The present invention provides a curable resin composition, a cured product of which has a small change in heat resistance after receiving a thermal history and a low thermal expansion property; a cured product of the curable resin composition; a printed circuit board having a small change in heat resistance; and an epoxy resin which imparts the characteristics described above. The epoxy resin is an epoxy resin which is obtained by polyglycidyl etherification of a reaction product formed from ortho-cresol, a β-naphthol compound, and formaldehyde and which includes as a necessary component, a dimer (x2, formula (1)), a trifunctional compound (x3, formula (2)), and a tetrafunctional compound (x4, formula (3)). The total content of those components is 65% or more in terms of the area rate in GPC measurement. ##STR00001##

An amine of the formula (I) and a process for its preparation by reductive alkylation of 1,2-propylenediamine with a di- or trifunctional carbonyl compound and hydrogen. The amine of the formula (I) is low in viscosity and in odour, high in reactivity towards epoxides and outstanding in its compatibility with other amines and with epoxy resins. The amine of the formula (I) allows access to low-emission epoxy resin compositions which have good processing qualities, cure rapidly even at low temperatures and form high-quality, high-hardness plastics having an attractive surface.

Provided is a Fresnel lens which has excellent heat resistance and which can covert light even from a poor-quality semiconductor light sources into uniform, high-quality light and can disperse the resulting light without lowering the central illuminance. The Fresnel lens according to the present invention includes two or more sawtooth prisms in a surface thereof and is made of a cured product of a curable composition containing an epoxy compound (A). Of the sawtooth prisms, a sawtooth prism having a longest inclined side in a cross section has a roughened surface, where the cross section is given by cutting the Fresnel lens in a plane which passes through the center of the Fresnel lens and which is perpendicular to a reference plane of the Fresnel lens.

Provided is a Fresnel lens which has excellent heat resistance and which can covert light even from a poor-quality semiconductor light sources into uniform, high-quality light and can disperse the resulting light without lowering the central illuminance. The Fresnel lens according to the present invention includes two or more sawtooth prisms in a surface thereof and is made of a cured product of a curable composition containing an epoxy compound (A). Of the sawtooth prisms, a sawtooth prism having a longest inclined side in a cross section has a roughened surface, where the cross section is given by cutting the Fresnel lens in a plane which passes through the center of the Fresnel lens and which is perpendicular to a reference plane of the Fresnel lens.

In various embodiments, the invention provides an in-situ adduct formed by reacting liquid, solid, and/or semi-solid epoxy resins with a di-carboxylic acid functionalized polymer. The adducting process at least doubles the viscosity of the mixture. A hot melt thermosetting surfacing film and composite formed using the adduct are also disclosed. Methods of preparing and using are also disclosed.

The present application relates to an encapsulating composition and an organic electronic device comprising the same, and provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside to secure the lifetime of the organic electronic device, is possible to realize a top emission type organic electronic device, is applicable to an inkjet method and can provide a thin display.

A glyceryl ether epoxy resin and a method of making it are provided. The glyceryl ether epoxy resin is a cross-linked polymer obtained by a ring-opening reaction of a glyceryl ether polymer and a polyamine compound. The glyceryl ether polymer is a glycidyl ether polymer comprising at least two epoxy groups, and the polyamine compound comprises at least two amine groups. The cross-linked polymer is a cross-linked three-dimensional network structure, the cross-linked polymer comprises a main chain and a plurality of hydroxyl groups, and the plurality of hydroxyl groups are located on the main chain. An epoxy structure of the glyceryl ether polymer is located on the main chain.

Provided are an epoxy resin composition and a film or a molding material. The epoxy resin composition is an epoxy resin composition including the following components A to D: component A: an epoxy resin having an oxazolidone ring structure in a molecule thereof; component B: an epoxy resin that is liquid at 30° C.; component C: a diblock copolymer having a B-M structure (where M represents a block formed of a homopolymer of methyl methacrylate or a copolymer containing at least 50 wt % of methyl methacrylate, B represents a block that is incompatible with the epoxy resins and the block M, and that has a glass transition temperature Tg of 20° C. or less, and respective blocks represented by B and M are directly bonded to each other or are linked to each other through a linking group); and component D: an amine-based curing agent that is dicyandiamide or a derivative thereof.

A method for manufacturing a pressure-sensitive self-adhering adhesive is based on an alkoxylated silane-containing polymer, to which is added at least one tackifying resin compatible with the alkoxylated, silane-containing polymer, and at least one catalyst (K). To overcome various disadvantages of the prior art, such as a too-slow or excessively violent reaction of the alkoxyl groups, and the need for an additional supplying of water, the alkoxylated silane-containing polymer is crosslinked using a catalyst (K) that comprises a Lewis acid-base adduct, wherein the Lewis acid (LS) is a reaction-inhibited cation at least in the temperature range below 60° C., and the Lewis base (LB) is an anion of a very strong acid. In a preferred embodiment the Lewis acid (LS) is an organyl-group-containing (AG) halogen-onium cation, and the Lewis base (LB) is the anion of a superacid.

A process for producing an epoxy-group terminated polyoxazolidinone comprising the copolymerization of a polyisocyanate compound (A) with two or more isocyanate groups with a polyepoxide compound (B) with two or more epoxy groups in the presence of a specific catalyst (C), wherein the molar ratio of the epoxy groups of the polyepoxide compound (B) to the isocyanate groups of the polyisocyanate compound (A) is from 2.6:1 and less than 25:1, and wherein the copolymerization is operated in the absence of an additional solvent (D-1) with a boiling point higher than 170° C., preferred higher than 165° C., more preferred higher than 160° C., and most preferred higher than 150° C. at 1 bar (absolute). The epoxy-group terminated polyoxazolidinones resulting from the process are also provided.