A curable, one-part epoxy/thiol resin composition comprising: an epoxy resin component comprising an epoxy resin having at least two epoxide groups per molecule; a thiol component comprising a polythiol compound having at least two primary thiol groups; a nitrogen-containing catalyst for the epoxy resin; and a substituted barbituric acid soluble in the one-part epoxy/thiol resin composition.

A curable, one-part epoxy/thiol resin composition comprising: an epoxy resin component comprising an epoxy resin having at least two epoxide groups per molecule; a thiol component comprising a polythiol compound having at least two primary thiol groups; a nitrogen-containing catalyst for the epoxy resin; and a substituted barbituric acid soluble in the one-part epoxy/thiol resin composition.

A composition includes a polythiol having more than one thiol group, a polyepoxide having more than one epoxide group, an amine catalyst, and conductive filler. The conductive filler is at least one of thermally conductive or electrically conductive. The conductive filler is present in an amount to provide a thermal conductivity of at least 0.95 W/m′K, and/or the conductive filler is present in an amount of greater than 80 percent by weight, based on the total weight of the composition. A polymer network, which can be prepared from the composition, and a method for making the polymer network are also disclosed.

Adhesion-promoting compositions and the use of the adhesion-promoting compositions to provide adhesion-promoting interlayers to enhance adhesion between adjoining layers of sulfur-containing sealants are disclosed. In repair applications, the adhesion-promoting compositions can enhance the adhesion of an overlying radiation-curable sulfur-containing sealant to a damaged or aged sulfur-containing sealant.

The present disclosure provides a polymeric material including a polymerized reaction product of a polymerizable composition including components and has a solids content of 90% or greater. The components include a uretdione-containing material including a reaction product of a diisocyanate reacted with itself; a first hydroxyl-containing compound; an optional second hydroxyl-containing compound having a single OH group; an epoxy component; and an accelerator. The first hydroxyl-containing compound has more than one OH group and the optional second hydroxyl-containing compound is a primary alcohol or a secondary alcohol. The present disclosure also provides a two-part composition, in which a polymeric material is included in the first part and the second part includes at least one thiol-containing compound. Further, a method of adhering two substrates is provided, including obtaining a two-part composition; combining at least a portion of the first part with at least a portion of the second part to form a mixture; disposing at least a portion of the mixture on a first substrate; and contacting a second substrate with the mixture disposed on the first substrate. The disclosure also provides a polymeric material and a method of making a two-part composition. Advantageously, two-part compositions according to the present disclosure can be used as coatings and adhesive systems with handling and performance similar to existing two-part urethane systems, but with less sensitivity to water.

There is provided a photocurable composition including Component (A): epoxy compound, Component (B): acrylic ester compound, Component (C): isocyanate compound, Component (D): photobase generator, and Component (E): compound having a thiol group, in which Component (A) has two or more epoxy groups in one molecule, Component (B) has two or more acryloyl groups in one molecule, Component (C) has two or more isocyanate groups in one molecule, and Component (E) has two or more thiol groups in one molecule, and a ratio of a total mass of Component (A), Component (B), Component (C), and Component (D) to a mass of Component (E) is (Component (A)+Component (B)+Component (C)+Component (D)):Component (E)=74:26 to 20:80.

An adhesive for an endoscope, the adhesive including an epoxy resin including at least one of bisphenol A epoxy resin, bisphenol F epoxy resin, or phenol novolac epoxy resin, a curing component, and an acidic curing acceleration component; a cured product of the adhesive; an endoscope including the cured product fixed; and a method for producing the endoscope.

An adhesion promoter, a curable composition containing the adhesion promoter, a cured composition formed from the curable composition, and an article containing the cured composition are provided. The adhesion promoter, which is formed by reacting a polyepoxide with a mercaptosilane that has a hydrolyzable silyl group, has at least one epoxide group and at least one hydrolyzable silyl group. The epoxide groups allow incorporation of the adhesion promoter into the polymeric matrix of the cured composition and the hydrolyzable silyl groups allow bond formation with various substrates.

Disclosed is a curable resin composition that has excellent curability by irradiation of light and heating and that is suitable for such applications as liquid encapsulants, liquid adhesives, adhesives for camera modules, and liquid crystal sealants. The curable resin composition contains (A) an aromatic epoxy resin having an allyl group, (B) a thiol-based curing agent, (C) a photoradical initiator, and (D) a thermally latent curing agent. Preferably, (A) the compound having an allyl group and an epoxy group is an aromatic epoxy resin having an allyl group. Preferably, the thiol-based curing agent, which is component (B), is in liquid form at 25° C.

Disclosed is a curable resin composition that has excellent curability by irradiation of light and heating and that is suitable for such applications as liquid encapsulants, liquid adhesives, adhesives for camera modules, and liquid crystal sealants. The curable resin composition contains (A) an aromatic epoxy resin having an allyl group, (B) a thiol-based curing agent, (C) a photoradical initiator, and (D) a thermally latent curing agent. Preferably, (A) the compound having an allyl group and an epoxy group is an aromatic epoxy resin having an allyl group. Preferably, the thiol-based curing agent, which is component (B), is in liquid form at 25° C.