Noise, vibration, or harshness (NVH) properties of an industrial or consumer product are reduced by incorporating therein an effective amount of a polyether- or polyester-epoxide polymer (PEEP) composition. The PEEP compositions are one-component or two-component reaction products of a polyepoxide compound and a polyol composition. The PEEP compositions have a glass-transition temperature within the range of −50° C. to 50° C. and a loss factor of at least 0.5 by ASTM D5992 over a temperature range of at least 15 Celsius degrees at one or more frequencies within the range of 0.1 to 10,000 Hz. The PEEP compositions provide NVH damping over a broad temperature range, have improved flexibility compared with conventional epoxy technologies, avoid amine and isocyanate reactants, and can be tailored to meet target specifications.

A liquid epoxy resin composition is provided. In preferred embodiments, the liquid epoxy resin composition is free of bisphenol A, bisphenol F, and bisphenol S, including epoxides thereof, and is useful in preparing a polyether polymer having utility in coating compositions, including, e.g., coating compositions for use on food or beverage containers.

The present application relates to a curable composition. The curable composition of the present application exhibits excellent adhesion ability and liquid crystal orientation ability simultaneously before or after curing, so that it can be effectively applied to various optical uses.

The present application relates to a curable composition. The curable composition of the present application exhibits excellent adhesion ability and liquid crystal orientation ability simultaneously before or after curing, so that it can be effectively applied to various optical uses.

The present invention provides a resin composition which has excellent handleability and which provides a cured product having excellent toughness and heat resistance. The present invention relates to a thermosetting resin composition including an allyl compound (A) containing at least two or more allyl groups and one or more benzene rings in a molecule, a maleimide compound (B) containing at least two or more maleimide groups in a molecule, a thiol compound (C) containing at least two or more thiol groups in a molecule, and a cyclic compound (D) containing at least two or more hydroxyl groups in a molecule.

The present invention provides an epoxy resin including a reaction product of 1,2,4-trihydroxybenzene and an epihalohydrin, the epoxy resin containing a cyclic compound that has a cyclic structure containing, as constitutional atoms, oxygen atoms at 1-position and 2-position derived from 1,2,4-trihydroxybenzene, the cyclic compound being contained in an amount of 0.003 to 0.070 mol based on 100 g of the epoxy resin. The epoxy resin is liquid and is excellent in pyrolysis resistance.

The present invention provides an epoxy resin including a reaction product of 1,2,4-trihydroxybenzene and an epihalohydrin, the epoxy resin containing a cyclic compound that has a cyclic structure containing, as constitutional atoms, oxygen atoms at 1-position and 2-position derived from 1,2,4-trihydroxybenzene, the cyclic compound being contained in an amount of 0.003 to 0.070 mol based on 100 g of the epoxy resin. The epoxy resin is liquid and is excellent in pyrolysis resistance.

Provided are an adhesive for an endoscope, a cured product thereof, an endoscope including a member secured with the cured product, and a method for manufacturing the endoscope. The adhesive includes the following (a) to (c): (a) an epoxy resin including at least one of a bisphenol A epoxy resin, a bisphenol F epoxy resin, or a phenol novolac epoxy resin; (b) a polyamine compound having an oxygen atom but no amide bond in a molecule thereof; and (c) at least one of an inorganic filler, an amide compound, a fatty acid wax, or a sorbitol compound.

Provided are an adhesive for an endoscope, a cured product thereof, an endoscope including a member secured with the cured product, and a method for manufacturing the endoscope. The adhesive includes the following (a) to (c): (a) an epoxy resin including at least one of a bisphenol A epoxy resin, a bisphenol F epoxy resin, or a phenol novolac epoxy resin; (b) a polyamine compound having an oxygen atom but no amide bond in a molecule thereof; and (c) at least one of an inorganic filler, an amide compound, a fatty acid wax, or a sorbitol compound.

The present application relates to a curable composition. The curable composition of the present application exhibits excellent adhesion ability and liquid crystal orientation ability simultaneously before or after curing, so that it can be effectively applied to various optical uses.