An object of the present invention is to provide a composition capable of forming a thermally conductive material having excellent thermally conductive properties and excellent handleability in a semi-cured state. In addition, another object of the present invention is to provide a thermally conductive material, a thermally conductive sheet, and a device with a thermally conductive layer.

The composition of the present invention contains a phenolic compound, an epoxy compound, a compound represented by Formula (1), and an inorganic nitride.

##STR00001##

Two-part curable compositions capable of demonstrating substantially no phase separation at room temperature over time and improved adhesion strength retention at elevated temperature conditions.

Two-part curable compositions capable of demonstrating substantially no phase separation at room temperature over time and improved adhesion strength retention at elevated temperature conditions.

The present invention is directed to the use as a reactive component in the curing of compositions based on epoxy resins of a functionalized α-angelica lactone (XOMAL) having the general formula: ##STR00001##
wherein: R.sup.a is a C.sub.1-C.sub.30 alkyl, C.sub.3-C.sub.30 cycloalkyl, C.sub.6-C.sub.18 aryl or C.sub.2-C.sub.12 alkenyl group.

The present disclosure provides to a novel flame retardant resin, wherein the resin is a reaction product of an epoxy material, a curing agent, and a partially esterified tannic acid of formula I, ##STR00001## wherein TA represents a tannic acid moiety, R.sup.1 represents an optionally substituted C.sub.1-C.sub.6 straight or branched alkyl, an optionally substituted C.sub.3-C.sub.6 cyclic ring, an optionally substituted phenyl group, or any combination thereof, and n is 2-10.

The present disclosure provides to a novel flame retardant resin, wherein the resin is a reaction product of an epoxy material, a curing agent, and a partially esterified tannic acid of formula I, ##STR00001## wherein TA represents a tannic acid moiety, R.sup.1 represents an optionally substituted C.sub.1-C.sub.6 straight or branched alkyl, an optionally substituted C.sub.3-C.sub.6 cyclic ring, an optionally substituted phenyl group, or any combination thereof, and n is 2-10.

A glycidyl amine epoxy resin(s) and a process for production of glycidyl amine epoxy resin(s) are disclosed. The glycidyl amine epoxy resin(s) is/are free from Bisphenol A (BPA) and Bisphenol F (BPF) and are based on AMES negative amine precursors.

Compositions and methods are described which provide a protective coating to coils or springs via a polymerization process such as by covalent bonding that includes grafting to the metal surface.

The present invention relates to a support-attached resin film for an interlayer insulating layer, including a support, and a resin composition layer formed on one side surface of the support in which the support has particles exposed on the one side surface, and an average maximum height of exposed portions of the particles is 1.0 μm or less, or the support has no particles exposed on the one side surface, a multilayer printed wiring board using the support-attached resin film for an interlayer insulating layer, and the multilayer printed-wiring board.

A curing agent component is useful for a multicomponent epoxide resin composition. An epoxide resin composition produced using the curing agent component, wherein the curing agent component includes, as a curing agent, at least one Mannich base and an amine that is reactive with respect to epoxide groups, as well as at least one polyphenol from the group of novolac resins as an accelerant. The Mannich base can he obtained by reacting a phenolic compound selected from phenol, styrenated phenol, catechol, resorcinol, hydroquinone, hydroxyhydroquinone, phloroglucinol, pyrogallol, o-cresol, m-cresol, p-cresol and bisphenols, with an aldehyde or an aldehyde precursor and an amine having at least two active hydrogen atoms in the molecule which are bonded to a nitrogen atom. The novolac resin is contained in the curing agent component in a proportion of 5-30 wt. %, based on the organic proportions of the curing agent component.