To provide an interlayer filler composition capable of forming a cured adhesive layer sufficiently cured and excellent in adhesion without letting voids be formed in the cured adhesive layer while minimizing leak out of a filler. An interlayer filler composition for a semiconductor device, comprises an epoxy resin (A), a curing agent (B), a filler (C) and a flux (D), has a minimum value of its viscosity at from 100 to 150° C. and satisfies the following formulae (1) and (2) simultaneously:

10<η50/η120<500   (1)

1,000<η150/η120   (2)

(wherein η50, η120 and η150 represent the viscosities at 50° C., 120° C. and 150° C., respectively, of the interlayer filler composition).

The present invention relates to a plastic film and a method for manufacturing same. A plastic film, which is formed such that at least one part has a curved shape, can have high hardness, impact resistance, scratch resistance and high transparency. The plastic film is light and will not be easily damaged by external pressure and thus can substitute for the existing glass and is expected to be used for various electronic products such as a display and the like. In particular, the plastic film has at least one part in a curved shape and thereby is expected to be used for products in various shapes which cannot be manufactured by means of the existing glass. Moreover, a method for manufacturing a plastic film enables manufacturing of a plastic film having at least one part in a curved shape without curls or cracks as well as simultaneous performing of heat molding and heat curing, thereby increasing the productivity of a plastic film.

There is provided a composition that a resist pattern having a reduced LWR representing variations in line width of the resist pattern, compared to conventional resist patterns, can be formed. A resist underlayer film-forming composition for lithography comprising a polymer, 0.1 to 30 parts by mass of a compound having an amino group protected with a tert-butoxycarbonyl group and an unprotected carboxyl group, or a hydrate of the compound, relative to 100 parts by mass of the polymer, and a solvent.

The present invention relates to a heat-curable composition comprising at least one epoxy monomer comprising two or three epoxy groups, which is not a hydrolysis-polymerizable silicon compound, at least one epoxy compound bearing at least one silicon atom having at least one hydrolyzable group directly linked to the silicon atom and at least one epoxy group, and at least one epoxy ring-opening catalyst. The composition comprises at least 50% by weight of compounds having at least one epoxy group, relative to the total weight of polymerizable compounds present in the composition and provides upon pre-curing a tack-free coating that can be removed by treatment with a solution of sodium hydroxide, and upon post-curing a coating that cannot be removed by treatment with a solution of sodium hydroxide.

An impregnating resin, e.g., a catalytically hardenable impregnating resin for the conductor of an electrical machine, may include at least one reactive resin mixed with at least one reactive diluent and a hardening catalyst, e.g., for cationic, anionic or coordinate polymerization of the impregnating resin. The properties of the impregnating resin or use thereof may be improved by virtue of the reactive diluent containing a heterocyclic four-membered ring. The impregnating resin may be part of a main insulation of a conductor arrangement, which may in turn be installed in an electrical coil or other electrical machine.

An impregnating resin, e.g., a catalytically hardenable impregnating resin for the conductor of an electrical machine, may include at least one reactive resin mixed with at least one reactive diluent and a hardening catalyst, e.g., for cationic, anionic or coordinate polymerization of the impregnating resin. The properties of the impregnating resin or use thereof may be improved by virtue of the reactive diluent containing a heterocyclic four-membered ring. The impregnating resin may be part of a main insulation of a conductor arrangement, which may in turn be installed in an electrical coil or other electrical machine.

Trisubstituted triazines having the formula: ##STR00001## wherein: X is O and n is 0 or 1, Y is OH, NH.sub.2 or CH.sub.2NH.sub.2, Q is P, P═O, CH or N, when Q is P, R is phenyl, when Q is P═O, Z is R or OR, and R is alkyl or phenyl, when Q is CH, Z is PO(R).sub.2 or PO(OR).sub.2, when Q is N, Z is R, and their uses as epoxy and cyclic carbonate polymer curing agents.

Trisubstituted triazines having the formula: ##STR00001## wherein: X is O and n is 0 or 1, Y is OH, NH.sub.2 or CH.sub.2NH.sub.2, Q is P, P═O, CH or N, when Q is P, R is phenyl, when Q is P═O, Z is R or OR, and R is alkyl or phenyl, when Q is CH, Z is PO(R).sub.2 or PO(OR).sub.2, when Q is N, Z is R, and their uses as epoxy and cyclic carbonate polymer curing agents.

A two-component curable epoxy resin system having an epoxy component containing a unique combination of two or more epoxy resins with at least one of the epoxy resins being an epoxy novolac type resin. The composite made from such resin system exhibits high glass transition temperature.

Provided is a molded article that has such a shape as to offer a light condensing or light diffusing effect, has excellent mechanical strengths and heat resistance, and has a high thickness deviation ratio. This molded article includes a cured product of a curable composition containing an epoxy compound (A). The cured product has a flexural modulus of 2.5 GPa or more as measured in conformity with JIS K 7171:2008, except for performing measurement on a test specimen having a length of 20 mm, a width of 2.5 mm, and a thickness of 0.5 mm and at a span between specimen supports of 16 mm. The molded article has a thickness deviation ratio (thickest portion thickness to thinnest portion thickness ratio) of 5 or more and offers a light condensing or light diffusing effect. The molded article preferably has a thinnest portion thickness of 0.2 mm or less. The curable composition is preferably a photocurable composition.