The present invention relates to a curable composition for the sealing, encapsulation, or laminating of electronic devices. The curable compositions according to the invention include those having an aliphatic epoxy resin, an aliphatic oxetane resin and a thermal cure initiator, wherein the compositions provide excellent transparency and good moisture barrier property after cure.

A low-loss insulating resin composition and an insulating film using the same are provided. The low-loss insulating resin composition comprises an epoxy resin composite including 40 to 60 parts by weight of a cyanate ester resin, 15 to 35 parts by weight of a biphenylaralkyl novolac resin, and 15 to 35 parts by weight of a fluorine-containing epoxy resin; a hardener; a thermoplastic resin; a hardening accelerator; an inorganic filler; a viscosity enhancer; and an additive.

The present application relates to an adhesive film, an organic electronic device comprising same, and a lighting apparatus and a display device comprising same. The present application enables an organic electronic device to show excellent moisture-blocking properties and have flexibility as well as excellent and reliable durability at high temperature and high humidity.

A seal material composition according to the present invention includes: an epoxy compound including an epoxy group; and a polymerizable epoxy curing agent including a polymerizable functional group configured for cross-linking the epoxy groups and for radical polymerization in a single molecule.

Compounds of the formula ##STR00001##
in which R.sup.1 is an organic radical having a (meth)acryloyl group and R.sup.2, R.sup.3, and R.sup.4 independently of one another are an H atom or a C1 to C10 alkyl group.

A curable green epoxy resin composition is described. More particularly, the curable green epoxy resin composition includes a biobinder isolated from bio-oil produced from animal waste, such as from swine manure. The biobinder can act as a curing agent for an epoxy resin component in the resin composition. Cured green epoxy resins, prepregs containing the curable green epoxy resin, and related composite materials are described. In addition, methods of preparing the curable green epoxy resin composition and of curing the curable green epoxy resin.

A method for forming a structure through three-dimensional (3D) printing, the method comprising applying through a 3D printing apparatus one or more layers of a mortar composition, in which the mortar composition comprises a mortar powder and one or more epoxies. In addition, a mortar composition comprising a mortar powder and one or more epoxies for use in forming a structure through three-dimensional printing. The mortar powder may comprise a cement, such as a hydraulic cement, and an aggregate. The mortar powder may further comprise one or more admixtures. The one or more epoxies may comprise a polymeric resin, and may be bisphenol-based or water-based. Further, the mortar composition may also comprise a curing agent.

The invention relates to structural adhesive compositions and more particularly to two-component (2K) structural adhesive compositions. The two components chemically react to bond structural surfaces. N-(3-Aminopropyl)cyclohexylamine (APCHA) has been found to be an improved curing agent for use with epoxy resins in 2K adhesive compositions. APHCA exhibits favorable features including viscosity, pot life and reactivity, and adhesive and thermal performance after curing with epoxy resin. These features and its unique chemistry allow the use of APCHA in curing agent formulations for structural adhesives, in particular wind turbine blade adhesives. APCHA solves issues with viscosity build-up, working time, through-cure, compatibility and adhesive performance that cannot be addressed with the commonly used amine formulations.

An epoxy resin composition and a cured product thereof are provided, the epoxy resin composition comprising an epoxy resin (A), a curing agent (B) comprising a compound represented by the following formula (B-1) (wherein R.sup.1 represents a hydrogen atom, a halogen atom, a methoxy group or a hydrocarbon group having 1 to 12 carbon atoms), and an imidazole adduct-type curing accelerator (C), wherein the molar ratio of the content of a phenolic hydroxide group to the content of an epoxy group in the epoxy resin composition is 0.25 to 0.67. ##STR00001##

There is provided an epoxy resin composition comprising an epoxy resin (A), a curing agent (B), an imidazole adduct-type curing accelerator (C), and a Lewis acid compound (D) having a boron atom or an aluminum atom, wherein the curing agent (B) comprises a compound (B-1) represented by a formula (B-1) [R.sup.1 denotes a hydrogen atom, a halogen atom, a methoxy group or a hydrocarbon group having 1 to 12 carbon atoms]; and the content of a compound (B-2) represented by a formula (B-2) [R.sup.2 denotes a hydrogen atom, a halogen atom, a methyl group or a methoxy group] in the curing agent (B) is 0 parts by mass or higher and lower than 2.0 parts by mass based on 100 parts by mass of the epoxy resin (A).