Disclosed herein are compounds of formulas (I) and (II), Wherein R.sub.1, R.sub.2, R.sub.3 and (1) are as described herein. Methods of making compounds of formulas (I) and (II), curable compositions containing them and cured compositions containing them are also described. The compounds of formulas (I) and II are curing agents, fire retardants or both. ##STR00001##

Provided is an epoxy resin composition that can achieve excellent low dielectric characteristics and high adhesive strength to metal. Specifically, provided is an epoxy resin composition comprising organic fine particles and an epoxy resin having a specific structure.

The present invention provides an epoxy resin composition that is provided with flexibility to combine impact resistance and mechanical strength, while maintaining epoxy resin-specific high elastic modulus, that reduces an increase in viscosity due to mixing, and that is excellent in heat resistance, storage stability, and solvent resistance. Provided is an epoxy resin composition containing: a modified polyvinyl acetal resin having a constitutional unit with an acid-modified group; a reactive diluent; and an epoxy resin, the epoxy resin composition having a sea-island phase separated structure after being cured.

The present teachings contemplate a method that includes a step of providing a first amount of esterified reaction product of an acid and an epoxy-based material. The esterified reaction product may be further reacted an epoxy resin to form a polymeric epoxy. The resulting material may have a generally linear backbone, foaming and curing capability and flame retardant properties.

Provided is a curative part usable in a two-part curable composition. The curative part includes a liquid amine; a heterogeneous dispersant; and core-shell rubber particles having an elastomeric core and a (meth)acrylic shell. The core-shell rubber particles and the heterogeneous dispersant can be collectively shear-dispersed in the liquid amine such that the core-shell rubber particles are substantially non-aggregated and the curative part is phase-stable over a period of at least 3 months at ambient temperature. Advantageously, large amounts of core-shell rubber particles can thus be incorporated into a cured resin matrix, which can afford significantly enhanced impact performance.

A bio-based resin obtained from a reaction mixture comprising a glycidyl ether component and a bio-based component comprising a fatty acid and a rosin acid, wherein the glycidyl ether component comprises at least two epoxide groups.

Proposed is an epoxy flux film that is to be positioned between a semiconductor substrate and a device and is heated and pressed without addition of an additional flux. Thus, device-substrate soldering and sealing are simultaneously performed, and interference of light reflected from the solder can be reduced.

Proposed is an epoxy flux film that is to be positioned between a semiconductor substrate and a device and is heated and pressed without addition of an additional flux. Thus, device-substrate soldering and sealing are simultaneously performed, and interference of light reflected from the solder can be reduced.

The invention relates to a composition comprising an epoxy-derived covalent adaptable network, preferably an epoxy vitrimer comprising at least one unit of formula (I)

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The invention further relates to a method for preparing a composition comprising an epoxy-derived covalent adaptable network by contacting at least one amine comprising primary, at least one vinylogous precursor comprising vinylogous precursor groups and at least one epoxide comprising epoxide groups whereby the number of amine groups, the number of vinylogous precursor groups and the number of epoxide groups is controlled.

An aspect of the present invention provides a semi-cured product composite containing: a porous body; and a semi-cured product of a thermally curable composition impregnated in the porous body, wherein the thermally curable composition contains an epoxy compound and a cyanate compound, and an equivalent ratio of an epoxy group of the epoxy compound to a cyanate group of the cyanate compound in the thermally curable composition is 1.0 or more.