Provided is an inkjet adhesive which is applied using an inkjet device, wherein the adhesive can suppress generation of voids in the adhesive layer and, after bonding, can enhance adhesiveness, moisture-resistant adhesion reliability, and cooling/heating cycle reliability. An inkjet adhesive according to the present invention comprises a photocurable compound, a photo-radical initiator, a thermosetting compound having one or more cyclic ether groups or cyclic thioether groups, and a compound capable of reacting with the thermosetting compound, and the compound capable of reacting with the thermosetting compound contains aromatic amine.

Provided is a resin composition for a fiber-reinforced composite material that has low tackiness when turned into a prepreg, has satisfactory handleability, and can be suppressed in deformation at the time of its release from a mold in a PCM method. The resin composition is a resin composition for a fiber-reinforced composite material including, as essential components: a liquid epoxy resin (A); a novolac-type epoxy resin (B); a polymer component (C) having a molecular weight of 10,000 or more; dicyandiamide (D); and an imidazole-based curing aid (E), wherein the resin composition includes 10 parts by mass to 35 parts by mass of the liquid epoxy resin (A), and 10 parts by mass to 25 parts by mass of the polymer component (C) out of 100 parts by mass of the total of the components (A) to (E), and has a glass transition temperature of 0° C. or more before its curing.

The present invention relates to a resin composition containing a transparent resin and a light absorber, wherein a cured product of the resin composition has an absorption maximum wavelength in a wavelength range of 550 to 720 nm.

The present invention provides a curable resin composition, a cured product of which has a small change in heat resistance after receiving a thermal history and a low thermal expansion property; a cured product of the curable resin composition; a printed circuit board having a small change in heat resistance; and an epoxy resin which imparts the characteristics described above. The epoxy resin is an epoxy resin which is obtained by polyglycidyl etherification of a reaction product formed from ortho-cresol, a β-naphthol compound, and formaldehyde and which includes as a necessary component, a dimer (x2, formula (1)), a trifunctional compound (x3, formula (2)), and a tetrafunctional compound (x4, formula (3)). The total content of those components is 65% or more in terms of the area rate in GPC measurement. ##STR00001##

A polyhydric phenol resin is provided. The polyhydric phenol resin comprises a polyhydric phenol resin component and a first component. When the polyhydric phenol resin is characterized in a high-performance liquid chromatography (HPLC), the first component is eluted at a retention time ranging from 27.1 minutes to 28.0 minutes, and based on the total area of the chromatographic peaks of the polyhydric phenol resin, the area percentage of the chromatographic peak of the first component at the corresponding retention time in the spectrum ranges from 1.0% to 20%.

The purpose of the present invention is to provide a surface sealing material which has high storage stability and is capable of forming, on an object to be coated such as an organic EL element, a cured product layer that has less irregularity, cissing and the like, while having high surface smoothness. A surface sealing material for organic EL elements according to the present invention contains (B) a cationically polymerizable compound that comprises a cationically polymerizable functional group in each molecule and has a structure represented by formula (1) —(R—O).sub.n— (wherein R represents an alkylene group having 2-5 carbon atoms and n represents an integer of 1-150), (C) a thermal cationic polymerization initiator and (D) a leveling agent.

The present disclosure provides a Lewis acid-base pair catalytic initiator and an application thereof. The Lewis acid-base pair catalytic initiator includes a Lewis acid and a Lewis base, the Lewis acid having a structural general formula as shown in formula (I) and the Lewis base having a structural general formula as shown in formula (II); wherein: the A is selected from element Baron or element Aluminum; the R.sub.1, R.sub.2, R.sub.3, R.sub.4 are independently selected from alkyl, alkoxy, aryl or halogen groups; the alkyl or alkoxy have a carbon number being equal to or greater than 1 to equal to or less than 16; the aryl contains substituents with the number being equal to or less than 5, the substituents being selected from methyl, methoxy or halogen; n is selected from an integer from 1 to 16.

Noise, vibration, or harshness (NVH) properties of an industrial or consumer product are reduced by incorporating therein an effective amount of a polyether- or polyester-epoxide polymer (PEEP) composition. The PEEP compositions are one-component or two-component reaction products of a polyepoxide compound and a polyol composition. The PEEP compositions have a glass-transition temperature within the range of −50° C. to 50° C. and a loss factor of at least 0.5 by ASTM D5992 over a temperature range of at least 15 Celsius degrees at one or more frequencies within the range of 0.1 to 10,000 Hz. The PEEP compositions provide NVH damping over a broad temperature range, have improved flexibility compared with conventional epoxy technologies, avoid amine and isocyanate reactants, and can be tailored to meet target specifications.

A thermosetting resin composition which produces no free isocyanate even when a carbodiimide compound is used and provides a cured resin having high heat resistance.

The thermosetting resin composition makes it possible to reduce the curing temperature, cures in a short time and provides a cured rein having a high glass transition temperature.

The thermosetting resin composition comprises: (A) an epoxy resin (component A); and (B) a cyclic carbodiimide compound (component B) including a cyclic structure having one carbodiimide group and represented by the following formula (B-i) in which first nitrogen and second nitrogen are bonded together by a bond group and having 8 to 50 atoms forming the cyclic structure:

##STR00001##

(wherein Q is bivalent to tetravalent bond group which is an aliphatic group, alicyclic group, aromatic group, or a combination of these groups and may contain a hetero atom or substituent); and/or
(b) a polyvalent amine-based curing agent (component b) represented by the following formula (b-i):

##STR00002##

(wherein Ar.sup.1 to Ar.sup.4 are each independently a phenylene group or naphthalene-diyl group which may be substituted by a substituent).

A curable, one-part epoxy/thiol resin composition comprising: an epoxy resin component comprising an epoxy resin having at least two epoxide groups per molecule; a thiol component comprising a polythiol compound having at least two primary thiol groups; a nitrogen-containing catalyst for the epoxy resin; and a substituted barbituric acid soluble in the one-part epoxy/thiol resin composition.