A cationically polymerizable composition that provides a cured product and having an excellent balance of adhesion to various substrates, particularly, a silver substrate, and excellent handling properties. A cationically polymerizable composition including a double-decker type silsesquioxane compound having at least one alicyclic epoxy group in one molecule (A), a cationically polymerizable compound (B), a compound having a vinyl group and a cationically polymerizable cyclic ether (C), and a chelate-modified epoxy compound (D).

A curative system comprising a combination of adipic acid dihydrazide and/or isophthalic dihydrazide and a clathrate in which the guest compound of the clathrate comprises an imidazole, an imidazoline or diazabicycloalkanes (DBCA).

A curative system comprising a combination of adipic acid dihydrazide and/or isophthalic dihydrazide and a clathrate in which the guest compound of the clathrate comprises an imidazole, an imidazoline or diazabicycloalkanes (DBCA).

A cationic curable composition that generates a silanol group by light irradiation and is cured by heat, the cationic curable composition including: a cationic curable component; porous particles holding an aluminum chelate; and a photodegradable silicon compound that generates a silanol group by photodegradation.

A cationic curable composition that generates a silanol group by light irradiation and is cured by heat, the cationic curable composition including: a cationic curable component; porous particles holding an aluminum chelate; and a photodegradable silicon compound that generates a silanol group by photodegradation.

The present invention concerns a curable adhesive composition, wherein the composition is a two-component composition comprising: (A) an adhesive component comprising: (i) an aliphatic glycidyl ether; (ii) a cycloaliphatic epoxy and/or an aromatic glycidyl ether; and (iii) a silane reducing agent; and (B) a catalyst component comprising: (iv) a Group 9 or Group 10 noble metal catalyst, wherein the adhesive component (A) and/or the catalyst component (B) further comprises an initiator; articles coated by the composition or component compositions thereof; methods of bonding articles using the composition or component compositions thereof; and kits comprising the composition or component compositions thereof.

The present invention concerns a curable adhesive composition, wherein the composition is a two-component composition comprising: (A) an adhesive component comprising: (i) an aliphatic glycidyl ether; (ii) a cycloaliphatic epoxy and/or an aromatic glycidyl ether; and (iii) a silane reducing agent; and (B) a catalyst component comprising: (iv) a Group 9 or Group 10 noble metal catalyst, wherein the adhesive component (A) and/or the catalyst component (B) further comprises an initiator; articles coated by the composition or component compositions thereof; methods of bonding articles using the composition or component compositions thereof; and kits comprising the composition or component compositions thereof.

Provided is a thermosetting epoxy resin composition, including: an epoxy resin; a latent curing agent which is porous particles formed of a polyurea resin and supporting an aluminum chelate; and boric acid.

Provided is a thermosetting epoxy resin composition, including: an epoxy resin; a latent curing agent which is porous particles formed of a polyurea resin and supporting an aluminum chelate; and boric acid.

A light emitting device is manufactured by bonding an LED element on a wiring board using an anisotropic conductive adhesive. In the manufacture, the anisotropic conductive adhesive is disposed on the wiring board, and the LED element is disposed thereon. A polymerizable epoxy-modified silicone resin and a metal chelate compound are contained in the anisotropic conductive adhesive in advance. A pressing unit is pressed against the LED element for a certain pressing time, while the temperature of the wiring board is kept at 160 C. or higher and 210 C. or lower, and the temperature of the pressing unit is set lower than that of the wiring board. Since the reaction between the epoxy-modified silicone resin and the metal chelate compound occurs at a low temperature, the LED element is temporarily connected to the wiring board without collapse of a fluorescent layer.