By using this organosilane compound represented by formula (1), a surface treatment agent that contains said (hydrolyzable) organosilane compound and/or a partial (hydrolysis) condensate thereof can form a cured film which exhibits excellent lipophilic properties and has a refractive index similar to the refractive index of sebum.

##STR00001##

(A is any one of C(O)OR.sup.1, C(O)NR.sup.1.sub.2, C(O)SR.sup.1 and P(O)(OR.sup.1).sub.2; R.sup.1 is a hydrogen atom, an alkyl group, an aryl group or an aralkyl group; Y is a divalent organic group; R is an alkyl group or a phenyl group; Xis a hydroxyl group or a hydrolyzable group; and n is 1-3.)

The present invention is a resin composition including: (A) an epoxy resin; (B) an epoxy compound shown by the following formula (1) and/or formula (2); (C) an epoxy compound shown by the following formula (3); (D) a phenolic curing agent; and (E) a curing accelerator, ##STR00001##
wherein A represents a single bond or a divalent organic group selected from the following formulae. ##STR00002## This provides a resin composition with improved strength, reduced warpage, and excellent adhesion, a resin film with improved strength formed from the composition, a semiconductor laminate containing the cured material of the resin film and a method for manufacturing the same, as well as a semiconductor device into which the semiconductor laminate is diced and a method for manufacturing the same.

The present invention is a resin composition including: (A) an epoxy resin; (B) an epoxy compound shown by the following formula (1) and/or formula (2); (C) an epoxy compound shown by the following formula (3); (D) a phenolic curing agent; and (E) a curing accelerator, ##STR00001##
wherein A represents a single bond or a divalent organic group selected from the following formulae. ##STR00002## This provides a resin composition with improved strength, reduced warpage, and excellent adhesion, a resin film with improved strength formed from the composition, a semiconductor laminate containing the cured material of the resin film and a method for manufacturing the same, as well as a semiconductor device into which the semiconductor laminate is diced and a method for manufacturing the same.

A resin composition including the following (A) to (D): (A) a resin containing epoxy groups in the range of 140 to 5000 g/eq as an epoxy equivalent; (B) a phenolic curing agent; (C) a curing accelerator; and (D) at least one compound selected among what is expressed by the following formulae (0-1) to (0-5). This provides a resin composition having small warpage and excellent adhesive force, a high adhesion resin composition film made into a film form from the composition, a semiconductor laminate having a cured product of the film and its production method, a semiconductor device obtained by dicing the semiconductor laminate into individual chips and its production method.

##STR00001##

To provide a positive type photosensitive composition capable of forming a cured film of a thick film with high heat resistance. A positive type photosensitive siloxane composition comprising a polysiloxane having a specific structure, a silanol condensation catalyst, a diazonaphtho-quinone derivative and a solvent.

A photosensitive resin composition comprising (A) a silicone skeleton-containing polymer, (B) a photoacid generator, and (C) a peroxide is coated to form a photosensitive resin coating which is unsusceptible to plastic deformation while maintaining flexibility. A pattern forming process using the composition is also provided.

A bridged silicone resin is disclosed which has the general formula (1): (HSiO.sub.3/2).sub.x(RSiO.sub.3/2).sub.y(R.sup.1SiO.sub.3/2).sub.z(SiO.sub.3/2XSiO.sub.3/2).sub.s; wherein x and s are each from >0 to <1 and 0<y+z<1 such that x+y+z+s=1; R is independently an alkyl group; R.sup.1 is independently an aryl group; and X is divalent group comprising a silarylene group or a (CH.sub.2).sub.qSiR.sup.2R.sup.3[O(SiR.sup.2R.sup.3O).sub.n]SiR.sup.2R.sup.3(CH.sub.2).sub.q group, where n is an integer from 1 to 10, each R.sup.2 and R.sup.3 is an independently selected substituted or unsubstituted hydrocarbyl group, and q and q are each independently integers selected from 0 or from 1 to 6. Various methods relating to the bridged silicone resin and end uses thereof are also disclosed.

A bridged silicone resin is disclosed which has the general formula (1): (HSiO.sub.3/2).sub.x(RSiO.sub.3/2).sub.y(R.sup.1SiO.sub.3/2).sub.z(SiO.sub.3/2XSiO.sub.3/2).sub.s; wherein x and s are each from >0 to <1 and 0<y+z<1 such that x+y+z+s=1; R is independently an alkyl group; R.sup.1 is independently an aryl group; and X is divalent group comprising a silarylene group or a (CH.sub.2).sub.qSiR.sup.2R.sup.3[O(SiR.sup.2R.sup.3O).sub.n]SiR.sup.2R.sup.3(CH.sub.2).sub.q group, where n is an integer from 1 to 10, each R.sup.2 and R.sup.3 is an independently selected substituted or unsubstituted hydrocarbyl group, and q and q are each independently integers selected from 0 or from 1 to 6. Various methods relating to the bridged silicone resin and end uses thereof are also disclosed.

A bridged silicone resin is disclosed which has the general formula (1): (HSiO.sub.3/2).sub.x(SiO.sub.3/2XSiO.sub.3/2).sub.y(1); wherein x and y are each from >0 to <1 such that x+y=1; and wherein X is divalent group comprising a silarylene group or a (CH.sub.2).sub.qSiRR.sup.1[O(SiRR.sup.1O).sub.n]SiRR.sup.1(CH.sub.2).sub.q group, where n is an integer from 1 to 10, each R and R.sup.1 is an independently selected substituted or unsubstituted hydrocarbyl group, and q and q are each independently integers selected from 0 or from 1 to 6. Various methods relating to the bridged silicone resin and end uses thereof are also disclosed.

A bridged silicone resin is disclosed which has the general formula (1): (HSiO.sub.3/2).sub.x(SiO.sub.3/2XSiO.sub.3/2).sub.y(1); wherein x and y are each from >0 to <1 such that x+y=1; and wherein X is divalent group comprising a silarylene group or a (CH.sub.2).sub.qSiRR.sup.1[O(SiRR.sup.1O).sub.n]SiRR.sup.1(CH.sub.2).sub.q group, where n is an integer from 1 to 10, each R and R.sup.1 is an independently selected substituted or unsubstituted hydrocarbyl group, and q and q are each independently integers selected from 0 or from 1 to 6. Various methods relating to the bridged silicone resin and end uses thereof are also disclosed.