The present invention relates to a catalyst composition for curing resins containing epoxy groups, in particular epoxy/polyurethane hybrid resins, the catalyst composition containing an imidazolium salt, in addition to a base, as well as a method for curing such resins in the presence of the catalyst composition, to the use of the catalyst composition for curing resins containing epoxy groups, to resin systems comprising a resin containing epoxy groups and the catalyst composition, and to a dosing system that comprises the resin and the catalyst composition.

Provided in the present invention are a halogen-free epoxy resin composition, prepreg and laminate using the same, the halogen-free epoxy resin composition comprising: (A) a halogen-free epoxy resin; (B) a crosslinking agent; and (C) a phosphorous-containing phenolic resin, the phosphorous-containing phenolic resin being formed by a synthesis of phenol and formaldehyde with dicyclopentadiene phenol, and being substituted by 9,10-dihydro-9-oxa-10-phosphapheanthrene-10-oxide or a derivative thereof. The prepreg and laminate prepared from the halogen-free epoxy resin composition have a high heat resistance, a low dielectric constant, a low dielectric loss factor and a low water absorption rate, and achieve halogen-free flame retardance.

A reinforcing resin composition includes an epoxy resin (A), a phenolic resin (B), and a benzoxazine compound (C).

Resin sheets which includes a support and a resin composition layer in contact on the support, and which are characterized in that an extracted water conductivity A of a cured product of the resin composition layer when extracted at 120° C. for 20 hours is 50 μS/cm or less and an extracted water conductivity B of the cured product of the resin composition layer when extracted at 160° C. for 20 hours is 200 μS/cm or less, can provide a thin insulating layer having excellent insulating properties.

Provided are a thermoplastic epoxy resin composition comprising (A) an epoxy compound having two epoxy groups in one molecule, (B) a compound having two phenolic hydroxyl groups in one molecule, and at least one compound selected from the group consisting of dihexylamine, diheptylamine, di(2-ethylhexyl)amine, N-ethylhexylamine, trihexylamine, dioctylamine, tri n-octylamine, N,N-dimethyl-n-octylamine, and N,N-dimethyldecylamine as (C) a curing accelerator, and a thermoplastic cured epoxy resin with transparency to visible light produced by curing the thermoplastic epoxy resin composition.

An impregnating resin, e.g., a catalytically hardenable impregnating resin for the conductor of an electrical machine, may include at least one reactive resin mixed with at least one reactive diluent and a hardening catalyst, e.g., for cationic, anionic or coordinate polymerization of the impregnating resin. The properties of the impregnating resin or use thereof may be improved by virtue of the reactive diluent containing a heterocyclic four-membered ring. The impregnating resin may be part of a main insulation of a conductor arrangement, which may in turn be installed in an electrical coil or other electrical machine.

Liquid crystalline network compositions comprising azo-containing aromatic epoxy units cross-linked with alkylene diacid units having alkylene segments containing at least one methylene unit, wherein the azo-containing aromatic epoxy units and alkylene diacid units are connected by ester linkages resulting from ring-opening esterification between the epoxy units and alkylene diacids, and wherein the azo-containing aromatic epoxy units and alkylene diacid units are in a molar ratio that results in the liquid crystalline network composition exhibiting a glass transition temperature (T.sub.g) of at least 25° C. Methods for producing these compositions and their use in light- or thermal-activated physical deformation, shape memory applications, and self-healing, as well as their ability to be recycled and used in additive manufacturing processes are also described.

Liquid epoxy curing agents that have improved latency over conventional liquid curing agents while retaining the physical properties of the cured material are disclosed. These liquid curing agents can be used for curing epoxy resins, or in combination with dicyandiamide (DICY) based curing agents in order to accelerate DICY curing.

Curable compositions comprising an epoxy mixture comprising a) an epoxy mixture comprising i) a first epoxy component comprising epoxy phenol novolac oligomers having a content of 2-functional monomers of less than 10 weight percent based on the total weight of the first epoxy component and having an epoxide equivalent weight in the range of 170 to 200; and ii) a second epoxy component comprising an epoxy resin having monomers with an average functionality of at least 2 and b) a hardener, are disclosed. The curable compositions can be used to prepare prepregs for hot-melt applications.

There is provided herein a curing agent compound for curing thermosetting resins, e.g., epoxy resins, a composition comprising a thermoplastic and/or thermosetting resin, e.g., an epoxy resin and the curing agent, an article comprising the curing agent, and a method of making the curing agent.