Phenolic-terminated and phenolic pendent curable polyimides with very good dielectric properties have been prepared. These materials in combination with epoxy resins and other co-curable resins are ideal for being transformed into flexible films that are ready to be laminated for example between copper foils for applications such as copper-clad laminates for a variety of electronics applications.

A polymer, a composition, and a polysiloxane-polyimide material thereof are provided. The polymer includes a first repeat unit and a second repeat unit. The first repeat unit has a structure represented by Formula (I) and the second repeat unit has a structure represented by Formula (II)

##STR00001##

wherein A.sup.1 and A.sup.3 are independently tetravalent moiety; A.sup.2 is a divalent moiety; n≥1; m≥1; R.sup.1 is independently hydrogen, C.sub.1-8 alkyl, C.sub.1-8 fluoroalkyl, C.sub.1-8 alkoxy, or C.sub.6-12 aryl; and R.sup.2 is independently hydrogen, C.sub.1-8 alkyl, C.sub.1-8 fluoroalkyl, C.sub.1-8 alkoxy, C.sub.6-12 aryl, or a reactive functional group.

Provided is a resin composition that has a low melt viscosity, and is capable of being turned into a cured product having a high heat resistance, a high adhesion and a high glass-transition temperature, though having a low permittivity and a low dielectric tangent. The resin composition is a cyclic imide resin composition containing: (a) a cyclic imide compound represented by the following formula (1),

##STR00001## (b) a cyclic imide compound represented by the following formula (2),

##STR00002##

and (c) a curing catalyst.

Provided are a thermosetting resin composition having especially good compatibility and having dielectric properties (low dielectric constant and low dielectric dissipation factor) in a high frequency range, high adhesion to conductor, excellent heat resistance, high glass transition temperature, low thermal expansion coefficient and high flame retardancy, and a prepreg, a laminate and a multilayer printed wiring board using the resin composition. Specifically, the thermosetting resin composition contains (A) a polyphenylene ether derivative having an N-substituted maleimide structure-containing group and a structural unit represented by the following general formula (I) in one molecule, (B) at least one thermosetting resin selected from the group consisting of epoxy resins, cyanate resins and maleimide compounds, and (C) a phosphorus flame retardant: ##STR00001##
wherein R.sup.1 each independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and x represents an integer of 0 to 4.

The present specification relates to a polyimide resin, a positive-type photosensitive resin composition, an insulating film and a semiconductor device.

The present invention provides a liquid crystal aligning agent composition that has excellent storage stability, can secure a high imidization rate, and can produce a liquid crystal alignment film having improved film strength together with liquid crystal alignment properties, a method for producing a liquid crystal alignment film using the same, and a liquid crystal alignment film and a liquid crystal display device using the same.

A method for purification of a biphenol dianhydride composition includes contacting the biphenol dianhydride composition with a halogenated solvent to form a solution, and isolating the purified biphenol dianhydride composition from the solution. A method of making a biphenol dianhydride composition including contacting a first solution including a biphenol tetraacid, and at least one of sodium ions, potassium ions, calcium ions, zinc ions, aluminum ions, iron ions, nickel ions, titanium ions, chromium ions, magnesium ions, manganese ions, copper ions, phosphorus ions, phosphate ions, sulfate ions, chloride ions, bromide ions, fluoride ions, nitrate ions, and nitrite ions, with a halogenated solvent to provide a second solution, heating the second solution to form the corresponding biphenol dianhydride, and isolating the purified biphenol dianhydride. The biphenol dianhydride is particularly useful for forming poly(etherimides), which can be used in a variety of articles.

Provided a polyimide compound having high heat resistance and transparency. The polyimide compound according to the present invention is characterized in that it is a reaction product of a diamine compound represented by the following general formula (1):

##STR00001## and an alicyclic tetracarboxylic acid dianhydride represented by the following general formula (2).

##STR00002##

A polyimide-based binder for power storage device having a repeated breaking energy retention ratio of 70% or more. The use of the binder enables improvement of a power storage device having a high capacity.

An object of the present invention is to more conveniently provide a copolyester for a polyester film which exhibits excellent dimensional stability and in particular excellent dimensional stability against environmental changes in, for example, temperature and humidity, and has a small film elongation percentage at 110° C. A copolyester of the present invention comprises: (A) an aromatic dicarboxylic acid component; (B) an alkylene glycol component; and (C1) a dimer acid component and/or (C2) a dimer diol component, wherein the copolyester contains, with reference to a molar number of a total dicarboxylic acid component, 0.5 to 3.5 mol % of the dimer acid component (C1) and/or 0.3 to 5.0 mol % of the dimer diol component (C2).