To provide a polymer material having properties that allow the polymer material to replace a polyimide and a polyamide synthesized from a petroleum raw material, said polymer material being synthesized from a raw material derived from natural molecules. [Solution] This polymer material is obtained by polymerizing a polymer raw material comprising a dimer of 4-amino cinnamic acid or a dimer of a 4-amino cinnamic acid derivative, which are natural molecules, wherein the carboxyl group is protected by an alkyl chain. The TGA curve of a polyamide acid (PAA-1) and a polyimide (PI-1) according to the present invention is shown in FIG. 5.

The present application discloses interlayers comprising novel polyesteramides comprising diols with tunable properties based on the monomers and monomer ratios used to prepare the polyesteramides and varying the reaction conditions. The interlayers have improved properties and can be used in many different applications.

A polyimide precursor solution contains a polyimide precursor, particles, and a water-based solvent that contains an amine compound (A), an organic solvent (B) other than the amine compound (A) and amide compounds, and water, in which a boiling point of the organic solvent (B) is higher than a boiling point of the amine compound (A), and is 200° C. or higher and 300° C. or lower.

Techniques and mechanisms to reduce toxicity in manufacturing of a polyamideimide and polyamide amic acid resin polymer. In an embodiment, a polyamideimide is produced using at least one aprotic dialkylamide solvent and at least one co-solvent. In another embodiment, the at least one co-solvent is selected from the group consisting of methyl actetate, n-propyl acetate, t-butyl acetate, iso-butyl acetate, ethyl acetate, isopropyl acetate, methyl lactate, ethyl lactate, n-propyl lactate, isopropyl lactate, n-butyl lactate, isobutyl lactate, t-butyl lactate, cyclohexanone, cyclopentanone, n-butyl acetate, methyl alcohol, ethyl alcohol, isopropyl alcohol, n-acetyl morpholine, ε-caprolactone and methylcyclohexane.

A method for coating a glass article includes obtaining a glass article; selecting a coating including a fluorinated polyimide, and coating the glass article with the selected coating including the fluorinated polyimide. The fluorinated polyimide having a cohesive energy density less than or equal to 300 KJ/mol, and a glass transition temperature (T.sub.g) less than or equal to 625 K.

The present invention relates to a method for preparing a patterned polyimide coverlay on a substrate. The method includes: providing a polyimide dry film including a carrier and a non-photosensitive polyimide layer on the carrier, the non-photosensitive polyimide layer containing (i) a polyimide precursor or soluble polyimide and (ii) a solvent; forming a predetermined pattern in the polyimide dry film; laminating the patterned polyimide dry film onto a substrate in such a manner that the non-photosensitive polyimide layer faces the substrate; and forming a patterned polyimide coverlay by heating.

A polyimide precursor solution contains a polyimide precursor, wherein in the case where the polyimide precursor is analyzed by gel permeation chromatography, the elution curve of the polyimide precursor has a region A including a higher-molecular-weight peak and a region B including a lower-molecular-weight peak; a weight average molecular weight determined from the region A in terms of polystyrene is approximately 10,000 or more, and a weight average molecular weight determined from the region B in terms of polystyrene is approximately less than 10,000; and when the area of the region A is a and the area of the region B is b, the polyimide precursor satisfies Equation (1)
a/(a+b)=approximately from 0.70 to 0.98.  Equation 1:

The present application discloses interlayers comprising novel polyesteramides comprising diols with tunable properties based on the monomers and monomer ratios used to prepare the polyesteramides and varying the reaction conditions. The interlayers have improved properties and can be used in many different applications.

The present application discloses novel polyesteramides comprising cycloalkyl diols and/or cycloalkyl dialkanols with tunable properties based on the monomers and monomerratios used to prepare the polyesteramides and varying the reaction conditions. The present application also discloses compositions and articles.

A negative-type photosensitive resin composition that has a satisfactory imidization rate and can yield a resin layer with high chemical resistance, even under low-temperature curing conditions of 200° C. or below, the negative-type photosensitive resin composition containing a photopolymerization initiator (B) in a proportion of 0.1 part by mass to 2.0 parts by mass with respect to 100 parts by mass of a polyimide precursor (A), the polyimide precursor (A) being a polyamic acid ester or polyarnic acid salt with a specific structure, and the weight-average molecular weight (Mw) of the polyimide precursor (A) being 3,000 or greater and less than 16,000, in terms of polystyrene, according to gel permeation chromatography (GPC)