A wafer processing laminate comprising a support, a temporary adhesive material layer laminated on the support, and a wafer stacked on the temporary adhesive material layer, the wafer having a front surface on which a circuit is formed and a back surface to be processed, the temporary adhesive material layer comprising a first temporary adhesive layer composed of a thermoplastic resin layer (A) laminated on the front surface of the wafer and a second temporary adhesive layer composed of a thermosetting resin layer (B) laminated on the first temporary adhesive layer, the thermoplastic resin layer (A) being soluble in a cleaning liquid (D) after processing the wafer, the thermosetting resin layer (B) being insoluble in the cleaning liquid (D) after heat curing and capable of absorbing the cleaning liquid (D) such that the cleaning liquid (D) permeates into the layer (B). This wafer processing laminate allows a wide selection of materials, facilitates separation and collection of a processed wafer, meets requirements on various processes, and can increase productivity of thin wafers.

A wafer processing laminate comprising a support, a temporary adhesive material layer laminated on the support, and a wafer stacked on the temporary adhesive material layer, the wafer having a front surface on which a circuit is formed and a back surface to be processed, the temporary adhesive material layer comprising a first temporary adhesive layer composed of a thermoplastic resin layer (A) laminated on the front surface of the wafer and a second temporary adhesive layer composed of a thermosetting resin layer (B) laminated on the first temporary adhesive layer, the thermoplastic resin layer (A) being soluble in a cleaning liquid (D) after processing the wafer, the thermosetting resin layer (B) being insoluble in the cleaning liquid (D) after heat curing and capable of absorbing the cleaning liquid (D) such that the cleaning liquid (D) permeates into the layer (B). This wafer processing laminate allows a wide selection of materials, facilitates separation and collection of a processed wafer, meets requirements on various processes, and can increase productivity of thin wafers.

Polymer compositions containing a polyamide polymer and a high molecular weight organopolysiloxane copolymer containing amide, urethane, urea, or thiourea groups exhibit high tensile strength but are soft elastomeric thermoplastics.

Low molecular weight silicone copolymers prepared by reacting an oxamido ester-terminated silicone with a polyetheramine and a primary or secondary amine are useful in treating fabrics to obtain a soft hand and also hydrophilicity, and can be prepared without the use of highly toxic reagents.

Low molecular weight silicone copolymers prepared by reacting an oxamido ester-terminated silicone with a polyetheramine and a primary or secondary amine are useful in treating fabrics to obtain a soft hand and also hydrophilicity, and can be prepared without the use of highly toxic reagents.

The present disclosure discloses an organosilicon-modified polyimide resin composition, comprising an organosilicon-modified polyimide and a thermal curing agent, wherein the organosilicon-modified polyimide comprises a repeating unit represented by the following general formula (I): ##STR00001##
wherein Ar.sup.1 is a tetra-valent organic group having a benzene ring or an alicyclic hydrocarbon structure, Ar.sup.2 is a di-valent organic group, R is each independently methyl or phenyl, and the thermal curing agent is selected from the group consisting of epoxy resin, isocyanate and bisoxazoline compounds. The resultant organosilicon-modified polyimide resin composition of the present disclosure has superior transmittance, heat resistance and mechanical strength, and is suitable for producing a flexible LED filament.

Since this laminated body having a silicone rubber and, at least in a section of a surface thereof, a layer of a cured product of a silicone-modified-polyimide resin composition that contains, for example, components (A), (Bc), and (C) possesses elasticity and allows wiring by means of a conductive paste thereon, such a laminated body is suitable as a base material of an electronic device. The component (A) is a silicone-modified polyimide resin in formula (1)

Ee-Ff-Gg(1)

{where E is represented by formula (2); F is represented by formula (3); G is a bivalent group derived from a diamine; f+e+g=100 mol %; the molar ratio f/(e+g) is 0.9 to 1.1; and e is 1-90 assuming that the sum of e and g is 100

##STR00001##

(R.sup.A is a bivalent hydrocarbon group, R.sup.1 and R.sup.2 are alkyl groups, R.sup.3 and R.sup.4 are monovalent aliphatic hydrocarbon groups, R.sup.5 and R.sup.6 are aryl groups or the like, m is an integer of 0-20, n is an integer of 1-20, o is an integer of 0-20, and m+n+o is an integer of 1-30)

-Im-X-Im-(3)

(Im is a cyclic group containing a cyclic imide structure, and X is selected from a single bond, O, and so forth)}; the component (Bc) is a thermally degradable radical initiator; and the component (C) is a solvent.

Since this laminated body having a silicone rubber and, at least in a section of a surface thereof, a layer of a cured product of a silicone-modified-polyimide resin composition that contains, for example, components (A), (Bc), and (C) possesses elasticity and allows wiring by means of a conductive paste thereon, such a laminated body is suitable as a base material of an electronic device. The component (A) is a silicone-modified polyimide resin in formula (1)

Ee-Ff-Gg(1)

{where E is represented by formula (2); F is represented by formula (3); G is a bivalent group derived from a diamine; f+e+g=100 mol %; the molar ratio f/(e+g) is 0.9 to 1.1; and e is 1-90 assuming that the sum of e and g is 100

##STR00001##

(R.sup.A is a bivalent hydrocarbon group, R.sup.1 and R.sup.2 are alkyl groups, R.sup.3 and R.sup.4 are monovalent aliphatic hydrocarbon groups, R.sup.5 and R.sup.6 are aryl groups or the like, m is an integer of 0-20, n is an integer of 1-20, o is an integer of 0-20, and m+n+o is an integer of 1-30)

-Im-X-Im-(3)

(Im is a cyclic group containing a cyclic imide structure, and X is selected from a single bond, O, and so forth)}; the component (Bc) is a thermally degradable radical initiator; and the component (C) is a solvent.

A composition is provided that includes an elastomer and an additive. The additive stabilizes the elastomer, although it may be useful for an alternate or additional purpose. The elastomer can have a moiety according to the general formula: A-B-A or B-A-B. Each A independently comprises a polysiloxane moiety having at least two siloxy (SiO) groups. Each B independently comprises a moiety, or a precursor thereof, having at least one carboxyl group. B is bonded to a silicon atom in A. The elastomer may comprise the reaction product of a reaction of: a first component having at least one reactive group; a second component having at least one reactive group; and a third component having at least two reactive groups reactive with the reactive groups of the first and second components. In addition, a cosmetic composition is provided that includes the elastomer, the additive, and at least one cosmetic component.

The present invention relates to a polymer comprising a repeating group having the structure of formula (I)

##STR00001##

wherein R, R.sup.1, R.sup.2, R.sup.3, R.sup.4, X, and s are as described herein and salt thereof. Also disclosed is a process of synthesizing such polymers.