A curing agent composition can be used for a multi-component epoxy resin compound for the chemical fastening of construction elements. An epoxy resin compound and a multi-component epoxy resin system are useful. A method can be used for the chemical fastening of construction elements in boreholes. A combination of a salt (S) with a phenol derivative can be used for the chemical fastening of construction elements, in particular at low temperatures (≤0° C.), to improve the curing and the pull-out strength.

An epoxy formulation is provided with improved properties for electrical components exposed to a voltage differential. The improved electrical properties include increased glass transition temperature, increased breakdown strength and/or lower loss factor. Electrical components may be formed from the epoxy formulation by 3D printing the epoxy formulation and curing the formulation with UV radiation. The epoxy formulation includes epoxy, a photoinitiator and an accelerator.

The present disclosure is generally directed to a method of curing an ionic liquid epoxy mixture using an electromagnetic signal. First, an ionic liquid epoxy resin comprising ionic liquid epoxide monomers and, optionally, diluent epoxy resins and powdered fillers, is combined with a curing agent to form an ionic liquid epoxy mixture. The mixture is then applied as a coating onto a surface of a material. The coating is placed in contact with a second surface of the same material or a surface of another material. An electromagnetic signal, which in some instances is a microwave signal, is applied to the coating. Following application of the signal, the ionic liquid epoxide monomers polymerize and the mixture cures, adhering the surfaces together. Alternately, the epoxy mixture is applied to a surface and cured with microwaves to form a protective coating as in cladding or paint.

An epoxy resin component(s) for a recyclable epoxy resin system is disclosed. The recyclable epoxy resin system comprises an epoxy resin component having a structural Formula I or an epoxy resin component having a structural Formula II and a curing agent. A process(es) for preparing the epoxy resin component having the structural Formula I and the epoxy resin system having the structural Formula II is also disclosed.

The present invention is a negative photosensitive resin composition which contains (A) an epoxy resin, (B) a compound that has a phenolic hydroxyl group and (C) a cationic photopolymerization initiator. This negative photosensitive resin composition is configured such that: 30% by mass or more of the epoxy resin (A) is an epoxy resin (A-1) that is represented by formula (1) (wherein each R moiety independently represents a glycidyl group or a hydrogen atom, and at least two R moieties among the plurality of R moieties are glycidyl groups; and a represents the average of the number of repeating units, which is a real number within the range of from 0 to 30); and the compound (B) that has a phenolic hydroxyl group and the cationic photopolymerization initiator (C) have specific structures.

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A photosensitive epoxy resin composition for formation of an optical waveguide, which can be used as an optical waveguide forming material excellent in thermal coloration resistance, patternability, and R-to-R adaptability (flexibility in an uncured resin state). The photosensitive epoxy resin composition contains an epoxy resin component and a photo-cationic polymerization initiator, wherein the epoxy resin component comprises an epoxy resin having a tri- or higher functional bisphenol-A skeleton.

The present invention discloses a composition comprising at least one or more stereoisomers of a compound represented by the following Formula (1), wherein, in a gas chromatogram obtained by analyzing the composition by gas chromatography, the ratio of the area of the maximum peak with respect to the total area of peaks derived from the stereoisomers is 90% or more. The present invention also discloses: a curable composition comprising the above described composition, and one selected from the group consisting of a thermal cationic polymerization initiator, an acid anhydride-based curing agent and a curing accelerator, and a photo-cationic polymerization initiator; as well as a cured product therefrom. The above described curable composition is useful in that it allows for the production of a cured product having a high heat resistance. ##STR00001## (In the Formula (1), R.sup.1 to R.sup.18 are each independently selected from the group consisting of a hydrogen atom, an alkyl group and an alkoxy group.).

Provided is a curable composition which has excellent curability, less causes silicone molds to swell, and allows the silicone molds to have better durability and a longer service life in repeated use. The curable composition according to the present invention is a curable composition for production of an optical component by molding using silicone molds. The curable composition contains curable compounds and a cationic initiator. The curable compounds include (A) a cycloaliphatic epoxy compound and (B) an oxetane compound. The oxetane compound (B) is present in a content of 10 to 45 weight percent of the totality of all the curable compounds contained in the curable composition. Of the totality of all the curable compounds contained in the curable composition, 90 weight percent or more is a compound or compounds having a solubility parameter of 9.0 (cal/cm.sup.3).sup.½ or more as determined at 25° C. by the Fedors' method.

An epoxy resin composition includes at least one thiol-based curing agent, a main epoxy resin, and a curing catalyst. The at least one thiol-based curing agent includes a non-hydrolyzable polyfunctional thiol compound having at least one hydroxyl group and/or urea bond. The main epoxy resin is at least one main aliphatic polyfunctional epoxy resin selected from a polyethylene glycol diglycidyl ether, a cyclohexane-based diglycidyl ether, and a dicyclopentadiene-based diglycidyl ether. The epoxy resin composition has a viscosity at 25° C. of 0.05 Pa.Math.s or higher and 3 Pa.Math.s or lower

The present invention provides compositions consisting of a) at least one metal salt, ammonium salt or phosphonium salt of a strong Brønsted acid and b) at least one primary aliphatic monoamine, processes for preparation thereof and use thereof.