C08G73/1046

THICK POLYIMIDE FILM HAVING IMPROVED SURFACE QUALITY AND METHOD OF MANUFACTURING SAME
20220033597 · 2022-02-03 ·

The present invention provides a polyimide film in which a parameter A for the relationship of the viscosity (V) of a polyamic acid solution, the number average molecular weight (Mn) of polyamic acid, and the thickness (T) of a polyimide film falls within a range from 0.4 to 1.13.

POLYIMIDE, FILM COMPOSITION, AND FILM PREPARED FROM THE SAME

A polyimide, a film composition, and film prepared from the same are provided. The polyimide is a product of a reactant (a) and a reactant (b). The reactant (a) consists of a first dianhydride and a second dianhydride. The first dianhydride has a structure represented by Formula (I) and the second dianhydride has a structure represented by Formula (II)

##STR00001##

wherein R.sup.1, R.sup.2 and Ar.sup.1 are as defined in specification. The reactant (b) includes a first diamine, wherein the first diamine is

##STR00002##

and R.sup.3, R.sup.4, R.sup.5, or R.sup.6 are as defined in specification.

CHEMICALLY COMPATIBILIZED FLUOROPOLYMER BLENDS

A polymer alloy composition including: (a) a fluoropolymer selected from fluorinated ethylene propylene (FEP), perfluoroalkoxy alkane (PFA), ethylene tetra-fluoroethylene (ETFE), and a terpolymer of ethylene, tetrafluoroethylene, and hexafluoropropylene (EFEP); (b) a compatibilizing agent; and (c) a polyether imide (PEI) or polyimide (PI). Also disclosed is a method of forming a thermoplastic alloy. The polymer alloy may be used to form various extruded workpieces including, for example, a bag, film, container, filament, food package, coating (such as a coating or jacketing for a wire), powder for powder electrostatic powder coating, powder for dispersions, compression molded and various injection molded parts.

POLYARYLETHER KETONE IMIDE SULFONE ADHESIVES

Aspects of the present disclosure generally describe polyarylether ketones and methods of use. In some aspects, a composition includes one or more polymers of formulae (I), (II), or (III):

##STR00001##

POLYIMIDE RESIN, VARNISH, AND POLYIMIDE FILM

A polyimide resin includes structural unit A derived from tetracarboxylic dianhydride and structural unit B derived from diamine, wherein unit A includes at least one unit selected from the group consisting of unit (A-1) derived from a compound represented by Formula (a-1) and unit (A-2) derived from a compound represented by Formula (a-2), and unit B includes unit (B-1) derived from a compound represented by Formula (b-1) and includes unit (B-2) derived from a compound represented by Formula (b-2).

##STR00001##

wherein X represents a single bond or an oxygen atom, and Ar represents a substituted or unsubstituted arylene group.

##STR00002##

wherein Z.sup.1/Z.sup.2 represent a divalent aliphatic or aromatic group, R.sup.1/R.sup.2 represent a monovalent aromatic or aliphatic group, R.sup.3/R.sup.4 represent a monovalent aliphatic group, R.sup.5/R.sup.6 represent a monovalent aliphatic or aromatic group, m&n represent an integer of 1 or greater, and a sum of m+n represents an integer from 2-1000.

HIGHLY BRANCHED NON-CROSSLINKED AEROGEL, METHODS OF MAKING, AND USES THEREOF
20210388170 · 2021-12-16 ·

Aerogel compositions, methods for preparing the aerogel compositions, articles of manufacture that include or are made from the aerogel compositions are described and uses thereof. The aerogels include a branched polyimide matrix with little to no crosslinked polymers.

Medical film and method for producing same, medical coating composition, medical device and method for producing same

The purpose of the present invention is to provide a medical film having excellent transparency, heat resistance, and solvent resistance. This medical film is a medical film including a heat-resistant resin having a glass transition temperature measured by thermomechanical analysis TMA of 190° C. or higher wherein the medical film has a total light transmittance of 80% or higher at a thickness of 10 μm and a b* value in the L*a*b* color system of 10 or lower.

Resin composition
11199776 · 2021-12-14 · ·

The present invention provides a resin composition having a high sensitivity and serving to produce a cured film with a low water absorption rate. The resin composition includes: (a) an alkali-soluble resin and (b1) an amido-phenol compound containing a phenolic hydroxyl group in which a monovalent group as represented by the undermentioned general formula (1) is located at the ortho position and/or (b2) an aromatic amido acid compound containing a carboxy group in which a monovalent group as represented by the undermentioned general formula (2) is located at the ortho position: ##STR00001##
wherein in general formula (1), X is a monovalent organic group having an alkyl group that contains 2 to 20 carbon atoms and bonds directly to the carbonyl carbon in general formula (1) or a monovalent organic group that has —(YO).sub.n—; and in general formula (2), U is a monovalent organic group that has an alkyl group containing 2 to 20 carbon atoms and bonding directly to the amide nitrogen in general formula (2) or a monovalent organic group that has —(YO).sub.n—; wherein Y is an alkylene group containing 1 to 10 carbon atoms and n is an integer of 1 to 20.

Melt processable thermoplastic composite comprising a multimodal dielectric filler

In an embodiment, a thermoplastic composite comprises a thermoplastic polymer; and a dielectric filler having a multimodal particle size distribution; wherein a peak of a first mode of the multimodal particle size distribution is at least seven times that of a peak of a second mode of the multimodal particle size distribution; and a flow modifier.

POLYMER LAYERED HOLLOW FIBER MEMBRANE BASED ON POLY(2,5-BENZIMIDAZOLE), COPOLYMERS AND SUBSTITUTED POLYBENZIMIDAZOLE

The present invention relates to a polymer layered hollow fiber membrane based on poly(2,5-benzimidazole) (ABPBI), ABPBI copolymers and substituted polybenzimidazole (PBI) and a process for preparation thereof.