Provided is a photosensitive resin composition which comprises (A) a polymer comprising repeating units represented by formula (A1) and at least one kind of repeating units selected from among repeating units represented by formula (A2) and repeating units represented by formula (A3), (B) an epoxy compound containing four or more epoxy groups on average in the molecule, (C) a photoacid generator, (D) a benzotriazole compound and/or an imidazole compound, and (E) an organic solvent.

##STR00001##

In order to provide a resin composition excellent in pattern processability and film strength, a resin composition film, and a semiconductor device using these, there is provided a resin composition including (A) a polymer compound, (B) a cationic polymerizable compound, and (C) a cationic polymerization initiator, in which (A) the polymer compound has a carboxylic acid residue at a molecular chain terminal.

The purpose of the present invention is to provide: an epoxy resin composition which enables the achievement of a resin cured product that has high flame retardancy and excellent mechanical characteristics; and a prepreg and a fiber-reinforced composite material, each of which uses this epoxy resin composition. One embodiment of the epoxy resin composition according to the present invention, said epoxy resin composition having achieved the above-described purpose, contains the components (A) and (B) described below. (A): a bifunctional glycidyl amine type epoxy compound (B): an epoxy compound having a specific structure and/or an epoxy compound having another specific structure

A prepreg having excellent tackiness as well as excellent resin strength after curing and strength in the non-fiber direction is described; and a fiber-reinforced composite material using the prepreg, where the prepreg is composed of reinforcing fibers and a resin composition which includes [A] an epoxy resin, [B] a dicyanamide and [C] a compound having a melting point of 130° C. or lower and a solubility parameter whose difference from the solubility parameter of [B] is 8 or less.

An epoxy resin composition including an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and an unsaturated fatty acid amide having from 14 to 24 carbons, a gas barrier laminate and a retort food packaging material using the epoxy resin composition, an odor-proofing or aroma-retaining packaging material, an odor-proofing or aroma-retaining method of sealing an article containing an odorous component or an aromatic component in the packaging material, a heat-shrinkable label, the production method of the heat-shrinkable label, a heat-shrunken label and a bottle having the heat-shrunken label, and a CO.sub.2 transmission prevention method.

An epoxy resin composition including an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and an unsaturated fatty acid amide having from 14 to 24 carbons, a gas barrier laminate and a retort food packaging material using the epoxy resin composition, an odor-proofing or aroma-retaining packaging material, an odor-proofing or aroma-retaining method of sealing an article containing an odorous component or an aromatic component in the packaging material, a heat-shrinkable label, the production method of the heat-shrinkable label, a heat-shrunken label and a bottle having the heat-shrunken label, and a CO.sub.2 transmission prevention method.

Disclosed is a liquid composition for an encapsulant of an organic light-emitting device. The liquid composition is free of a physical and chemical hygroscopic agent (getter) but includes a binder material having high hygroscopicity including an aliphatic 4-functionalized epoxy-based compound. Thus, the liquid composition for the encapsulant may be rapidly cured at low temperature and may secure excellent storage stability under a high temperature environment.

A method for recycling matrix residues includes steps of degrading a target epoxy to form matrix residues, collecting the matrix residues, and adding the matrix residues into a polymer-forming formulation. Characteristically, the polymer-forming formulation includes multifunctional anhydride monomers and polyfunctional co-reactant monomers.

A glove including a cured film of an elastomer containing a (meth)acrylonitrile-derived structural unit, an unsaturated carboxylic acid-derived structural unit and a butadiene-derived structural unit in a polymer main chain, wherein the elastomer contains 20 to 40% by weight of a (meth)acrylonitrile-derived structural unit, 1 to 10% by weight of an unsaturated carboxylic acid-derived structural unit and 50 to 75% by weight of a butadiene-derived structural unit, and has a crosslinked structure of a carboxyl group in the unsaturated carboxylic acid-derived structural unit with an epoxy crosslinker containing an epoxy compound having three or more epoxy groups in one molecule.

A glove including a cured film of an elastomer containing a (meth)acrylonitrile-derived structural unit, an unsaturated carboxylic acid-derived structural unit and a butadiene-derived structural unit in a polymer main chain, wherein the elastomer contains 20 to 40% by weight of a (meth)acrylonitrile-derived structural unit, 1 to 10% by weight of an unsaturated carboxylic acid-derived structural unit and 50 to 75% by weight of a butadiene-derived structural unit, and has a crosslinked structure of a carboxyl group in the unsaturated carboxylic acid-derived structural unit with an epoxy crosslinker containing an epoxy compound having three or more epoxy groups in one molecule.