Patent classifications
C08G59/32
LOW-REFRACTIVE-INDEX THERMOSETTING COMPOSITION, OPTICAL MEMBER FORMED THEREFROM, AND DISPLAY DEVICE
The present disclosure relates to a thermosetting composition, an optical member formed therefrom, and a display device, the composition comprising a thermosetting resin, gas-containing particles and a monomer or an oligomer having two or more thermosetting functional groups, thereby having optical effects such as a low refractive index of 1.40 or less on light with a wavelength of 450 nm, high light transmittance, and low haze.
Cycloaliphatic-based epoxy adhesive composition
A new adhesive composition comprising a cycloaliphatic-based epoxy composition, which is particularly suitable for use as a structural adhesive in anchoring applications.
Cycloaliphatic-based epoxy adhesive composition
A new adhesive composition comprising a cycloaliphatic-based epoxy composition, which is particularly suitable for use as a structural adhesive in anchoring applications.
Curing composition for an epoxy resin compound, epoxy resin compound and multi-component epoxy resin system
A curing composition for an epoxy resin compound useful for the chemical fastening of construction elements, an epoxy resin compound, and a multi-component epoxy resin system are provided. A method for the chemical fastening of construction elements in boreholes and a method of using a salt (S) as an accelerator in an epoxy resin compound for chemical fastening, the epoxy resin compound including a Mannich base and an amine which is reactive to epoxy groups.
Curing composition for an epoxy resin compound, epoxy resin compound and multi-component epoxy resin system
A curing composition for an epoxy resin compound useful for the chemical fastening of construction elements, an epoxy resin compound, and a multi-component epoxy resin system are provided. A method for the chemical fastening of construction elements in boreholes and a method of using a salt (S) as an accelerator in an epoxy resin compound for chemical fastening, the epoxy resin compound including a Mannich base and an amine which is reactive to epoxy groups.
Epoxy resin composition, prepreg and molded body
An epoxy resin composition including components (A), (B), (C) and (D); wherein a content of the component (A) is 60 to 90 parts by mass, and a content of the component (B) is 10 to 40 parts by mass, with respect to epoxy resins; the epoxy resin composition has a characteristic that, when cured and formed into a cured product, the cured product has a glass transition temperature of 200° C. or higher; and a viscosity at 100° C. of the resin composition is 5 to 35 Pa.Math.s, wherein Component (A) is an aromatic epoxy resin having at least 3 glycidyl groups in one molecule, Component (B) is an aromatic epoxy resin having two glycidyl groups in one molecule, Component (C) is an aromatic polysulfone resin having a reduced viscosity of 0.18 to 0.30 dl/g; and Component (D) is an aromatic amine compound.
Cationic Curing Composition for Plastic Substrate, Coating Material, Plastic Product and Application
The disclosure provides a cationic curing composition for a plastic substrate, a coating material including the composition and an application of the composition in the field of energy curing. The cationic curing composition includes a polyhydroxy resin, an epoxy compound, an oxetanyl-containing compound, and a cationic initiator, the polyhydroxy resin is a polyester resin, an acrylic resin and/or a phenolic resin, and the molar ratio of a hydroxyl, a three-membered epoxy group to a four-membered epoxy group in the cationic curing composition is 1:(3-20):(1-25). A plastic product includes the plastic substrate and a coating layer, and the coating layer is formed by curing the cationic curing composition.
Cationic Curing Composition for Plastic Substrate, Coating Material, Plastic Product and Application
The disclosure provides a cationic curing composition for a plastic substrate, a coating material including the composition and an application of the composition in the field of energy curing. The cationic curing composition includes a polyhydroxy resin, an epoxy compound, an oxetanyl-containing compound, and a cationic initiator, the polyhydroxy resin is a polyester resin, an acrylic resin and/or a phenolic resin, and the molar ratio of a hydroxyl, a three-membered epoxy group to a four-membered epoxy group in the cationic curing composition is 1:(3-20):(1-25). A plastic product includes the plastic substrate and a coating layer, and the coating layer is formed by curing the cationic curing composition.
SHEET MOLDING COMPOUND RESIN COMPOSITION, SHEET MOLDING COMPOUND, MOLDED ARTICLE, AND METHOD FOR PRODUCING SHEET MOLDING COMPOUND
A sheet molding compound resin composition containing a thermosetting resin (A), a resin-curing agent (B), and a glycidyl ether (C) including an alkyl group having a carbon atom number of 7 to 14 and a glycidyl group is provided. The sheet molding compound resin composition can be favorably used for a sheet molding compound and a molded article of the sheet molding compound as a result of having excellent impregnating ability with respect to carbon fiber regardless of the resin viscosity.
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD
Provided is a photosensitive resin composition which comprises (A) a polymer comprising repeating units represented by formula (A1) and at least one kind of repeating units selected from among repeating units represented by formula (A2) and repeating units represented by formula (A3), (B) an epoxy compound containing four or more epoxy groups on average in the molecule, (C) a photoacid generator, (D) a benzotriazole compound and/or an imidazole compound, and (E) an organic solvent.
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