An epoxy resin includes a reaction product between: an epoxy compound having a mesogenic structure; and at least one selected from the group consisting of an aromatic hydroxycarboxylic acid having a carboxy group and a hydroxy group bonded to an aromatic ring and an aromatic dicarboxylic acid having two carboxy groups bonded to an aromatic group.

Provided is a method for producing a polymer, characterized by reacting (A) an epoxy compound having two or more epoxy groups in the molecule with (B) a reactive compound having, in the molecule, two or more functional groups reactive with epoxy groups, in the presence of (C) a polymerization catalyst and (D) a cocatalyst.

The present specification relates to a method for manufacturing a polarizing plate, and an adhesive composition for a polarizing plate.

A resin composition for fiber-reinforced plastic having a good balance between stability and curability and capable of producing fiber-reinforced plastic with improved strength. The composition contains an epoxy resin, an acid anhydride, and a catalyst that is liquid at 25° C. The catalyst is at least one member selected from the group consisting of a compound composed of an acid and a base and a compound composed of a quaternary onium cation and an anion.

An epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the epoxy resin composition, the epoxy resin composition including an epoxy resin; a curing agent; an inorganic filler; and a curing catalyst, the epoxy resin including an epoxy resin represented by Formula 1:

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The present invention provides a composition for forming a thermally conductive material, from which a thermally conductive material having excellent adhesiveness can be obtained. In addition, the present invention provides a thermally conductive material and a surface-modified inorganic substance.

The composition for forming a thermally conductive material of the present invention is a composition for forming a thermally conductive material containing a surface-modified inorganic substance and a thermosetting compound, the surface-modified inorganic substance satisfying at least one of Requirement 1 or Requirement 2.

Requirement 1: The surface-modified inorganic substance includes a surface-modified inorganic substance X containing the inorganic substance, and a surface modifier A and a surface modifier B adsorbed on a surface of the inorganic substance.

Requirement 2: The surface-modified inorganic substance includes a surface-modified inorganic substance A containing the inorganic substance and the surface modifier A adsorbed on the surface of the inorganic substance, and a surface-modified inorganic substance B containing the inorganic substance and the surface modifier B adsorbed on the surface of the inorganic substance.

A thermoplastic polyester resin composition has an excellent retention stability and is capable of producing a molded article excellent in mechanical properties and heat resistance as well as in long-term hydrolysis resistance; and the molded article. The thermoplastic polyester resin includes 100 parts by weight of a thermoplastic polyester resin (A) and 0.1 to 10 parts by weight of a biphenyl aralkyl-type epoxy resin or cyclopentadiene-type epoxy resin (B) of a specific type.

A compound for bonded magnet that increases the mechanical strength (for example, crushing strength) of a bonded magnet is provided. The compound for bonded magnet includes a magnetic powder, an epoxy resin, a curing agent, a coupling agent, and a metal salt, and the metal salt is represented by R.sub.2M, in which R represents a saturated fatty acid group having 6 or more and 10 or less carbon atoms, while M represents at least one metal element between Ca and Ba.

The present invention provides: a two-pack curable epoxy resin composition that contains a curing agent having excellent long-term storage stability, has a low viscosity and a good impregnation property into fibers; the cured product; a fiber-reinforced composite material; and a molded article. Specifically, the two-pack curable epoxy resin composition is used, the two-pack curable epoxy resin composition containing: a main agent (i) containing an epoxy resin (A); and a curing agent (ii) containing an acid anhydride (B) and an organic phosphorus compound (C), in which a mass ratio [(i)/(ii)] of the main agent (i) to the curing agent (ii) is in a range of 35/65 to 75/25, and an amount of the organic phosphorus compound (C) used is in a range of 0.5 to 5 parts by mass with respect to 100 parts by mass in total of the epoxy resin (A) and the acid anhydride (B).

A thermoplastic polymer-based composite material and a preparation method thereof are provided. The thermoplastic polymer-based composite material is obtained by impregnating a reinforcing material with a mixture or an oligomer of an epoxy resin, a bisphenol A/F, and a catalyst and then performing an in-situ polymerization. The thermoplastic polymer-based composite material is less expensive to produce, has an optimal impregnation effect, excellent secondary processing performance, high heat resistance, desirable mechanical properties and excellent overall performance.