This invention relates to a polybenzoxazine precursor and a method of preparing the same, and more particularly, to a polybenzoxazine precursor which includes benzoxazine obtained by reacting a phenol novolak resin with an aldehyde compound and allylamine and diaminodiphenylmethane as an amine compound, and to a method of preparing the same. The polybenzoxazine precursor may serve to prepare a hardened material having excellent thermal and electrical characteristics and dimensional stability. Accordingly, the polybenzoxazine precursor may be available for use in a copper clad laminate, a semiconductor encapsulant, a printed circuit board, an adhesive, a paint, and a mold.

This invention relates to a polybenzoxazine precursor and a method of preparing the same, and more particularly, to a polybenzoxazine precursor which includes benzoxazine obtained by reacting a phenol novolak resin with an aldehyde compound and allylamine and diaminodiphenylmethane as an amine compound, and to a method of preparing the same. The polybenzoxazine precursor may serve to prepare a hardened material having excellent thermal and electrical characteristics and dimensional stability. Accordingly, the polybenzoxazine precursor may be available for use in a copper clad laminate, a semiconductor encapsulant, a printed circuit board, an adhesive, a paint, and a mold.

Disclosed are methods for preparing and collecting a polyaromatic compound. Also disclosed are products comprising a polyaromatic compound.

An adhesive composition is disclosed. The adhesive composition comprises an epoxy-containing component; rubber particles having a core-shell structure; and a curing component comprising a mixture of an amine-containing compound substantially free of hydroxyl functional groups and a polymeric phenol-containing compound, wherein the amine-containing compound comprises primary and/or secondary amino groups, and wherein the curing component chemically reacts with the epoxy-containing component upon activation from an external energy source. Also disclosed are methods of preparing the adhesive composition and for forming a bonded substrate with the adhesive composition. Further disclosed are curing components for an adhesive composition and methods of making the curing components.

An adhesive composition is disclosed. The adhesive composition comprises an epoxy-containing component; rubber particles having a core-shell structure; and a curing component comprising a mixture of an amine-containing compound substantially free of hydroxyl functional groups and a polymeric phenol-containing compound, wherein the amine-containing compound comprises primary and/or secondary amino groups, and wherein the curing component chemically reacts with the epoxy-containing component upon activation from an external energy source. Also disclosed are methods of preparing the adhesive composition and for forming a bonded substrate with the adhesive composition. Further disclosed are curing components for an adhesive composition and methods of making the curing components.

Provided is an addition condensation product of an aromatic compound and a carbonyl compound. The addition condensation product includes an aromatic compound dimer in which two composition units derived from the aromatic compounds are bonded via one composition unit derived from the carbonyl compound and an aromatic compound multimer in which each of three or more composition units derived from the aromatic compounds is bonded via one composition unit derived from the carbonyl compound. A ratio of the aromatic compound dimer to the aromatic compound multimer is in the range of 1:75 to 1:1,000.

A production method of an addition condensation product includes a step at which an aromatic compound, a carbonyl compound, and a catalyst are mixed in a reaction solvent, and an addition condensation reaction of the aromatic compound and the carbonyl compound is conducted in the temperature range of 60 to 97° C., both inclusive, to obtain the addition condensation product of the aromatic compound and the carbonyl compound. At the step to obtain the addition condensation product, 1 mole of the aromatic compound is mixed with 0.1 to 0.999 mole, both inclusive, of the carbonyl compound as the mole ratio. A ratio of the aromatic compound dimer to the aromatic compound multimer is in the range of 1:75 to 1:1,000.

This invention relates to a modified phenolic resin and a process of modifying a phenolic resin by an ethylenically unsaturated carboxylate compound. The ethylenically unsaturated carboxylate compound contains a thermally polymerizable or crosslinkable functional group, and has affinity to or is chemically bonded to the hydroxyl phenyl or the benzene ring of the phenolic resin, thereby introducing the thermally polymerizable or crosslinkable functional group in the phenolic resin. The invention also relates to a rubber composition comprising a rubber component and the modified phenolic resin component wherein the rubber composition does not contain a methylene donor cross-linking agent that decomposes to an aldehyde. The invention also relates to a formaldehyde-free process for preparing a rubber composition comprising mixing a rubber component and the modified phenolic resin component, wherein the process does not emit formaldehyde.

This invention relates to a modified phenolic resin and a process of modifying a phenolic resin by an ethylenically unsaturated carboxylate compound. The ethylenically unsaturated carboxylate compound contains a thermally polymerizable or crosslinkable functional group, and has affinity to or is chemically bonded to the hydroxyl phenyl or the benzene ring of the phenolic resin, thereby introducing the thermally polymerizable or crosslinkable functional group in the phenolic resin. The invention also relates to a rubber composition comprising a rubber component and the modified phenolic resin component wherein the rubber composition does not contain a methylene donor cross-linking agent that decomposes to an aldehyde. The invention also relates to a formaldehyde-free process for preparing a rubber composition comprising mixing a rubber component and the modified phenolic resin component, wherein the process does not emit formaldehyde.

The present disclosure relates to organic compound(s) (i.e., compound of formula I or compound of formula IA) and/or a composition including the organic compound(s) useful for utilization of non-coking coal in a blend including coking coal without deterioration of properties of coking coal, wherein the organic compound(s) is capable of releasing hydrogen in the plastic region of coal. The present disclosure provides a simple, economical, non-toxic and efficient method for the preparation of the organic polymer, and a method for utilization of non-coking coal in blend including coking coal without deterioration of the properties of coke.