising the same.

The present disclosure relates to a composition for encapsulating an organic electronic element and an organic electronic device comprising the same, and provides an encapsulation composition which can form an encapsulation structure capable of effectively blocking moisture or oxygen introduced from the outside into the organic electronic device, thereby securing the lifespan of the organic electronic device and implementing endurance reliability of the encapsulation structure at high temperature and high humidity, and has high shape retainability, and an organic electronic device comprising the same.

A dual-cure method for forming a solid polymeric structure is provided. An end-capped, imide-terminated prepolymer is combined with at least one photopolymerizable olefinic monomer, at least one photoinitiator, and a diamine, to form a curable resin composition, which, in a first step, is irradiated under conditions effective to polymerize the at least one olefinic monomer, thus forming a scaffold composed of the prepolymer and the polyolefin with the diamine trapped therein. The irradiated composition is then thermally treated at a temperature effective to cause a transimidization reaction to occur between the prepolymer and the diamine, thereby releasing the end caps of the prepolymer and providing the solid polymeric structure. A curable resin composition comprising an end-capped, imide-terminated prepolymer, at least one photopolymerizable olefinic monomer, at least one photoinitiator, and a diamine, is also provided, as are related methods of use.

A dual-cure method for forming a solid polymeric structure is provided. An end-capped, imide-terminated prepolymer is combined with at least one photopolymerizable olefinic monomer, at least one photoinitiator, and a diamine, to form a curable resin composition, which, in a first step, is irradiated under conditions effective to polymerize the at least one olefinic monomer, thus forming a scaffold composed of the prepolymer and the polyolefin with the diamine trapped therein. The irradiated composition is then thermally treated at a temperature effective to cause a transimidization reaction to occur between the prepolymer and the diamine, thereby releasing the end caps of the prepolymer and providing the solid polymeric structure. A curable resin composition comprising an end-capped, imide-terminated prepolymer, at least one photopolymerizable olefinic monomer, at least one photoinitiator, and a diamine, is also provided, as are related methods of use.