A radical-polymerizable resin composition comprising one or more metal-containing compounds (A) selected from a metal soap (A1) and a β-diketone skeleton-containing metal complex (A2); one or more thiol compounds (B) selected from a secondary thiol compound (B1) and a tertiary thiol compound (B2); and a radical-polymerizable compound (C) can stably cure under a dry condition, in water and in seawater and further on a wet substrate. The radical-polymerizable resin composition is useful as a repairing material for inorganic structure, a radical-polymerizable coating composition, a concrete spall preventing curable material, a reinforcing fiber-containing composite material, etc.

The present disclosure provides for aqueous, curable binder compositions, as well as articles and products comprising assemblies of matter comprising mineral fibers, synthetic fibers, natural fibers, cellulosic particles and sheet materials comprising the binder compositions disclosed herein.

According to one embodiment, a system for manufacturing a fully impregnated thermoplastic prepreg includes a mechanism for moving a fabric or mat and a drying mechanism that removes residual moisture from at least one surface of the fabric or mat. The system also includes a resin application mechanism that applies a reactive resin to the fabric or mat and a press mechanism that presses the coated fabric or mat to ensure that the resin fully saturates the fabric or mat. The system further includes a curing oven through which the coated fabric or mat is moved to polymerize the resin and thereby form a thermoplastic polymer so that upon exiting the oven, the fabric or mat is fully impregnated with the thermoplastic polymer. During at least a portion of the process, humidity in the vicinity of the coated fabric or mat is maintained at substantially zero.

An apparatus for impregnating fiber structures with a matrix material includes a lower part having a bath for receiving the matrix material and a draining unit. The draining unit includes a wiper having a wiping edge, over which the impregnated fiber structure is guided during operation, and a surface inclined in the direction of the bath, by which matrix material draining from the fiber structure can return into the bath. The draining unit includes a cover on which a deflection unit, by which the fiber structure is pressed into the bath when the cover is mounted, is mounted. When the cover is mounted, a gap is formed between the cover and the lower part on the sides by which the fiber structure is guided into the apparatus and emerges from the apparatus. A method for impregnating fiber structures with a matrix material is also disclosed.

A resin composition includes: a vinyl-containing polyphenylene ether resin; a compound of Formula (1); and a compound of Formula (2), a compound of Formula (3), a compound of Formula (4) or a combination thereof. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including prepreg viscosity variation ratio, prepreg stickiness resistance, amount of void after lamination, multi-layer board thermal resistance, glass transition temperature, ratio of thermal expansion, copper foil peeling strength, dissipation factor and laminate appearance.

A resin composition includes 100 parts by weight of a maleimide resin; 20 parts by weight to 60 parts by weight of a benzoxazine resin; 5 parts by weight to 40 parts by weight of an epoxy resin; 120 parts by weight to 240 parts by weight of silica including spherical silica having a sediment volume of less than or equal to 0.4 mL/g and a particle size distribution D50 of less than or equal to 1.0 μm; and 0.5 part by weight to 1.6 parts by weight of an imidazole compound having a long-chain alkyl group, wherein the imidazole compound having a long-chain alkyl group includes octylimidazole, undecylimidazole, heptadecylimidazole or a combination thereof. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including glass transition temperature, ratio of thermal expansion, copper foil peeling strength, thermal resistance after moisture absorption, dissipation factor, amount of resin cluster and appearance of cooper-free circuit board.

The purpose of the present invention is to provide: a molding material from which a carbon fiber reinforced composite material having excellent impact resistance and tensile strength is obtained; and a molding material from which a glass fiber reinforced composite material, that has high bending strength and impact resistance, has excellent weather resistance, and can suppress a decrease in bending strength after water absorption, is obtained. In order to achieve the purpose, the molding material according to the present invention is a molding material formed of an epoxy resin composition and a carbon fiber and/or a glass fiber, wherein the epoxy resin composition includes all of [A] to [C], the carbon fiber satisfies conditions [a] and [b], and the glass fiber has a surface functional group capable of forming a covalent bond with an isocyanate group. [A] Epoxy resin having at least two oxylan groups in molecule [B] Epoxy resin curing agent having at least two isocyanate groups in molecule [C] Catalyst [a] Having substantially perfect circular cross section [b] Average fiber diameter of 4.0-8.0 μm

A resin composition for a printed wiring board, including: a phenolic compound (A); a maleimide compound (B); an epoxy compound (C); a cyclic carbodiimide compound (D); an inorganic filler (E); and a curing accelerator (F), wherein a content of the inorganic filler (E) is 100 to 250 parts by mass based on 100 parts by mass of a resin solid content.

A fibre-reinforced polymer composite comprising fibres bound within a solid polymer matrix, wherein at least some of the fibres are in contact with graphene, and wherein the composite changes electrical resistance when deformed.

Methods of making fiber-containing prepregs are described. The methods may include the steps of providing a plurality of fibers, and applying a reactive resin composition to the plurality of fibers to make a mixture of the plurality of fibers and the resin composition. The reactive resin composition may include at least one of monomers and oligomers capable of polymerizing into a polymerized resin matrix. The mixture may be heated to a polymerization temperature where the monomers, oligomers, or both polymerize to form a fiber-resin amalgam that includes the polymerized resin matrix. The fiber-resin amalgam may be formed into the fiber-containing prepreg. Also described are methods of forming a fiber-reinforced composite that includes the prepreg.