Dual-sided adhesive articles include a first crosslinked pressure sensitive adhesive layer with a first major surface and a second major surface, a second siloxane-based pressure sensitive adhesive layer with a first major surface and a second major surface, such that the first major surface of the second siloxane-based pressure sensitive adhesive layer is in contact with the second major surface of the first crosslinked pressure sensitive adhesive layer. The articles also include a release liner having a microstructured surface with an array of microstructures, where the microstructured surface is in contact with the second major surface of the second siloxane-based pressure sensitive adhesive layer. The microstructures of the microstructured surface of the second siloxane-based pressure sensitive adhesive layer are unstable when not in contact with the microstructured release liner, and disappear over time when in contact with a substrate.

Dual-sided adhesive articles include a first crosslinked pressure sensitive adhesive layer with a first major surface and a second major surface, a second siloxane-based pressure sensitive adhesive layer with a first major surface and a second major surface, such that the first major surface of the second siloxane-based pressure sensitive adhesive layer is in contact with the second major surface of the first crosslinked pressure sensitive adhesive layer. The articles also include a release liner having a microstructured surface with an array of microstructures, where the microstructured surface is in contact with the second major surface of the second siloxane-based pressure sensitive adhesive layer. The microstructures of the microstructured surface of the second siloxane-based pressure sensitive adhesive layer are unstable when not in contact with the microstructured release liner, and disappear over time when in contact with a substrate.

Transfer tapes include a releasing substrate and an adhesive layer adjacent to the surface of the releasing substrate. The adhesive layer includes a at least one siloxane-based copolymer, and at least one siloxane tackifying resin. The adhesive layer is a pressure sensitive adhesive at room temperature and is convertible into a ceramic-like layer by bake-out at a temperature of from 100-500°.

The present disclosure discloses an LED filament, comprising a plurality of LED chips; at least two electrodes, each of the at least two electrodes is connected to at least one of the plurality of LED chips; and a light conversion layer comprising a top layer and a base layer, coated on at least two sides of the at least two electrodes, and a portion of the at least two electrodes is exposed by the light conversion layer, where the top layer and the base layer are located at two sides of the plurality of LED chips, respectively, wherein the base layer comprising an organosilicon-modified polyimide, a thermal curing agent and fluorescent powders. The present disclosure further discloses an LED light bulb. The base layer of the present disclosure has superior transmittance, heat resistance and mechanical strength, and is suitable for producing a flexible LED filament.

The present disclosure generally relates to adhesive compositions and articles including at least one of polydiorganosiloxane polyoxamide copolymer, silicone polyurea block copolymer, and/or an addition cure silicone, a silicate tackifying resin, and inorganic particle filler. The filler is typically fumed silica. Some embodiments of the adhesive composition include at least one of a polydiorganosiloxane polyoxamide copolymer, a silicate tackifying resin in an amount of between about 10 wt % and about 70 wt %, and inorganic particle filler in between about 0.1 wt % and about 20 wt %; a silicone polyurea block copolymer, a silicate tackifying resin in an amount of between about 10 wt % and about 70 wt %, and inorganic particle filler in an amount between about 0.1 wt % and about 20 wt %; and an addition cure silicone, a silicate tackifying resin in an amount of between about 10 wt % and about 70 wt %, and inorganic particle filler in an amount between about 0.1 wt % and about 20 wt %.

This application relates to a coating layer composition and a coating layer formed using the coating layer composition. The coating layer composition includes a heat-resistant binder, a hydroxy group-containing polyimide particle, a silane cross-linking agent, and a solvent. The hydroxy group-containing polyimide particle and the functional group-containing silane cross-linking agent form a core-shell structured organic particle in which a core portion is derived from the hydroxy group-containing polyimide particles and a shell portion that is derived from the functional group-containing silane cross-linking agent. The shell portion is on the surface of the core portion in the core-shell structured organic particle. The application also relates to a separator for a rechargeable lithium battery and a rechargeable lithium battery including the separator having a coating layer formed using the coating layer composition.

Low molecular weight silicone copolymers prepared by reacting an oxamido ester-terminated silicone with a polyetheramine and a primary or secondary amine are useful in treating fabrics to obtain a soft hand and also hydrophilicity, and can be prepared without the use of highly toxic reagents.

Low molecular weight silicone copolymers prepared by reacting an oxamido ester-terminated silicone with a polyetheramine and a primary or secondary amine are useful in treating fabrics to obtain a soft hand and also hydrophilicity, and can be prepared without the use of highly toxic reagents.

Blend compositions include at least one polydiorganosiloxane polyoxamide copolymer, and at least 70% by weight of at least one silicone tackifying resin. The blend composition is non-tacky at room temperature up to a temperature of at least 100° C. The polydiorganosiloxane polyoxamide copolymer can be a linear or branched copolymer. The blend compositions provide solid, non-powdery, and non-tacky delivery vehicles for silicone tackifying resin.

A resin composition contains at least (a) a polyimide resin having a specific structure and (b) a crosslinker including a fluorene group. The resin composition is capable of bonding an electronic circuit formation substrate or a semiconductor circuit formation substrate and a support substrate together. The resin composition has excellent heat resistance during bonding of an electronic circuit formation substrate or semiconductor circuit formation substrate having a thickness of 1 μm or more and 100 μm or less. The resin composition has steady adhesive force through the process of manufacturing an electronic component, a semiconductor device or the like, and can be peeled off under mild conditions at room temperature after the manufacturing process. An adhesive, a resin layer, a laminated film, and a processed wafer containing the resin composition, as well as a method for manufacturing an electronic component or a semiconductor device using these are also disclosed.