Provided is a curable epoxy composition capable of forming a cured product having excellent heat resistance even in a high temperature environment. A first curable epoxy composition includes an alicyclic epoxy compound (A) having an alicyclic structure and an epoxy group in a molecule, an acid anhydride-based curing agent (B), and an imidazole-based curing accelerator (C), and is liquid at 25° C. and to be used for a rotary electric machine. A second curable epoxy composition includes an alicyclic epoxy compound (A) having an alicyclic structure and an epoxy group in a molecule, an acid anhydride-based curing agent (B), an imidazole-based curing accelerator (C), and a polyester polyol (D), and is to be used for a rotary electric machine.

Provided are: a polyolefin resin composition which has excellent antistatic properties with sufficient persistence and wiping resistance but without impairment of the intrinsic mechanical properties of a resin; and an automotive interior/exterior material containing the same. The polyolefin resin composition contains: 50 to 90 parts by mass of a polyolefin resin; 3 to 40 parts by mass of a thermoplastic elastomer; and 3 to 30 parts by mass of a filler, the polyolefin resin composition further containing an antistatic agent composed of a polymer compound (E) in an amount of 3 to 20 parts by mass with respect to a total amount of 100 parts by mass of the polyolefin resin, the thermoplastic elastomer and the filler, wherein the polymer compound (E) has a structure in which a diol, an aliphatic dicarboxylic acid, an aromatic dicarboxylic acid, a compound (B) which contains at least one group represented by the formula (I) and has hydroxyl groups at both ends, and an epoxy compound (D) having two or more epoxy groups are bound via ester bonds:

—CH.sub.2—CH.sub.2—O   (1)

Provided are: a polyolefin resin composition which has excellent antistatic properties with sufficient persistence and wiping resistance but without impairment of the intrinsic mechanical properties of a resin; and an automotive interior/exterior material containing the same. The polyolefin resin composition contains: 50 to 90 parts by mass of a polyolefin resin; 3 to 40 parts by mass of a thermoplastic elastomer; and 3 to 30 parts by mass of a filler, the polyolefin resin composition further containing an antistatic agent composed of a polymer compound (E) in an amount of 3 to 20 parts by mass with respect to a total amount of 100 parts by mass of the polyolefin resin, the thermoplastic elastomer and the filler, wherein the polymer compound (E) has a structure in which a diol, an aliphatic dicarboxylic acid, an aromatic dicarboxylic acid, a compound (B) which contains at least one group represented by the formula (I) and has hydroxyl groups at both ends, and an epoxy compound (D) having two or more epoxy groups are bound via ester bonds:

—CH.sub.2—CH.sub.2—O   (1)

This invention relates to a conductive epoxy resin composition, in particular for bonding copper substrate, and the cured product, and the use thereof as well as a semiconductor device comprising the cured product.

A resin composition and method for installing a pipe liner that allows the liner to be fully wet out with a resin and activator and stored for a period of up to six months prior to installation and curing. A method of lining a pipe with a delayed curing resin composition is also provided that includes fully wetting out a liner with a blended two part epoxy composition such that the liner can be transported in a wet out fashion, placed in a pipe to be lined and repositioned as needed without concern for the resin composition to begin curing.

A composition formed of an epoxy resin incorporating a fire retardant.

The invention is directed to a method of controlled conversion of thermosetting resins and additive manufacturing thereof by selective laser sintering. Partial curing of a thermosetting formulation can be used to increase the T.sub.g of the resin and minimize the additional cure needed to cross-link a printed object. After printing, the partially cured material is finally cured via a slow temperature ramp maintained just below the material's evolving T.sub.g.

The subject matter of the present application is a thermally expandable preparation that can be pumped at application temperatures below 70° C., containing (a) at least one first epoxy resin E1 that has an epoxy equivalent weight of at most 280 g/eq and a viscosity of at most 1250 Pa*s at 25° C., (b) at least one second epoxy resin E2 that has an epoxy equivalent weight of at least 300 g/eq and a viscosity of at most 250 Pa*s at 25° C., (c) at least one hardener that can be thermally activated, (d) at least one propellant that can be thermally activated, and (e) at least 1 wt. % of organic fibres having a fibre length of 0.2 mm to 10 mm.

A curable composition of the present invention includes a cationic polymerizable compound; a thermal polymerization initiator; and a storage stabilizer, in which the cationic polymerizable compound includes at least two selected from the group consisting of a glycidyl ether compound, an alicyclic epoxy compound, and an oxetane compound, a content of the thermal polymerization initiator is from 0.3 to 3 parts by mass with respect to 100 parts by mass of the cationic polymerizable compound, and chain curing is enabled by thermal energy generated by a polymerization reaction of the cationic polymerizable compound.

Provided are: an epoxy resin composition for fiber-reinforced composite materials, which has a good balance between storage stability and fast curing properties at high levels; a prepreg; and an epoxy resin composition which exhibits excellent mechanical characteristics as a fiber-reinforced composite material. A resin composition which contains an epoxy resin, dicyandiamide, an imidazole compound and an acidic compound, while satisfying the following conditions (a)-(c): (d) The time until the heat flow rate reaches the peak top after the epoxy resin composition reaches 100° C. is 25 minutes or less as measured by a differential scanning calorimeter at an isothermal temperature of 100° C. in a nitrogen gas stream. (e) The time until the heat flow rate reaches the peak top after the epoxy resin composition reaches 60° C. is 15 hours or more as measured by a differential scanning calorimeter at an isothermal temperature of 60° C. in a nitrogen gas stream. (f) The ratio of the number of epoxy groups to the number of imidazole rings in the epoxy resin composition is from 25 to 90 (inclusive).