The present disclosure relates to a Michael Addition curable composition, coating composition containing the same and coated article made therefrom. In particular, the Michael Addition curable composition, comprises A) at least one reactive donor capable of providing two or more nucleophilic carbanions; B) at least one reactive acceptor comprising two or more carbon-carbon double bonds; C) at least one catalyst for catalyzing the Michael Addition crosslinking reaction between the reactive donor and the reactive acceptor; and D) at least one hardness improver, wherein the at least one reactive donor has a backbone based on an epoxy resin; and wherein the at least one hardness modifier is one or more selected from silica and urea formaldehyde resin, and the at least one hardness modifier has a particle size in micrometers and the at least one hardness modifier has a pH value of 6.5 or higher.

Herein disclosed is an adhesive additive for magnetically curing an adhesive. The adhesive additive includes a magnetic nanoparticle that includes (i) a metal, wherein the metal comprises iron, manganese, cobalt, nickel, and/or zinc, or (ii) a metal oxide, wherein the metal oxide contains a metal which includes iron, manganese, cobalt, nickel, and/or zinc, a coating on the magnetic nanoparticle, wherein the coating comprises (a) a surfactant or an inorganic material, and (b) a monomer or a polymer which is miscible with an adhesive substrate which the adhesive additive is incorporable to, wherein the magnetic nanoparticle produces thermal energy in response to an alternating magnetic field applied thereto for the adhesive substrate to form cross-linkages. An adhesive, which is magnetically curable, is also disclosed herein. The adhesive includes the adhesive additive and an adhesive substrate. Methods of forming the adhesive additive are further disclosed herein.

A curable green epoxy resin composition is described. More particularly, the curable green epoxy resin composition includes a biobinder isolated from bio-oil produced from animal waste, such as from swine manure. The biobinder can act as a curing agent for an epoxy resin component in the resin composition. Cured green epoxy resins, prepregs containing the curable green epoxy resin, and related composite materials are described. In addition, methods of preparing the curable green epoxy resin composition and of curing the curable green epoxy resin.

The present application discloses an underfill for chip packaging, including 19-25% of epoxy resin, 55-60% of filler, 15-25% of curing agent and 0.5-0.8% of accelerator in mass percentage, wherein the curing agent includes a polycondensate of paraxylene and dihydroxynaphthalene and a polycondensate of paraxylene and naphthol. Both of the polycondensate of paraxylene and dihydroxynaphthalene and the polycondensate of paraxylene and naphthol are selected to be used in the underfill for chip packaging in the present application, so that the underfill has stronger adhesiveness after being cured. In addition, the present application further provides a chip packaging structure using the underfill.

A curable green epoxy resin composition is described. More particularly, the curable green epoxy resin composition includes a biobinder isolated from bio-oil produced from animal waste, such as from swine manure. The biobinder can act as a curing agent for an epoxy resin component in the resin composition. Cured green epoxy resins, prepregs containing the curable green epoxy resin, and related composite materials are described. In addition, methods of preparing the curable green epoxy resin composition and of curing the curable green epoxy resin.

The invention relates to a cationically curable composition with at least one cationically polymerizable component, a first photoinitiator releasing an acid when irradiated with actinic radiation of a first wavelength λ.sub.1, and a second photoinitiator releasing an acid when irradiated with actinic radiation of a second wavelength λ.sub.2, wherein the second wavelength λ.sub.2 is shorter than the first wavelength λ.sub.1, and wherein the second photoinitiator, after irradiation of the composition with actinic radiation of the first wavelength λ.sub.1, shows an absorption of actinic radiation of the second wavelength λ.sub.2 in the composition that is sufficient to activate the second photoinitiator and fix the composition. Furthermore, a method is described for the joining, casting, molding, sealing and/or coating of substrates using the cationically curable composition.

The present invention discloses a preparation method of a cardanol-modified polyamine curing agent with high corrosion resistance. The method includes the following steps: subjecting cardanol, paraformaldehyde and an amine compound to Mannich reaction, after the Mannich reaction, adding a water-soluble initiator for polymerization reaction, then evaporating water and excessive amine compound under reduced pressure after the polymerization reaction, thus obtaining a cardanol-modified polyamine curing agent. The coating obtained by curing the curing agent with an epoxy resin has greatly improved chemical resistance and corrosion resistance, indicating that the use of the water-soluble initiator in this present invention enables olefins to be polymerized very well, and molecules are reinforced obviously after polymerization, thereby greatly improving the chemical resistance and corrosion resistance.

A novel compound which absorbs long-wavelength active energy rays and generates with high-efficiency radicals and strong bases, and which has excellent reaction efficiency in a base generating chain reaction; a photopolymerization initiator which contains said compound; and a photosensitive resin composition which contains said photopolymerization initiator are provided, where the novel compound is represented by formula (1), where, in formula (1), R.sub.1, R.sub.2, R.sub.3, R.sub.5 and R.sub.6 independently represent a hydroxyl group, an alkoxy group, or an organic group other than those substituents, the R.sub.4's independently represent an organic group including a thioether bond, ‘A’ represents a substituent represented by formula (1-1) or (1-2), where, in formula (1-1), R.sub.7 and R.sub.8 independently represent a hydrogen atom, an alkyl group or a heterocyclic group, and where, in formula (1-2), R.sub.9 and R.sub.10 independently represent an amino group or a substituted amino group.

A seal material composition according to the present invention includes: an epoxy compound including an epoxy group; and a polymerizable epoxy curing agent including a polymerizable functional group configured for cross-linking the epoxy groups and for radical polymerization in a single molecule.

The present invention relates to a support-attached resin film for an interlayer insulating layer, including a support, and a resin composition layer formed on one side surface of the support in which the support has particles exposed on the one side surface, and an average maximum height of exposed portions of the particles is 1.0 μm or less, or the support has no particles exposed on the one side surface, a multilayer printed wiring board using the support-attached resin film for an interlayer insulating layer, and the multilayer printed-wiring board.