A thermosetting resin composition and a prepreg and a laminated board prepared therefrom. The thermosetting resin composition contains the following components in parts by weight: 50-150 parts of a cyanate; 30-100 parts of an epoxy resin; 5-70 parts of styrene-maleic anhydride; 20-100 parts of a polyphenyl ether; 30-100 parts of a halogen-free flame retardant; 0.05-5 parts of a curing accelerator; and 50-200 parts of a filler. The prepreg and laminated board prepared from the thermosetting resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance and moisture resistance, etc., and are suitable for use in a halogen-free high-frequency multilayer circuit board.

A method for enhancing a sorbent membrane for carbon dioxide capture is disclosed. The method includes applying a layer of a hydrophobic material to at least one surface of the sorbent membrane. The hydrophobic material may be one of a polysioxane, a silicone compound, and a fluoroacrylic copolymer. The sorbent membrane may be an anionic exchange membrane, and may have a quaternary ammonium functional group. The layer of hydrophobic material reduces the amount of water used in the carbon dioxide capture process, and relaxes the water quality constraints.

The present invention relates to a thermoplastic composite material comprising an organic fibrous material and a thermoplastic binding agent, wherein the thermoplastic binding agent is selected from a polymer from the group comprising styrene-acrylate. Furthermore, the invention relates to a method for producing a thermoplastic composite material and to the use of the thermoplastic composite material.

The present invention relates to the treatment or prevention of skeletal disorders, at particular skeletal diseases, developed by patients that display abnormal increased activation of the fibroblast growth factor receptor 3 (FGFR3), in particular by expression of a constitutively activated mutant of FGFR3.

Provided herein are ionically conductive solid-state compositions that include ionically conductive inorganic particles in a matrix of an organic material. The resulting composite material has high ionic conductivity and mechanical properties that facilitate processing. In particular embodiments, the ionically conductive solid-state compositions are compliant and may be cast as films. In some embodiments of the present invention, solid-state electrolytes including the ionically conductive solid-state compositions are provided. In some embodiments of the present invention, electrodes including the ionically conductive solid-state compositions are provided. The present invention further includes embodiments that are directed to methods of manufacturing the ionically conductive solid-state compositions and batteries incorporating the ionically conductive solid-state compositions.

A polycarbonate resin composition includes: 50 to 90% by mass of polycarbonate resin (A); 2 to 30% by mass of acrylonitrile-butadiene-styrene copolymer resin (B); 5 to 40% by mass of at least one basic magnesium sulfate (C) selected from fibrous basic magnesium sulfate (C-1) and fan-shaped basic magnesium sulfate (C-2); 0.1 to 8% by mass of at least one (D) selected from a fatty acid metal salt and a fatty acid; and 1 to 20% by mass of elastomer (E).

This disclosure relates to a curable composition that includes at least first, second, and third polymers. The first polymer includes a first monomer unit and a second monomer unit different from the first monomer unit, in which the first monomer unit has the structure of formula (I) defined in the Specification and the second monomer unit has the structure of formula (II) defined in the Specification. The second polymer includes at least about 60 wt % of a styrene monomer unit; and the third polymer includes at most about 60 wt % of a styrene monomer unit. This disclosure also relates to using the composition to form a free-standing film, a laminate, a prepreg, and/or a printed circuit board.

The present disclosure provides for articles formed of a filled polymeric resin material. More specifically, the present disclosure relates to polymeric resin materials that include a filler that includes of a mixture of cured rubber granules, foam granules, and/or textile fibers. The filler can be suspended in and/or encapsulated by the polymeric resin material. The polymeric resin material, the filler, or both can include waste or scrap material from manufacturing or from ground post-consumer waste.

The present invention relates to a method for preparing a benzoxazine-containing resin composition and a prepreg and a laminate made therefrom. The method for preparing a benzoxazine-containing resin composition is adding an acidic filler to a benzoxazine-containing resin composition. By adding an acidic filler to the benzoxazine-containing resin composition, the present invention promotes greatly the polymerization reaction of benzoxazine and epoxy resin, reduces the curing temperature required for polymerization of benzoxazine and epoxy resin. The laminate prepared from the benzoxazine-containing resin composition, to which an acidic filler is added, has high anti-stripping stability, high glass transition temperature, low water absorption, high heat resistance, high bending strength and good processability, and can achieve low coefficient of thermal expansion.

A resin composition includes a vinyl-containing polyphenylene ether resin and a prepolymer, wherein the prepolymer is prepared by prepolymerization of a mixture which at least includes a divinylbenzene, a triallyl compound and a diallyl isophthalate. An article made from the resin composition is also provided, which includes a prepreg, a resin film, a laminate or a printed circuit board. The article achieves improvements in at least one properties of glass transition temperature, copper foil peeling strength, dissipation factor, inner resin flow, melt viscosity, minimum dynamic viscosity, resin filling property in open area, and water resistance.