An amine of formula (I) which is particularly suitable for use as a curing agent for epoxy resins. The amine of formula (I) is devoid of non-incorporable toxic phenols, and is low-viscosity and pale in color. It allows the production of easily-workable, low-emission or emission-free epoxy resin products which cure rapidly even at relatively low ambient temperatures thus obtaining a high degree of hardness and a nice surface with hardly any yellowing. This is particularly suited to use in floor or top coatings.

The metal-clad laminate includes an insulating layer and a metal layer that exists in contact with at least one surface of this insulating layer. The insulating layer includes a cured product of a thermosetting resin composition that contains an epoxy compound having a number-average molecular weight of 1000 or less and at least two epoxy groups per molecule, a polyphenylene ether, a cyanate ester compound, a curing catalyst, and a halogen-based flame retardant. The halogen-based flame retardant is a flame retardant incompatible and dispersed in the thermosetting resin composition. The metal layer includes a metal substrate and a cobalt-containing barrier layer provided on at least a contact surface side of this metal substrate with the insulating layer. In the metal-clad laminate, the contact surface has, as surface roughness, a ten-point average roughness Rz of 2 m or less.

A thermosetting epoxy resin composition comprising (A) a glycidyl-type epoxy resin comprising a mixture of (a1) from 10 wt % to 90 wt % of at least one cycloaliphatic glycidyl-type epoxy resin without an ester group, and (a2) from 90 wt % to 10 wt % of at least one cycloaliphatic glycidyl-type epoxy resin containing an ester group, each based on the total weight of (a1) and (a2), (B) at least one cationic curing agent, and optionally (C) at least one silanized filler,
which, in particular, is suitable for the manufacture of outdoor insulation system articles for electrical engineering by casting, potting, encapsulation, and impregnation processes, wherein said articles exhibit good mechanical, electrical and dielectrical properties, and can be used as insulators, bushings, switchgears and instrument transformers.

The present invention concerns a curable adhesive composition, wherein the composition is a two-component composition comprising: (A) an adhesive component comprising: (i) an aliphatic glycidyl ether; (ii) a cycloaliphatic epoxy and/or an aromatic glycidyl ether; and (iii) a silane reducing agent; and (B) a catalyst component comprising: (iv) a Group 9 or Group 10 noble metal catalyst, wherein the adhesive component (A) and/or the catalyst component (B) further comprises an initiator; articles coated by the composition or component compositions thereof; methods of bonding articles using the composition or component compositions thereof; and kits comprising the composition or component compositions thereof.

A curable, one-part, dual-stage thiol-ene-epoxy liquid adhesive composition, articles, and methods, wherein the composition includes: an epoxy resin component comprising an epoxy resin having at least two epoxide groups per molecule; a thiol component comprising a polythiol compound having at least two thiol groups; a nitrogen-containing catalyst for the epoxy resin; a barbituric acid derivative soluble in the thiol-epoxy component of the thiol-ene-epoxy adhesive composition; a non-(meth)acrylate ethylenically unsaturated compound; and a photoinitiator; wherein the nitrogen-containing catalyst is insoluble in the ethylenically unsaturated compound and the polythiol compound separately.

Provided is a resin composition which is capable of improving the bending property and the cutting processability of a B-stage film and which is capable of reducing the dielectric loss tangent of a cured product and improving the thermal dimensional stability of the cured product. The resin composition according to the present invention includes an epoxy compound, a curing agent and an inorganic filler, the epoxy compound containing a liquid epoxy compound having a viscosity of 500 mPa.Math.s or less at 25 C., in an amount of 1% by weight or more and 10% by weight or less based on 100% by weight of the whole of the epoxy compound.

A non-leaching mediator may include a polymer having a polymeric backbone, and a plurality of phenothiazine groups bonded to the polymeric backbone. The plurality of phenothiazine groups may include at least one of a phenothiazine group having the general formula (IV):

##STR00001##

and salts thereof, where n is about 9 and R represents the polymeric backbone to which the phenothiazine group is bonded, and a phenothiazine group having the general formula (V):

##STR00002##

and salts thereof, where n is about 9 and R represents the polymeric backbone to which the phenothiazine group is bonded.

A solid electrolyte is provided. The solid electrolyte includes inorganic ceramic electrolytes and an organic polymer. The organic polymer physically combines to the inorganic ceramic electrolytes. The organic polymer includes a repeat unit of formula (I),

##STR00001## wherein the A includes the following formula (II):

##STR00002## wherein each of R.sup.1 and R.sup.2 is independently selected at least one from the group consisting of the following groups: C.sub.2-C.sub.4 aliphatic alkyl, optionally substituted phenyl, bisphenol, bisphenol A, bisphenol F, and bisphenol S. The organic polymer is distributed uniformly between the inorganic ceramic electrolytes. The solid electrolyte has a conducting ion path. The solid electrolyte has a conducting ion path.

The invention relates to structural adhesive compositions and more particularly to two-component (2K) structural adhesive compositions. The two components chemically react to bond structural surfaces. N-(3-Aminopropyl)cyclohexylamine (APCHA) has been found to be an improved curing agent for use with epoxy resins in 2K adhesive compositions. APHCA exhibits favorable features including viscosity, pot life and reactivity, and adhesive and thermal performance after curing with epoxy resin. These features and its unique chemistry allow the use of APCHA in curing agent formulations for structural adhesives, in particular wind turbine blade adhesives. APCHA solves issues with viscosity build-up, working time, through-cure, compatibility and adhesive performance that cannot be addressed with the commonly used amine formulations.

The present application relates to an adhesive film, an organic electronic device comprising same, and a lighting apparatus and a display device comprising same. The present application enables an organic electronic device to show excellent moisture-blocking properties and have flexibility as well as excellent and reliable durability at high temperature and high humidity.