Provided is a method for the production of a crosslinked molded body containing polyaryletherketone (PAEK), comprising the steps of (a) providing a mixture comprising a PAEK and a crosslinker, (b) preparing a molded body from the mixture, and (c) thermally treating the molded body at a temperature at which PAEK crosslinks, thereby obtaining the crosslinked molded body, and wherein the crosslinker is a di(aminophenyl) compound comprising two aminophenyl rings, wherein the two aminophenyl rings are joined together via an aliphatic group having a carbocyclic rest.

A polyphenylene ether bismaleimide resin, a method for manufacturing the same, and a resin composition are provided. The polyphenylene ether bismaleimide (PPE-BMI) resin is obtained by a condensation reaction with a maleic anhydride and a primary amine compound as reactants. The primary amine compound is a polyphenylene ether diamine.

A resin material and a metal substrate are provided. The resin material includes a resin composition and inorganic fillers. The inorganic fillers are dispersed in the resin composition. The resin composition includes 10 wt % to 40 wt % of a liquid rubber, 20 wt % to 50 wt % of a polyphenylene ether resin, and 10 wt % to 30 wt % of a crosslinker. The polyphenylene ether resin includes a first polyphenylene ether that has a bismaleimide group at a molecular end.

The present disclosure relates to a thermosetting resin composition for a semiconductor package including a modified phenylene ether oligomer or a modified poly(phenylene ether) having ethylenically unsaturated groups at both ends thereof; a thermosetting resin; a predetermined elastic (co)polymer; and an inorganic filler, and a prepreg and a metal clad laminate including the same.

A composition includes particular amounts a poly(phenylene ether), a first polyamide, hydrogenated block copolymer of an alkenyl aromatic and a conjugated diene, pentaerythritol tetrastearate, and bisphenoxyethanol fluorene. The composition can be particularly well-suited for use in a reinforced thermoplastic composition including a reinforcing carbon filler.

A poly(arylene ether) copolymer wherein the poly(arylene ether) copolymer is a product of oxidative copolymerization of monomers comprising a first monohydric phenol; a second monohydric phenol different from the first monohydric phenol; a siloxane oligomer; and optionally, at least one terminal functional group.

A poly(phenylene ether) copolymer comprising first repeating units comprising a C.sub.1-6alkyl(C.sub.6-30cycloalkenyl) pendant group; second repeating units different from the first repeating units; a copolymer of Formula (3); and optionally, at least one terminal functional group comprising (meth)acrylate, styrene, —CH.sub.2—(C.sub.6H.sub.4)—CH═CH.sub.2, allyl, cyanate ester, glycidyl ether, anhydride, aniline, maleimide, an activated ester, or a combination thereof.

##STR00001##

A resin composition containing: (A) a modified polyphenylene ether having a main chain modified at a terminal end with a functional group having a carbon-carbon double bond; (B) a crosslinking agent; (C) a crosslinking aid; and (D) an organic peroxide. The crosslinking aid (C) is a compound having a specific structure.

It could be helpful to provide a thermoplastic elastomer excellent in transparency, etc., while having mechanical properties such as high heat resistance, strength, and flexibility. The thermoplastic elastomer of this disclosure primarily comprises a copolymer including a block structural unit derived from a polymer (A) that contains a polyphenylene ether and has a glass transition temperature of 120° C. or more, and a block structural unit derived from a polymer (B) that primarily contains a diene rubber and has a glass transition temperature of 20° C. or less.

A resin composition includes: (A) a polyphenylene ether resin of Formula (1) and (B) a compound of Formula (3), and/or a compound of Formula (4), and/or a compound of Formula (5). An article is made from the resin composition. The article made from the resin composition may include a prepreg, a resin film, a laminate or a printed circuit board, and one or more properties including resin filling void, glass transition temperature, Z-axis ratio of thermal expansion, dielectric constant, dissipation factor, and warpage may be improved.

##STR00001##