The present disclosure relates to an epoxy resin composition having a thermal conductivity of at least 5 W/m.Math.k, which has a sufficient thermal emission effect when implementing a multilayer circuit and can replace a ceramic substrate used in automobiles, home appliances, electric vehicles and the like, and to a heat dissipation circuit board using the same. The epoxy resin composition according to one embodiment of the present disclosure, the epoxy resin composition includes an epoxy resin, a curing agent and an inorganic filler. The inorganic filler may include alumina having a maximum particle diameter of less than 32 μm and aluminum nitride having a mean particle diameter of 0.5 to 1.0 μm, in an amount of 85 wt % or more. The epoxy resin composition includes an inorganic filler having a mean particle diameter of 1.0 μm to form an insulating layer having excellent thermal conductivity and withstand voltage properties, thereby providing a high heat dissipation circuit board that is superior compared to existing single layer circuit boards.

The present disclosure relates to an epoxy resin composition having a thermal conductivity of at least 5 W/m.Math.k, which has a sufficient thermal emission effect when implementing a multilayer circuit and can replace a ceramic substrate used in automobiles, home appliances, electric vehicles and the like, and to a heat dissipation circuit board using the same. The epoxy resin composition according to one embodiment of the present disclosure, the epoxy resin composition includes an epoxy resin, a curing agent and an inorganic filler. The inorganic filler may include alumina having a maximum particle diameter of less than 32 μm and aluminum nitride having a mean particle diameter of 0.5 to 1.0 μm, in an amount of 85 wt % or more. The epoxy resin composition includes an inorganic filler having a mean particle diameter of 1.0 μm to form an insulating layer having excellent thermal conductivity and withstand voltage properties, thereby providing a high heat dissipation circuit board that is superior compared to existing single layer circuit boards.

Two part curable compositions are provided which include a first part comprising a (meth)acrylate component and an amine and a second part comprising a fatty acid peroxide. Further disclosed are methods of preparing a two part adhesive composition using the two part curable compositions and methods of bonding surfaces using the two part curable compositions.

Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.

Disclosed are a modified epoxy resin immobilized enzyme, a preparation method therefor and an application thereof. Herein, the preparation method includes the following steps: modifying an epoxy resin, adding a polyethyleneimine to a modified epoxy resin for further modification, and then adding an enzyme to be immobilized and a glutaraldehyde for immobilization, to obtain the modified epoxy resin immobilized enzyme. The epoxy resin is modified, the polyethyleneimine is added to the modified epoxy resin for the further modification, and an aldehyde group in the resin and an amino group in the polyethyleneimine are covalently bound to each enzyme, then it is activated by the bifunctional reagent glutaraldehyde.

A method of manufacturing an ink blocking layer for a display device, an ink blocking layer for a display device, and a display device are provided. The method of manufacturing an ink blocking layer for a display device includes: preparing a main material including an epoxy monomer having three or more epoxy groups and a curing agent including an acid and an amine; and mixing the main material with the curing agent to prepare an epoxy resin.

A method of manufacturing an ink blocking layer for a display device, an ink blocking layer for a display device, and a display device are provided. The method of manufacturing an ink blocking layer for a display device includes: preparing a main material including an epoxy monomer having three or more epoxy groups and a curing agent including an acid and an amine; and mixing the main material with the curing agent to prepare an epoxy resin.

Resin compositions including at least two different inert fillers that are useful for preparing prepregs and laminates that are used in manufacturing printed circuit boards.

An epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the epoxy resin composition, the epoxy resin composition including an epoxy resin; a curing agent; an inorganic filler; and a curing catalyst, the epoxy resin including an epoxy resin represented by Formula 1: ##STR00001##

The instant invention provides a curable formulation suitable for laminating adhesive applications, and laminating adhesives made therefrom. The curable formulation suitable for laminating adhesive applications according to the present invention comprises a) a blend comprising i) an epoxy terminated polyester and at least one of ii) a maleate (poly) ester or iii) a diacrylate terminated oligomer or polymer and b) an aliphatic amine curing agent.