A negative-type photosensitive resin composition that has a satisfactory imidization rate and can yield a resin layer with high chemical resistance, even under low-temperature curing conditions of 200° C. or below, the negative-type photosensitive resin composition containing a photopolymerization initiator (B) in a proportion of 0.1 part by mass to 20 parts by mass with respect to 100 parts by mass of a polyimide precursor (A), the polyimide precursor (A) being a polyamic acid ester or polyamic acid salt with a specific structure, and the weight-average molecular weight (Mw) of the polyimide precursor (A) being 3,000 or greater and less than 16,000, in terms of polystyrene, according to gel permeation chromatography (GPC).

A method for manufacturing a polyimide composite film for a flexible metal-clad substrate includes the following steps, providing a polyamide acid solution; providing fluorine polymer particles and mixing the fluorine polymer particles with a dispersant and an organic solution to prepare a fluorine polymer particle dispersion; forming a colloidal polyimide film from the polyamide acid solution; and coating the colloidal polyimide film with the fluorine polymer particle dispersion and then performing baking to form a polyimide composite film.

An embodiment can provide a method for producing a polyamide-imide film which is colorless and transparent and has excellent mechanical properties, the method comprising: a step of producing a polyamide-imide polymer solution by polymerizing an aromatic diamine compound, an aromatic dianhydride compound, and a dicarbonyl compound; a step of producing a gel sheet by extruding, casting and drying the polymer solution; and a step of producing a polyamide-imide film by heat-treating the gel sheet, wherein the viscosity of the polymer solution is 100,000 to 500,000 cps, and the polyamide-imide film has a yellowness index of 5 or lower, a haze of 2% or lower, a transmittance of 85% or above and a modulus of 5.0 GPa or above, at a thickness of 20 μm to 75 μm.

A modified bismaleimide resin, a method for preparing the same, a prepreg, a copper clad laminate, and a printed circuit board are provided. The modified bismaleimide resin is formed by a reaction between a diamine compound having a nonpolar backbone structure and maleic anhydride, and a molecular structure thereof contains a greater amount of non-polar and hydrophobic groups.

A resin composition of the present invention contains: a maleimide compound (A) having a transmittance of 5% or more at a wavelength of 405 nm (h-line); a particular carboxylic acid containing compound (B); and a photo initiator (C) having an absorbance of 0.1 or more at a wavelength of 405 nm (h-line).

The present disclosure generally relates to aerogel materials and methods for producing them.

Disclosed is a novel diamine having a structure of comprising an intramolecular imide group, and further comprising aromatic cyclic groups linked by an ester group to both sides of the imide group. When the novel diamine is used as a polymerizable component for preparing a polyimide, a polyimide film having remarkably improved mechanical and thermal properties while maintaining optical properties can be provided.

Compositions of and methods for producing a modified polyimide-containing compound with an alkyl or acyl group, one method including selecting and preparing a polyimide-containing compound to undergo a Friedel-Crafts alkylation or acylation reaction; carrying out the Friedel-Crafts alkylation or acylation reaction on the polyimide-containing compound to bond an alkyl group or acyl group to a reactive site on an aromatic compound of the polyimide-containing compound; cleaving the polyimide-containing compound to produce modified monomers comprising the alkyl group or the acyl group; and using the modified monomers in a reaction to produce the modified polyimide-containing compound, wherein the alkyl group or the acyl group is present in the modified polyimide-containing compound.

The present disclosure provides a thin film material and a manufacturing method thereof. The manufacturing method of the thin film material comprises: a compound A and a first reactant reacting to form a compound B; the compound B and a second reactant reacting to form a compound C; the compound C and a third reactant reacting to form a polymer D; the polymer D reacting to obtain a mixture including a polymer F or a polymer H; and a solution including the polymer F or the polymer H forming the polymer F or the polymer H on a substrate.

An object of the present invention is to provide a film forming material for lithography that is applicable to a wet process, and is useful for forming a photoresist underlayer film excellent in heat resistance, etching resistance, embedding properties to a supporting material having difference in level, and film flatness; and the like. The problem described above can be solved by the following film forming material for lithography. A film forming material for lithography comprising: a compound having a group of formula (0A):

##STR00001##

(In formula (0A), R.sup.A is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; and R.sup.B is an alkyl group having 1 to 4 carbon atoms.); and a compound having a group of formula (0B):

##STR00002##