A high-CTI and halogen-free epoxy resin composition for copper-clad plates and uses thereof is provided. The formula of the high-CTI and halogen-free epoxy resin composition for copper-clad plates comprises 100˜140 parts of halogen-free phosphorous epoxy resin, 10˜35 parts of dicyclopentadiene phenolic epoxy resin, 32˜60 parts of benzoxazine, 1˜5 parts of phenolic resin, 0.05˜0.5 parts of accelerants; and 25˜70 parts of fillers, by weight. The copper-clad plates, prepared according to embodiments of the present invention, can reach the requirements of high CTI (CTI≧500V), high heat resistance(Tg≧150 ° C., PCT, 2 h>6 min) and the level of flame retardance of UL-94 V0, and they are widely used in the electronic materials of electric machines, electric appliances, white goods and so on.

An epoxy resin includes an epoxy compound having a mesogenic structure, a cured product of the epoxy resin having a flexural modulus of 3.0 GPa or more at 23° C., a fracture toughness of 1.0 MPa.Math.m.sup.1/2 or more, and a glass transition temperature of 150° C. or higher.

The present invention relates to a tetramethylbiphenol type epoxy resin having a content of a sodium ion of 1 to 12 ppm which is determined by measurement by the atomic absorption spectrometry using a solution wherein a sample is dissolved in N-methylpyrrolidone.

According to an embodiment, a thermosetting epoxy resin composition including an epoxy resin, an aromatic amine compound, a boron-phosphorus complex, and a phosphorus compound is provided. The aromatic amine compound is represented by the following general formula (1) (where R.sub.1 represents an alkyl group, m represents an integer of 2 or more, n represents an integer of 0 or more, and m and n satisfy m+n≤6, and when n is an integer of 2 or more, a plurality of R.sub.1 may be the same as or different from each other).

##STR00001##

Provided is an encapsulating resin composition for a power device including an epoxy resin, an inorganic filler, a curing agent, and a curing accelerator. This composition is molded under a condition of 175° C. for 2 minutes and then subjected to after-curing under a condition of 175° C. for 4 hours to obtain a test piece having a diameter of 100 mm and a thickness of 2 mm, and a half width of a current-time curve obtained by measuring the test piece with a thermally stimulated depolarization current method according to an order of (i) to (v) below is equal to or less than 800 seconds, (i) increase a temperature of the test piece to 150° C. at a rate of 5° C./min without applying a voltage, (ii) applying a constant voltage of 500 V for 30 minutes while maintaining the temperature of the test piece at 150° C., (iii) lower the temperature of the test piece to 45° C. at a rate of 5° C./min while applying the constant voltage of 500 V, (iv) stop applying the voltage while maintaining the temperature of the test piece at 45° C. and leave the test piece to stand for 5 minutes, and (v) increase the temperature of the test piece at a rate of 3.5° C./min without applying a voltage to the test piece, and measure a value of a current flowing during the increase in the temperature to obtain a current-time curve.

A thermoset epoxy resin, its preparing composition and making process are disclosed. In particular, the thermoset epoxy resin is glycidyl ether of diphenolic bis-carbamate and formed by curing a one component epoxy composition and has a general structure as shown in formula (1).

The present invention provides a laminate with good adhesion, which includes a transparent substrate, an adhesive layer formed by an adhesive composition, and a metal layer. The adhesive composition contains a resin, an adhesion promoter selected from a triazole compound represented by formula (1), a thiadiazole compound represented by formula (2), a benzotriazole compound represented by formula (3) or a phosphate oligomer; and an antioxidant, in which R.sup.1˜R.sup.5 are as defined herein.

##STR00001##

The present invention relates to a low-alkylphenol composition comprising a) at least one epoxy resin, b) at least one amine having at least two secondary amino groups that are both part of an organic ring system, and c) at least one salt of a strong Brønsted acid with a counterion selected from metal ions, metal-containing ions, phosphonium ions and ammonium ions, to processes for production thereof and to the use thereof.

Provided is a curable resin composition being excellent in normal-temperature stability for obtaining cured product having high heat resistance, cured product thereof, methods of producing the composition and the product, and a semiconductor device using the product as sealant. Further provided is a resin composition, cured product thereof, and methods of producing the composition and the product, wherein the composition includes: (A) multifunctional benzoxazine compound having at least two benzoxazine rings, (B) epoxy compound containing at least one epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) curing agent; wherein composition consisting of (A), (B), and (C) has weight-average molecular weight of 350 or more and 650 or less in terms of polystyrene. Additionally provided is a semiconductor device where semiconductor element is disposed in the cured product obtained by curing the composition containing components (A) to (C), and optionally components (D) and/or (E).

A latent curing catalyst includes zirconium phosphate fine particles containing a curing accelerator. The zirconium phosphate fine particles containing the curing accelerator do not have a sharp crystalline peak at a diffraction angle (2θ) in a range of 10° to 40° in powder X-ray diffraction and have a broad halo pattern.