Grafted triglycerides comprising a triglyceride grafted with a fatty acid residue containing 4 to 30 carbon atoms are reacted with an epoxide resin and an amine curing agent to yield an epoxy thermoset. The grafted triglyceride is prepared by reaction of an epoxidized triglyceride with a fatty acid. By varying the length of the fatty residue, the number of fatty residues per triglyceride, the identity of the epoxy resin and the amine curing agent, it is possible to prepare epoxy thermosets that exhibit superior physical properties compared to the properties of epoxy thermosets prepared without the grafted triglyceride, or as compared to epoxy thermosets wherein the epoxidized triglyceride is used in place of the grafted triglyceride.

A liquid epoxy resin composition having a reduced tendency to crystallize including at least one liquid epoxy resin having the following generic chemical Structure (I): where n is 0 or an integer of 1 or more; and wherein n=0 is in the range of between about 1 wt % and about 90 wt %; wherein; n=1 is in the range of between about 7 wt % and about 20 wt %; n=2 is in the range of between about 0.8 wt % and about 3 wt %; and n=3 and above is in the range of about 0 wt % and about 2 wt %. ##STR00001##

A crosslinking composition includes a compound having at least two functional groups that are each independently represented by Chemical Structure (I): ##STR00001##
X is an oxygen, sulfur, or nitrogen; R.sup.1 is an alkyl group, an aryl group, or an alkylaryl group; R.sup.2, R.sup.3, and R.sup.4 are each independently an alkyl group, an aryl group, an alkylaryl group, or a hydrogen; R.sup.5 is an alkyl group, an aryl group, an alkylaryl group, or a hydrogen; z is 0 when X is oxygen or sulfur and z is 1 when X is nitrogen; and when a double bond is formed between a carbon atom bonded to R.sup.3 and an adjacent nitrogen, m is 0, and when a single bond is formed between the carbon atom bonded to R.sup.3 and the adjacent nitrogen, m is 1.

An epoxy resin composition containing an epoxy resin [A1], epoxy resin [B1], epoxy resin [C1] and curing agent [D] wherein [A1] is a bisphenol-type epoxy resin with a softening point of 90° C. or more, [B1] is a tri- or higher functional amine-type epoxy resin, [C1] is a bisphenol F-type epoxy resin with a number average molecular weight of 450 or less, and the epoxy resins [A1] to [C1] satisfy the following contents per 100 parts by mass of total epoxy resin content: [A1] 20 to 50 parts by mass, [B1] 30 to 50 parts by mass and [C1] 10 to 40 parts. The present invention provides low-viscosity epoxy resin compositions that are excellent in impregnating reinforcing fibers and capable of producing cured resins with excellent modulus and toughness, as well as prepregs and fiber-reinforced composite materials based on those epoxy resin compositions.

Provided are alkoxysilylated epoxy compounds, a composite of which exhibits good heat resistance properties, low CTE and increased glass transition temperature, and a cured product thereof exhibits good flame retardancy without requiring separate coupling agent, a method for preparing the same and a composition and a cured product including the same. An alkoxysilylated epoxy compound including an epoxy group and at least one alkoxysilyl group of an S1 substituent selected from Formulae S11 to S15 or an S2 substituent selected from Formulae S21 to S25; a method for preparing the same by epoxy ring-opening reaction of starting material and alkoxysilylation, an epoxy composition including the epoxy compound, and a cured product and a use of the composition, are provided. Since chemical bonds may be formed between alkoxysilyl group and filler and between alkoxysilyl groups, chemical bonding efficiency of the composite may be improved.

Provided are alkoxysilylated epoxy compounds, a composite of which exhibits good heat resistance properties, low CTE and increased glass transition temperature, and a cured product thereof exhibits good flame retardancy without requiring separate coupling agent, a method for preparing the same and a composition and a cured product including the same. An alkoxysilylated epoxy compound including an epoxy group and at least one alkoxysilyl group of an S1 substituent selected from Formulae S11 to S15 or an S2 substituent selected from Formulae S21 to S25; a method for preparing the same by epoxy ring-opening reaction of starting material and alkoxysilylation, an epoxy composition including the epoxy compound, and a cured product and a use of the composition, are provided. Since chemical bonds may be formed between alkoxysilyl group and filler and between alkoxysilyl groups, chemical bonding efficiency of the composite may be improved.

A polyhydric phenol resin is provided. The polyhydric phenol resin comprises a polyhydric phenol resin component and a first component. When the polyhydric phenol resin is characterized in a high-performance liquid chromatography (HPLC), the first component is eluted at a retention time ranging from 27.1 minutes to 28.0 minutes, and based on the total area of the chromatographic peaks of the polyhydric phenol resin, the area percentage of the chromatographic peak of the first component at the corresponding retention time in the spectrum ranges from 1.0% to 20%.

The present disclosure relates to a modified epoxy resin having the formula (I):

##STR00001## wherein R is R1, R2 or a combination of R1 and R2; R1 and R2 are independently alkyl group having 1 to 32 C atoms, branched alkyl group having 1 to 32 C atoms, Cyclo-aliphatic group, substituted cycloaliphatic group, aromatic group, substituted aromatic group, biaryl or alkyl substituted biaryl group, methyl bridged aromatic group, cycloaliphatic-aromatic group or Ar—Z—Ar group; X and Y are independently O, —C(O)O—, or an amine group. Z is dicyclopentadiene; R3 and R4 are independently either H, alkyl group, branched alkyl group, alkoxy group, substituted biaryl group or methyl bridged aromatic group; R4 and R3 optionally forming a fused aromatic ring or a fused hetero aromatic ring; n is 0 to 1 with n=0>75%; and N is 1-20.

An epoxy composition that includes an epoxy-terminated prepolymer, an alkanolamine hardener having at least one hydroxyl group and an organometallic compound, where amine groups of the alkanolamine hardener react with epoxy groups of the epoxy-terminated prepolymer in a stoichiometric ratio to form a cured epoxy composition. The epoxy-terminated prepolymer is formed from a reaction product of an amine terminated polymeric polyol and a molar excess of epoxy groups in an epoxy monomer, relative to a molar amount of amine groups in the amine terminated polymeric polyol.

Disclosed is a method for producing a biphenyl-skeleton-containing epoxy resin represented by Formula (1) described below including a step of allowing polyvalent hydroxy biphenyl obtained by a production step including a regioselective cross-coupling reaction to react with epihalohydrin. ##STR00001##
(In the formula, k1 and l1 each represent an integer of 0 to 4, m and n each represent an integer of 1 to 5, R.sup.1 and R.sup.2 each independently represent a hydrocarbon group having 1 to 10 carbon atoms which may have a substituent group, and R.sup.1 and R.sup.2 may be identical to each other or different from each other. (Provided that left and right phenyl structures of a biphenyl skeleton are different from each other.)