A polymer composite exhibiting piezoelectric properties can be formed for flexible and/or thin film applications, in which the polymer composite includes a polymer matrix and a piezoelectric ceramic filler embedded in the polymer matrix. The polymer matrix may include at least two polymers: a first polymer and a second polymer. The first polymer may be a fluorinated polymer, and the second polymer may be compatible with the first polymer and have a dielectric constant of less than approximately 20. The piezoelectric ceramic filler may be a lead-free ceramic filler, such as barium titanate, and be approximately 40-70% by volume of the polymer composite. The remaining 30-60% by volume may be the polymer matrix, which may itself be approximately 5-20% by weight second polymer and 80-95% fluorinated polymer.

The invention relates to a molding composed of extruded foam, wherein at least one fiber (F) is present with a fiber region (FB2) within the molding and is surrounded by the extruded foam, while a fiber region (FB1) of the fiber (F) projects from a first side of the molding and a fiber region (FB3) of the fiber (F) projects from a second side of the molding, and the extruded foam is produced by an extrusion process comprising the following steps: I) providing a polymer melt in an extruder, II) introducing at least one blowing agent into the polymer melt provided in step I) to obtain a foamable polymer melt, III) extruding the foamable polymer melt obtained in step II) from the extruder through at least one die aperture into an area at lower pressure, with expansion of the foamable polymer melt to obtain an expanded foam, and IV) calibrating the expanded foam from step III) by conducting the expanded foam through a shaping tool to obtain the extruded foam.

The present invention relates to a molding made from foam, wherein at least one fiber (F) is partly within the molding, i.e. is surrounded by the foam. The two ends of the respective fibers (F) that are not surrounded by the foam thus each project from one side of the corresponding molding. The foam comprises at least two mutually bonded foam segments.

Disclosed are a halogen-free resin composition, and a prepreg and a laminate prepared by using the same. The halogen-free resin composition comprises the following components according to organic solid matters by weight parts: (A) 40-80 parts by weight of allyl modified benzoxazine resin; (B) 10-20 parts by weight of hydrocarbon resin; (C) 10-40 parts by weight of allyl modified polyphenylene oxide resin; (D) 0.01-3 parts by weight of initiating agent; (E) 10-100 parts by weight of filler; and (F) 0-80 parts by weight of phosphoric flame retardant. The prepreg and the laminate prepared by using the halogen-free resin composition have lower dielectric constant and lower dielectric loss tangent value, higher peeling strength, higher glass transition temperature, excellent heat resistance and good flame retardant effect.

A novel material for producing auxetic foams is disclosed. The material comprises a multiphase, multicomponent polymer foam with a filler polymer having a carefully selected glass transition temperature. Novel methods for producing auxetic foams from the material are also disclosed that consistently, reliably and quickly produce auxetic polyurethane foam at about room temperature (25° C.). This technology overcomes challenging issues in the large-scale production of auxetic PU foams, such as unfavorable heat-transmission problem and harmful organic solvents.

A reinforcement sheet has a composite layer including fibres and a polymer A and a coating layer including polymer B, each polymer having at least 65 mol % of a repeat unit of formula:

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wherein for each polymer A and B, t1, and w1 independently represent 0 or 1 and v1 represents 0, 1 or 2. A method of forming the reinforcement sheet is also disclosed, in addition to a method for forming an article comprising a laminate of the reinforcement sheets and the article comprising such a laminate. The repeat unit may be ether-ether-ketone.

Disclosed herein are various cable gel seal arrangements and thermoplastic gels useful therein. The thermoplastic gels are prepared from a composition including a styrene triblock copolymer, a styrene diblock copolymer, an oil extender, and an additive selected from poly(2,6-dimethyl-1,4-phenylene oxide), a C9 resin, poly(alpha-methylstyrene), a coumarone-indene resin, and combinations thereof, wherein the additive has a T.sub.g from about 95° C. to about 200° C. The thermoplastic gels advantageously exhibit low compression set.

This invention generally relates to transparent compositions containing a blend of poly(phenylene ether) and styrenic polymer, methods for their manufacture, and food packaging films and containers derived therefrom.

A resin composition, including resin and imidazole, is provided. The resin includes cyanate ester resin and bismaleimide resin, and the imidazole does not have acidic hydrogen.

A circuit board includes an insulating made by a low dielectric resin composition includes a low dielectric resin containing acid anhydride, an epoxy resin, polyphenylene ether resin with vinyl and active esters, maleic acid liquid polybutadiene, and an accelerator. Such low dielectric resin can be dissolved in organic solvent more easily than a low dielectric resin without acid anhydride, and the low dielectric resin containing acid anhydride has a better compatibility with other organic components than a low dielectric resin without acid anhydride. A low dielectric resin composition with lower dielectric constant and better properties can thus be obtained.