The present invention provides an adhesion promoting composition, or a sulfide compound-containing polysiloxane composition, having good adhesion, capable of forming a laminate having high adhesion between a metal layer and a polysiloxane layer. The adhesion promoting composition according to the present invention is an adhesion promoting composition applied to between a metal layer and a polysiloxane layer, and comprises a sulfide compound having a certain structure and a solvent. The sulfide compound-containing polysiloxane composition according to the present invention comprises a sulfide compound having a certain structure, a polysiloxane, and a solvent.

The present invention provides a bio-electrode composition including a silsesquioxane bonded to an N-carbonyl sulfonamide salt, wherein the N-carbonyl sulfonamide salt is shown by the following general formula (1): ##STR00001##
wherein R.sup.1 represents a linear, branched, or cyclic alkylene group having 1 to 20 carbon atoms that may have an aromatic group, an ether group, or an ester group, or an arylene group having 6 to 10 carbon atoms; Rf represents a linear, branched, or cyclic alkyl group having 1 to 4 carbon atoms containing at least one fluorine atom; M.sup.+ is an ion selected from a lithium ion, a sodium ion, a potassium ion, and a silver ion. This can form a living body contact layer for a bio-electrode that is excellent in electric conductivity and biocompatibility, light-weight, manufacturable at low cost, and free from large lowering of the electric conductivity even though it is wetted with water or dried.

There is provided herein a process for the synthesis of sulfonyl silanes. There is also provided herein various sulfenylated and sulfonylated silicon-containing compounds made by the process.

The present disclosure relates to a UV- and heat-curable ladder-like polysilsesquioxane copolymer and a method for preparing the same. Since a controlled functionality can be provided only on a desired region via a thiol-ene click reaction without an additional additive, an insulating layer having a low dielectric constant and a microcircuit pattern can be formed without an additional etching process.

The present disclosure relates to a UV- and heat-curable ladder-like polysilsesquioxane copolymer and a method for preparing the same. Since a controlled functionality can be provided only on a desired region via a thiol-ene click reaction without an additional additive, an insulating layer having a low dielectric constant and a microcircuit pattern can be formed without an additional etching process.

The present invention relates to a coated insulated wire having improved heat dissipation properties, insulation properties, flame retardancy, and lightweight properties; and a method of manufacturing the same.

Photocurable adhesion-promoting compositions containing organic titanates and/or organic zirconates and partially reacted alkoxysilanes and the use of the photocurable adhesion-promoting compositions to provide adhesion between metal substrates and an overlying radiation-cured sealant are disclosed.

A composition contains 45-65 weight-percent (wt %) of a linear polyorganosiloxane with terminal vinyl functionality, 39 wt % to less than 50 wt % alkenyl-free polyorganosiloxane resin comprising R.sub.3SiO.sub.1/2 and SiO.sub.4/2 siloxane units at an average molar ratio of greater than zero to 10; where R is independently in each occurrence selected from a group consisting of alkyl groups containing from one to 10 carbon atoms; 0.5-15 wt % mercapto-functional linear polyorganosiloxane crosslinker; 0.01-0.1 wt % radical stabilizer; 0.01-3 wt % thiol-ene photopolymerization initiator; 0-10 wt % fumed silica; and 0-5 wt % polydimethylsiloxane; wherein weight-percent values are relative to composition weight, the composition has a molar ratio of SiH/vinyl functional groups that is greater than 0.3 and at the same time less than 0.8 and wherein the composition is free of alkenyl functional polyorganosiloxane resin, free of alkoxysilyl containing components, and free of polysiloxane comprising R.sup.SHSiO.sub.3/2 siloxane units, where R.sup.SH is a mercapto-group containing hydrocarbyl.

A composition contains 45-65 weight-percent (wt %) of a linear polyorganosiloxane with terminal vinyl functionality, 39 wt % to less than 50 wt % alkenyl-free polyorganosiloxane resin comprising R.sub.3SiO.sub.1/2 and SiO.sub.4/2 siloxane units at an average molar ratio of greater than zero to 10; where R is independently in each occurrence selected from a group consisting of alkyl groups containing from one to 10 carbon atoms; 0.5-15 wt % mercapto-functional linear polyorganosiloxane crosslinker; 0.01-0.1 wt % radical stabilizer; 0.01-3 wt % thiol-ene photopolymerization initiator; 0-10 wt % fumed silica; and 0-5 wt % polydimethylsiloxane; wherein weight-percent values are relative to composition weight, the composition has a molar ratio of SiH/vinyl functional groups that is greater than 0.3 and at the same time less than 0.8 and wherein the composition is free of alkenyl functional polyorganosiloxane resin, free of alkoxysilyl containing components, and free of polysiloxane comprising R.sup.SHSiO.sub.3/2 siloxane units, where R.sup.SH is a mercapto-group containing hydrocarbyl.

Provided is a radiation curable silicone composition suitable for additive manufacturing processes, a process for making such compositions, and a method for forming an article from such compositions. The compositions exhibit fast radiation curing over a variety of wavelengths. The articles formed from the compositions exhibit a good balance of properties including flexibility and mechanical strength. In embodiments, the organo-silicone composition comprises at least one polymerization-effective silicone containing polymer bearing unsaturated hydrocarbon group, at least one mercapto functional silicone resin, and a photo initiator.