Provided herein are silicon-containing recyclable polyamino compounds; epoxy resin compositions containing these silicon-containing reworkable or recyclable polyamino compounds; and methods of their use.

Provided are an epoxy resin composition, which exhibits excellent low dielectric properties, and imparts excellent copper foil peel strength and interlayer cohesive strength when used in printed circuit plate applications; and a phenolic resin or an epoxy resin, which are for forming the epoxy resin composition. The phenolic resin is represented by General Formula (1) below.

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In the formula, R.sup.1's each represent a hydrocarbon group having 1 to 10 carbon atoms; R.sup.2's each represent a hydrogen atom, Formula (1a), or Formula (1b), where at least one of R.sup.2's is Formula (1a) or Formula (1b); and n represents the number of repetitions of 0 to 5.

An epoxy compound including a 5-membered aromatic heterocyclic ring represented by Formula 1 or Formula 2, a composition prepared using the epoxy compound, a semiconductor device prepared using the epoxy compound, an electronic device prepared using the epoxy compound, an article prepared using the epoxy compound, and a method of preparing the article:

E1-(M1).sub.a1-(L1).sub.b1-M3-(L2).sub.b2-(M2).sub.a2-E2  Formula 1

E1-(M1).sub.a1-(L1).sub.b1-M3-(L2).sub.b2-(M2).sub.a2-(L5).sub.b5-A-(L6).sub.b6-(M4).sub.a3-(L3).sub.b3-M6-(L4).sub.b4-(M5).sub.a4-E2  Formula 2 wherein in Formulae 1 and 2, M1, M2, M3, M4, M5, M6, L1, L2, L3, L4, L5, L6, E1, E2, a1, a2, a3, a4, b1, b2, b3, b4, b5, and b6 are the same as those defined in the detailed description.

A solder mask ink composition is disclosed. The solder mask ink composition includes an epoxy resin; a solvent in an amount of at least 20% by weight relative to the total weight of the solder mask ink composition; and optionally a non-ionic surfactant. The ink composition has a viscosity that is less than 1000 cps at a shear rate of 10 s.sup.−1 and greater than 30 cps at a shear rate of 495 s.sup.−1 and a temperature of 25° C.

A solder mask ink composition is disclosed. The solder mask ink composition includes an epoxy resin; a solvent in an amount of at least 20% by weight relative to the total weight of the solder mask ink composition; and optionally a non-ionic surfactant. The ink composition has a viscosity that is less than 1000 cps at a shear rate of 10 s.sup.−1 and greater than 30 cps at a shear rate of 495 s.sup.−1 and a temperature of 25° C.

Elastomers are formed by curing a reaction mixture that includes an polyepoxide-terminated polyether having a linear or branched polyether chain that has a molecular weight of at least 2000, at least two epoxide groups that has an epoxide equivalent weight of at least 400 2) a curing agent containing at least one polythiol compound having at least two thiol groups and an equivalent weight per thiol group of up to 500, and 3) at least one base catalyst.

The invention provides novel flame-retardant polymers and materials, their synthesis and use. More particularly, the flame-retardant polymers are deoxybenzoin-derived polymers.

The invention provides novel flame-retardant polymers and materials, their synthesis and use. More particularly, the flame-retardant polymers are deoxybenzoin-derived polymers.

A high-CTI and halogen-free epoxy resin composition for copper-clad plates and uses thereof is provided. The formula of the high-CTI and halogen-free epoxy resin composition for copper-clad plates comprises 100˜140 parts of halogen-free phosphorous epoxy resin, 10˜35 parts of dicyclopentadiene phenolic epoxy resin, 32˜60 parts of benzoxazine, 1˜5 parts of phenolic resin, 0.05˜0.5 parts of accelerants; and 25˜70 parts of fillers, by weight. The copper-clad plates, prepared according to embodiments of the present invention, can reach the requirements of high CTI (CTI≧500V), high heat resistance(Tg≧150 ° C., PCT, 2 h>6 min) and the level of flame retardance of UL-94 V0, and they are widely used in the electronic materials of electric machines, electric appliances, white goods and so on.

Use of biologically-derived polyphenols for the preparation of epoxy resins is described. Examples of biologically-derived polyphenols include resveratrol, genistein, daidzein, and polyphenols synthesized from tyrosine. Because the epoxy resins are prepared from biologically-derived materials, they provide epoxy resins that will degrade into biologically harmless materials. The epoxy resins can be used to provide coating compositions.