Patent classifications
C08K2003/0831
GAS PERMEABLE, ULTRATHIN, STRETCHABLE EPIDERMAL ELECTRONIC DEVICES AND RELATED METHODS
Presented herein are gas permeable, ultrathin, stretchable epidermal electronic devices and related methods enabled by self-assembled porous substrates and conductive nanostructures. Efficient and scalable breath figure method is employed to introduce the porous skeleton and then silver nanowires (AgNWs) are dip-coated and heat-pressed to offer electric conductivity. The resulting film has a transmittance of 61%, sheet resistance of 7.3 Ω/sq, and water vapor permeability of 23 mg cm.sup.−2 h.sup.−1. With AgNWs embedded below the surface of the polymer, the electrode exhibits excellent stability with the presence of sweat and after long-term wear. The present subject matter demonstrates the potential of the electrode for wearable applications—skin-mountable biopotential sensing for healthcare and textile-integrated touch sensing for human-machine interfaces. The electrode can form conformal contact with human skin, leading to low skin-electrode impedance and high-quality biopotential signals. In addition, the textile electrode can be used in a self-capacitance wireless touch sensing system.
POLYMER COMPOSITIONS WITH ANTIMICROBIAL AND WAVELENGTH-SHIFTING NANOPARTICLES
Disclosed are embodiments of polymer compositions and systems that contain antimicrobial and wavelength-shifting metal nanoparticles. The polymer compositions containing metal nanoparticles protect exposed materials from UV radiation. The polymer compositions containing metal nanoparticles down convert incoming UV light to light that may have a longer wavelength. Unexpectedly, by selecting at least two differently configured nanoparticle components (e.g., different in size, shape, or both), each with specific particle size distribution, it is possible to effectively protect an area from damage resulting from exposure to UV radiation. In addition, spherical silver nanoparticles do not cause bacteria to become resistant as do convention silver nanoparticles made by chemical synthesis.
Polymer film-metal composites
Disclosed is a method of preparing polymer film-metal composites and uses of such composites. The metal can be in the form of a nanoparticle or a film. The methods comprise depositing on a surface, a composition comprising: a cationic metal precursor; a polymer film precursor that comprises a plurality of photopolymerizable groups; and a photoreducer-photoinitiator; then irradiating the composition under conditions to simultaneously reduce the cationic metal and polymerize the photopolymerizable groups to obtain the composite on the surface.
Fiber-reinforced polymer composition for use in an electronic module
A fiber-reinforced polymer composition that comprises a polymer matrix; a thermally conductive filler distributed within the polymer matrix; and a plurality of long fibers distributed within the polymer matrix is provided. The long fibers comprise an electrically conductive material and have a length of about 7 millimeters or more. Further, the composition exhibits an in-plane thermal conductivity of about 1 W/m-K or more as determined in accordance with ASTM E 1461-13 and an electromagnetic shielding effectiveness of about 20 dB or more as determined at a frequency of 1 GHz in accordance with EM 2107A.
Metal particle-containing composition and electrically conductive adhesive film
The present disclosure relates to a metal particle-containing composition contains at least one thermosetting resin (R), a hardening agent (H), and at least three types of metal particles (P) different from one another. The metal particles (P) contain a solder alloy particle (P1) containing a tin alloy containing at least one metal (A), wherein the metal (A) is a metal that forms a eutectic crystal with tin at a eutectic temperature of 200° C. or lower, at least one metal particle (P2) containing a metal (B) having a melting point exceeding 420° C. in a bulk, the metal particle (P2) having a melting point higher than a solidus temperature of the solder alloy particle (P1), and at least one metal particle (P3) containing a metal (C) that forms an intermetallic compound with a metal contained in the solder alloy particle (P1).
DISPLAY DEVICE AND MANUFACTURING METHOD OF DISPLAY DEVICE
A display device and a manufacturing method of the display device are provided. The display device includes a substrate; a pixel definition layer disposed on the substrate and having a plurality of pixel openings; a surface-active nanolayer disposed on a surface of the substrate and on a surface extending to the pixel definition layer, wherein the surface-active nanolayer covers a plurality of nanoparticles; and a light-emitting layer disposed in the plurality of pixel openings.
SENSITIVE CONJUGATED POLYMER STRUCTURE COLOR AND SENSOR USING SAME
The present disclosure relates to a responsive polymer film, a method of preparing the responsive polymer film, and a sensor using the polymer film.
ADHESIVE COMPOSITION AND COUPLING STRUCTURE
A connected structure including: a first circuit member having a first electrode; a second circuit member having a second electrode; and a connecting portion provided between the first circuit member and the second circuit member and electrically connecting the first electrode and the second electrode to each other, wherein at least one of the first electrode and the second electrode has a layer made of Cu or Ag as an outermost surface thereof, and the connecting portion contains a conductive particle having a layer made of Pd or Au as an outermost surface thereof.
Production of very small or thin dies
A system to manufacture a plurality of dies may include an etching tool, an electrically-conductive-adhesive-composition, a heat-applying-extraction-tool and a porous substrate cooperating with an evacuation component. The etching tool uses an ion beam that is configured to singulate a plurality of dies on a wafer with an ion etching process. The electrically-conductive-adhesive-composition is located between the wafer and a porous substrate carrying the wafer during the ion etching process. The electrically-conductive-adhesive-composition adheres the wafer to the porous substrate to keep the dies in place during the ion etching process. The electrically-conductive-adhesive-composition also aids in conducting electrons away from the wafer as a drain during the ion etching process. The heat-applying-extraction-tool applies heat to an individual die during a handling process of the manufacturing process in order to melt the electrically-conductive-adhesive-composition through the porous substrate to an evacuation component in order to then pick up an individual die singulated from the wafer.
ADHESIVE COMPOSITION AND LIQUID-CRYSTAL DISPLAY AND METHOD OF DISASSEMBLING THE SAME
An adhesive composition includes 0.1 to 1 part by weight of nano panicles, 50 to 95 parts by weight of acrylate resin, and 5 to 50 parts by weight of a monomer or oligomer of acrylate or acrylic acid containing multi-functional groups, and the acrylate resin and the monomer or oligomer of acrylate or acrylic acid containing multi-functional groups have a total weight of 100 parts by weight, in which the acrylate resin has a weight average molecular weight of 100,000 to 1,500,000. The nano particle has a shell covering parts of the surface of the core, and acrylate groups grafted to the surface of the core.