A coating composition comprising a resin material comprising polyester imide polymer one or more titanate material; and one or more OH reactive cross linking material.

The present disclosure provides a polyimide thin film, a preparing method thereof, and a display device. Specifically, a polyamic acid containing an ester group structure is prepared. The polyamic acid is prepared by a two-step process. A dianhydride containing an ester group structure is introduced into a polyimide to increase the content of benzene ring. Moreover, the introduction of ester groups is conducive to flexibility, which not only improves its heat resistance component, but, by introducing components with longer flexible chains, effectively destroys the regularity of macromolecules, thereby improving the flexibility of the material. Moreover, the introduction of rigid aromatic ring groups facilitates the realization of heat resistance. The ester bond is introduced into the dianhydride through the esterification, and then participates in the preparing of the polyimide material.

The present disclosure provides a polyimide thin film, a preparing method thereof, and a display device. Specifically, a polyamic acid containing an ester group structure is prepared. The polyamic acid is prepared by a two-step process. A dianhydride containing an ester group structure is introduced into a polyimide to increase the content of benzene ring. Moreover, the introduction of ester groups is conducive to flexibility, which not only improves its heat resistance component, but, by introducing components with longer flexible chains, effectively destroys the regularity of macromolecules, thereby improving the flexibility of the material. Moreover, the introduction of rigid aromatic ring groups facilitates the realization of heat resistance. The ester bond is introduced into the dianhydride through the esterification, and then participates in the preparing of the polyimide material.

The present invention provides a separation membrane suitable for separating water from a liquid mixture containing an alcohol and water, the separation membrane being capable of reducing a decrease in separation performance regardless of long-term use. A separation membrane 10 of the present invention includes a polyimide having a structural unit X represented by the following formula (1) and a structural unit Y represented by following formula (2).

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A.sup.1 is a linking group including no arylene group in a main chain and having a solubility parameter, in accordance with a Fedors method, of more than 5.0 (cal/cm.sup.3).sup.½. A.sup.2 is a tetravalent organic group including an arylene group.

A polyurethane foam composition comprising: (a) an isocyanate compound; (b) one or more isocyanate reactive compounds at least one of the isocyanate reactive compounds comprises an aromatic polyester polyol compound comprising an imide moiety wherein the aromatic polyester polyol is the reaction product of: (i) a cyclic anhydride compound; (ii) a phthalic acid based compound, (iii) a primary amine compound, (iv) an aliphatic diol compound; (v) optionally, a high functionality, low molecular weight polyether polyol compound; (vi) optionally, a hydrophobic compound; and wherein the weight ratio of Component (i) to Component (ii) is from 1:24 to 24:1; and wherein the aromatic polyester polyol is liquid at 25° C. and comprises a hydroxy value ranging from about 30 to about 600; and (c) a blowing agent.

A resin composition contains a polyimide resin and an ester-based resin. The ester-based resin is polycarbonate or polyarylate. The polyimide contains a structural unit represented by general formula (1). In general formula (1), X is a divalent organic group shown in group (I), and Y is a divalent group that contains one or more selected from the group consisting of a fluorine group, a trifluoromethyl group, a sulfonic group, a fluorene structure and an alicyclic structure. Each of R.sup.1 and R.sup.2 is a fluorine atom, an alkyl group having 1 to 20 carbon atoms, or a fluoroalkyl group having 1 to 20 carbon atoms, m is an integer of 1 to 4, and n is an integer of 0 to 4.

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The present disclosure relates to a polyimide film-forming composition, a method of preparing the same, and a use thereof. According to the present invention, there is provided a polyimide film that has excellent isotropic property and scattering resistance, is flexible, and has excellent bendability without deterioration of colorless and transparent optical properties. The polyimide film may be usefully used in various flexible display devices.

When making parts by additive manufacturing, particularly by fused filament fabrication, it is sometimes necessary to include a removable support during part fabrication due to the shape of the part. An overhang, for instance, may be fabricated using a support structure, which is subsequently eliminated following polymer matrix consolidation. Elimination of a removable support following part fabrication may be problematic in some instances. Polymer filaments suitable for forming removable supports during additive manufacturing may comprise at least one imide polymer having at least partial solubility in aqueous fluids. Imide polymers may include, for example, polyimides and polyesterimides. Additive manufacturing processes may comprise forming a supported part by depositing a build material and a removable support comprising an imide polymer, wherein at least a portion of the build material is deposited upon the removable support. An unsupported part may be formed following exposure of the supported part to an aqueous fluid.

Compositions including a polyimide and one or more thermally conductive fillers, and compaction rollers for an automated fiber placement machine incorporating the compositions are provided. The polyimide may be a polymeric reaction product of a dianhydride and one or more diamines. The one or more diamines may include a fluorine-containing alkyl ether diamine. The one or more thermally conductive fillers may include one or more of a carbon-based filler, boron nitride, a metal, or combinations thereof. The compositions may have a thermal conductivity of from about 0.2 to about 50 Watts per meter Kelvin (Wm.sup.−1 K.sup.−1).

A photosensitive resin composition comprising: (A) a polyimide precursor having a polymerizable unsaturated bond; (B) one or more selected from compounds represented by any of the following formulas (1) to (4); and (C) a photopolymerization initiator represented by the following formula (11), wherein in the formulas (1) to (4), R.sup.1, R.sup.2, and R.sup.8 are independently an alkyl group including 1 to 4 carbon atoms, and R.sup.3 to R.sup.7 are independently a hydrogen atom, or an alkyl group including 1 to 4 carbon atoms; s is an integer of 0 to 8; t is an integer of 0 to 4; r is an integer of 0 to 4; and in the formula (11), R.sup.11 is an alkyl group including 1 to 12 carbon atoms, an alkoxy group including 1 to 12 carbon atoms, a cycloalkyl group including 4 to 10 carbon atoms, a phenyl group, or a tolyl group; R.sup.12 is an alkyl group including 1 to 12 carbon atoms, a cycloalkyl group including 4 to 10 carbon atoms, a phenyl group, or a tolyl group; and R.sup.13 is a substituted or unsubstituted benzoyl group, a substituted or unsubstituted fluorenyl group, or a substituted or unsubstituted carbazolyl group.

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