A hybrid crosslinked polymeric membrane and a process for fabricating the same are provided. Specifically, the hybrid crosslinked polymer membrane comprises a glassy polymer and a ladder-structured polysilsesquioxane and has a crosslinked structure. The hybrid crosslinked polymer membrane can have an excellent permeability of carbon dioxide by virtue of an increase in the free volume and enhanced plasticization resistance, chemical resistance, and durability.

The invention generally relates to shape memory films that are tri-functionally crosslinked and that comprise multiple, non-terminal, phenylethynyl moieties. In addition, the present invention relates methods of fabricating such films. Due to the improved properties of such SMPS, the SMP designer can program in to the SMP mechanical property enhancements that make the SMP suitable, among other things, for advanced sensors, high temperature actuators, responder matrix materials and heat responsive packaging.

This disclosure relates to a dry film structure that includes a carrier substrate; and a dielectric film supported by the carrier substrate. The dielectric film includes at least one dielectric polymer and low amounts of metals.

An object of the present invention is to provide: a compound containing an imide group which is not only cured under film formation conditions of inert gas as well as air and has excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but can also form an organic underlayer film with favorable adhesion to a substrate, and a material for forming an organic film containing the compound. A material for forming an organic film, including: (A) a compound for forming an organic film shown by the following general formula (1A); and (B) an organic solvent, ##STR00001## noting that in the general formula (1B), when W.sub.1 represents ##STR00002##  R.sub.1 does not represent any of ##STR00003##

A fluorinated amide compound having a specific repeating unit and a fluorinated nitrogen-containing heterocyclic ring-containing compound having a specific repeating unit.

An amide compound and a nitrogen-containing heterocyclic ring-containing compound which have a specific repeating unit and a crosslinking site represented by Formula (2):

—C≡CX.sup.1

at a molecular end.

The present disclosure relates to a polyamideimide film-forming composition, a polyamideimide film, a method of preparing a polyamideimide film-forming composition, a method of producing a polyamideimide film, and uses of a polyamideimide film-forming composition and a polyamideimide film. The polyamideimide film according to one embodiment prevents deterioration of colorless and transparent optical properties, has excellent visibility with no optical stains, has excellent heat resistance, is flexible, and has excellent bending properties.

A polyimide film according to the present invention can be effectively used as a substrate for a flexible display device without a deterioration in heat resistance even at a temperature of 350° C. or higher since a coefficient of thermal expansion (A) in the section of 100-350° C., of the polyimide film, and a coefficient of thermal expansion (B) in the section of 350-450° C., of the polyimide film, meet 0<B/A<2.

The invention generally relates to polymer nanocomposite films that possess shape memory properties at elevated temperatures. Such films can absorb microwaves, are thermally conductive, are electrically conductive and have increased mechanical strength. In addition, the present invention relates to methods of fabricating such films into 3D objects. Due to the improved properties of such films more advanced sensors and microwave shields can be constructed.

Methods for preparing mixed polyamides, polyimides and polyamideimides under hydrothermal polymerization conditions are provided. The methods are based on suitable mixtures of poly carboxylic acids, poly carboxylic dianhydrides or poly carboxylic acid chloride anhydrides and polyamines and provide routes to low cost structural polymers useful in, for example, infrastructure applications.