A remoldable bismaleimide resin and application thereof. The preparation method includes blending 2-allylphenyl glycidyl ether and terephthalic acid in acetonitrile, carrying out an esterification reaction under the condition of quaternary ammonium salt as a catalyst to obtain bis(3-(2-allylphenoxy)-2-hydroxypropyl) terephthalate containing a reversible dynamic group; then uniformly mixing bis(3-(2-allylphenoxy)-2-hydroxypropyl) terephthalate and bismaleimide, curing to obtain the re-moldable bismaleimide resin. The prepared re-moldable bismaleimide resin not only has excellent heat resistance and mechanical properties, but also can be remolded under hot pressing conditions. The preparation method of the re-moldable bismaleimide resin has the advantages of wide raw material sources and simple process, and has a wide application prospect in the fields of aerospace, transportation, electronic information, new energy, insulated electrical industry and the like.

A remoldable bismaleimide resin and application thereof. The preparation method includes blending 2-allylphenyl glycidyl ether and terephthalic acid in acetonitrile, carrying out an esterification reaction under the condition of quaternary ammonium salt as a catalyst to obtain bis(3-(2-allylphenoxy)-2-hydroxypropyl) terephthalate containing a reversible dynamic group; then uniformly mixing bis(3-(2-allylphenoxy)-2-hydroxypropyl) terephthalate and bismaleimide, curing to obtain the re-moldable bismaleimide resin. The prepared re-moldable bismaleimide resin not only has excellent heat resistance and mechanical properties, but also can be remolded under hot pressing conditions. The preparation method of the re-moldable bismaleimide resin has the advantages of wide raw material sources and simple process, and has a wide application prospect in the fields of aerospace, transportation, electronic information, new energy, insulated electrical industry and the like.

A low-dielectric heat dissipation film composition contains: (A) a maleimide resin composition containing (A1) a maleimide resin containing at least two or more maleimide groups per molecule and (A2) a polymerization initiator; and (B) boron nitride particles. The component (A1) has a maleimide equivalent of not more than 0.1 mol/100 g, and a cured material of the component (A) has a relative dielectric constant of 3.5 or less at a frequency of 10 GHz. Thus, the present invention provides a film composition for forming a film having low dielectric constant and high heat dissipation.

A low-dielectric heat dissipation film composition contains: (A) a maleimide resin composition containing (A1) a maleimide resin containing at least two or more maleimide groups per molecule and (A2) a polymerization initiator; and (B) boron nitride particles. The component (A1) has a maleimide equivalent of not more than 0.1 mol/100 g, and a cured material of the component (A) has a relative dielectric constant of 3.5 or less at a frequency of 10 GHz. Thus, the present invention provides a film composition for forming a film having low dielectric constant and high heat dissipation.

A polyimide precursor solution includes an aqueous solvent including water, a polyimide precursor, resin particles, and an ionization agent X having a boiling point of 100° C. or more and 130° C. or less and an ionization agent Y having a boiling point of 250° C. or more and 300° C. or less.

Disclosed are a polyamide resin composition and a molded article manufactured using the same. The molded article may have excellent mechanical strength, deformation resistance and light resistance, and may be suitable for use without coating. The polyamide resin composition includes a polyamide resin, an auxiliary resin (e.g., an acrylonitrile-butadiene-styrene copolymer), a filler (e.g., glass fibers and glass beads), and a compatibilizer (e.g., copolymer including maleimide).

Disclosed are a polyamide resin composition and a molded article manufactured using the same. The molded article may have excellent mechanical strength, deformation resistance and light resistance, and may be suitable for use without coating. The polyamide resin composition includes a polyamide resin, an auxiliary resin (e.g., an acrylonitrile-butadiene-styrene copolymer), a filler (e.g., glass fibers and glass beads), and a compatibilizer (e.g., copolymer including maleimide).

The invention discloses a remoldable shape memory bismaleimide resin and its application. The preparation method includes blending 2-allylphenyl glycidyl ether and adipic acid in acetonitrile, carrying out an esterification reaction under the condition of quaternary ammonium salt as a catalyst to obtain bis(3-(2-allylphenoxy)-2-hydroxypropyl)adipate containing a reversible dynamic group; then uniformly mixing bis(3-(2-allylphenoxy)-2-hydroxypropyl)adipate and bismaleimide, curing to obtain the remoldable shape memory bismaleimide resin. The prepared remoldable shape memory bismaleimide resin is not only excellent heat resistance and mechanical properties, but also can be remolded under hot pressing conditions. The preparation method of the remoldable shape memory bismaleimide resin has the advantages of wide raw material sources and simple process, and has a wide application prospect in the fields of aerospace, transportation, electronic information, new energy, insulated electrical industry and the like.

The invention discloses a remoldable shape memory bismaleimide resin and its application. The preparation method includes blending 2-allylphenyl glycidyl ether and adipic acid in acetonitrile, carrying out an esterification reaction under the condition of quaternary ammonium salt as a catalyst to obtain bis(3-(2-allylphenoxy)-2-hydroxypropyl)adipate containing a reversible dynamic group; then uniformly mixing bis(3-(2-allylphenoxy)-2-hydroxypropyl)adipate and bismaleimide, curing to obtain the remoldable shape memory bismaleimide resin. The prepared remoldable shape memory bismaleimide resin is not only excellent heat resistance and mechanical properties, but also can be remolded under hot pressing conditions. The preparation method of the remoldable shape memory bismaleimide resin has the advantages of wide raw material sources and simple process, and has a wide application prospect in the fields of aerospace, transportation, electronic information, new energy, insulated electrical industry and the like.

The compound (A) is represented by formula (1).

R.sub.1O—R.sub.2—OR.sub.1   (1)

(In formula (1), each R.sub.1 independently represents a group represented by formula (2), or a hydrogen atom, and R.sub.2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms, provided that at least one R.sub.1 is a group represented by formula (2).)

##STR00001##

(In formula (2), -* represents a bonding hand.)