A particle-dispersed polyimide precursor solution contains a polyimide precursor having a unit represented by the following formula (I), particles, and a solvent, in which the particle-dispersed polyimide precursor solution satisfies both the following conditions (1) and (2),

##STR00001## (in the formula (I), A represents a tetravalent organic group, and B represents a divalent organic group represented by any of the following formulas (B1) to (B4)),

##STR00002## (in the formulas (B1) to (B4), Ar.sup.1, Ar.sup.10, and Ar.sup.11 each independently represent a trivalent aromatic group which may have a substituent, Ar.sup.2, Ar.sup.4, Ar.sup.5, Ar.sup.7 and Ar.sup.8 each independently represent a divalent aromatic group which may have a substituent, Ar.sup.3 and Ar.sup.6 each independently represent a tetravalent aromatic group which may have a substituent or a group represented by the following formula (II), Ar.sup.9 represents a divalent aromatic group which may have a substituent or a group represented by the following formula (III), X.sup.1 to X.sup.7 each independently represent NRa, O, or S, Ra represents a hydrogen atom, an alkyl group which may have a substituent, or an aryl group, and * represents a bonding site with an adjacent linking group), and

##STR00003## (in the formulas (II) and (III), Ar.sup.12 and Ar.sup.13 each independently represent a trivalent aromatic group which may have a substituent, Ar.sup.14 and Ar.sup.15 each independently represent a divalent aromatic group which may have a substituent, Y and Z each independently represent O, S, S(═O).sub.2, or CRbRc, Rb and Rc each independently represent a hydrogen atom, an alkyl group which may have a substituent, or an aryl group, and * represents a bonding site with an adjacent linking group),

Condition (1): a total content of the groups represented by the formulas (B1) to (B4) is 1% by mass or more and 40% by mass or less with respect to a total amount of the polyimide precursor, and

Condition (2): a content of the particles is 5% by mass or more and 90% by mass or less with respect to a total content of the polyimide precursor and the particles.

Disclosed in the present disclosure are an ultra-high modulus and high-transmittance polyimide thin film, and a preparation method and application therefor. The ultra-high modulus and high-transmittance polyimide thin film is prepared by means of mixing and dissolving polydiamine and polydianhydride in a solvent, adding an end-capping reagent, and performing polymerization reaction and imidization. The ultra-high modulus and high-transmittance polyimide thin film has an ultra-high modulus and high transmittance, and is applicable to fields such as flexible photoelectricity and aerospace, especially to a structural member, a reinforcement layer or a substrate of flexible display and transparent display.

The present invention is a polymer having a polyamide structural unit, a polyamide-imide structural unit, or a polyimide structural unit, selected from a polyamide, a polyamide-imide, a polyimide, a polyimide precursor, a polybenzoxazole, and a polybenzoxazole precursor, including a reaction product of a diamine containing at least one of a diamine shown by the following general formula (1) and a diamine shown by the following general formula (2), together with at least one of a tetracarboxylic dianhydride shown by the following general formula (3) as well as a dicarboxylic acid and a dicarboxylic halide shown by the following general formula (4). This provides a polymer which is soluble in a safe organic solvent used widely, and is usable as a base resin of a positive photosensitive resin composition that is soluble in an aqueous alkaline solution and capable of forming a fine pattern to give higher resolution. ##STR00001##

This disclosure relates to a polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib),

##STR00001##

(b) at least one diamine of Structure (II),

##STR00002##

(c) at least one tetracarboxylic acid dianhydride, and optionally (d) at least one compound containing a first functional group reactive with an amine or an anhydride and at least a second functional group selected from the group consisting of a substituted or unsubstituted alkenyl group and a substituted or unsubstituted alkynyl group. Each variable in the above formulas is defined in the specification.

Provided are a polyimide precursor, a polyimide precursor solution, a polyimide film, a method for preparing the same, and a use thereof. According to an exemplary embodiment of the present invention, a polyimide film having excellent thermal resistance and satisfying transparency and a low coefficient of linear thermal expansion may be provided, and thus, may be usefully applied in a flexible display field requiring high dimensional stability and the like.

A polyimide component being transparent includes a dianhydride monomer and a diamine monomer. The dianhydride monomer has an asymmetric structure. The dianhydride monomer has at least one first polar group and at least one side chain group. The first polar group is an ester group. A molecular structural formula of the side chain group is:

##STR00001##

The diamine monomer has an asymmetric structure and at least one second polar group. The second polar group is at least one of a nitrogen heterocycle and an ether group. The polyimide component is polymerized by the dianhydride monomer and the diamine monomer. The disclosure also relates to a polyimide film and a polyimide copper clad laminate.

Embodiments of the present disclosure generally describe ethano-Tröger's base-amine monomers, ethano-Tröger's base polyimides of intrinsic microporosity, membranes based on ethano-Tröger's base polyimides of intrinsic microporosity, methods of making ethano-Tröger's base-amine monomers, methods of making ethano-Tröger's base polyimides of intrinsic microporosity prepared from ethano-Tröger's base-amine monomers, methods of separating chemical species, and the like.

The present invention relates to a crosslinking agent compound in which a terminal crosslinkable functional group is capped with a silane-based protecting group, a photosensitive composition including the same, and a photosensitive material using the same.

A method of manufacturing a bump structure includes forming a passivation layer over a substrate. A metal pad structure is formed over the substrate, wherein the passivation layer surrounds the metal pad structure. A polyimide layer including a polyimide is formed over the passivation layer and the metal pad structure. A metal bump is formed over the metal pad structure and the polyimide layer. The polyimide is a reaction product of a dianhydride and a diamine, wherein at least one of the dianhydride and the diamine comprises one selected from the group consisting of a cycloalkane, a fused ring, a bicycloalkane, a tricycloalkane, a bicycloalkene, a tricycloalkene, a spiroalkane, and a heterocyclic ring.

A liquid crystal alignment agent and a preparation method thereof, a liquid crystal alignment film and a preparation method thereof, and a liquid crystal cell are provided. A piperazine monomer is added to a liquid crystal alignment agent, a bulk resistance value and a surface resistance value of a liquid crystal alignment agent material can be reduced, and the ability of the liquid crystal alignment agent material to release residual charges can be effectively improved, thereby increasing the reliability and stability of an electronic product. The liquid crystal cell using the liquid crystal alignment agent has advantages such as high voltage holding ratio (VHR) and low residual voltage.