C08K2003/0831

Multilayer composites comprising adhesive and one or more nanofiber sheets
11377537 · 2022-07-05 · ·

Techniques are disclosed for producing multilayered composites of adhesive nanofiber composites. Specifically, one or more sheets of highly aligned nanofibers are partially embedded in an adhesive such that at least a portion of the nanofiber sheet is free from adhesive and is available to conduct current with adjacent electrical features. In some example embodiments, the adhesive nanofiber composites are metallized with a conductive metal and in these and other embodiments, the adhesive nanofiber composites may also be stretchable.

Conductive coating material and production method for shielded package using conductive coating material

A conductive coating material is disclosed including at least (A) 100 parts by mass of a binder component including a solid epoxy resin that is a solid at normal temperature and a liquid epoxy resin that is a liquid at normal temperature, (B) 500 to 1800 parts by mass of metal particles that have a tap density of 5.3 to 6.5 g/cm.sup.3 with respect to 100 parts by mass of the binder component (A), (C) 0.3 to 40 parts by mass of a curing agent that contains at least one imidazole type curing agent with respect to 100 parts by mass of the binder component (A), and (D) 150 to 600 parts by mass of a solvent with respect to 100 parts by mass of the binder component (A).

NEW POLYMER MATRIX ELECTRODES
20220252537 · 2022-08-11 · ·

Electrochemical probes (or sensors), resistant to corrosive agents present in seawaters or in industrial waters, useful for detecting compounds present in water, are here described, wherein said probes comprise at least one polymer matrix electrode, in which said electrode is selected from the group comprising counter electrode, reference electrode and working electrode.

Conductive nanocomposites

Conductive or semiconductive nanoparticles are modified with conductive ligands so as to be able to obtain conductive or semiconductive layers without requiring a thermal treatment for forming the structures upon application of the layers. A composition can include a matrix polymer for producing conductive composites.

SURFACE COATED ELECTRICALLY CONDUCTIVE ELASTOMERS

The disclosure provides electrically conductive elastomers.

PIEZOELECTRIC POLYVINYLIDENE FLUORIDE MATERIAL, METHOD FOR MANUFACTURING SAME, AND FINGERPRINT RECOGNITION MODULE

A piezoelectric polyvinylidene fluoride (PVDF) material, a method for manufacturing the same, and a fingerprint recognition module are provided. The polyvinylidene PVDF material includes PVDF, a first solvent, a second solvent, a fluorosurfactant, and an inducing material. Material of the inducing material is one of carbon nanotubes, carbon black, and gold nanorods. Because of the high anisotropy of the inducing material, molecular orientation of the PVDF material is induced, thereby improving piezoelectric performance of the piezoelectric PVDF material. Problems of conventional piezoelectric PVDF materials, which are used in ultrasonic fingerprint recognition modules, such as poor piezoelectric performance and high-energy loss are improved.

METAL PARTICLE-CONTAINING COMPOSITION AND ELECTRICALLY CONDUCTIVE ADHESIVE FILM

The present disclosure relates to a metal particle-containing composition contains at least one thermosetting resin (R), a hardening agent (H), and at least three types of metal particles (P) different from one another. The metal particles (P) contain a solder alloy particle (P1) containing a tin alloy containing at least one metal (A), wherein the metal (A) is a metal that forms a eutectic crystal with tin at a eutectic temperature of 200° C. or lower, at least one metal particle (P2) containing a metal (B) having a melting point exceeding 420° C. in a bulk, the metal particle (P2) having a melting point higher than a solidus temperature of the solder alloy particle (P1), and at least one metal particle (P3) containing a metal (C) that forms an intermetallic compound with a metal contained in the solder alloy particle (P1).

METHOD FOR MANUFACTURING ANISOTROPIC CONDUCTIVE FILM, AND ANISOTROPIC CONDUCTIVE FILM
20210265076 · 2021-08-26 · ·

Provided is an anisotropic conductive film manufacturing method capable of reducing manufacturing costs. Also provided is an anisotropic conductive film capable of suppressing the occurrence of conduction defects. The anisotropic conductive film manufacturing method includes: a holding step of supplying conductive particles having a plurality of particle diameters on a member having a plurality of opening parts, and holding the conductive particles in the opening parts; and a transfer step of transferring the conductive particles held in the opening parts to an adhesive film. In the particle diameter distribution graph (X-axis: particle diameter (μm), Y-axis: number of particles) of the conductive particles held in the opening parts, the shape of the graph is such that the slope is substantially infinite in a range at or above a maximum peak particle diameter.

FILLER-CONTAINING FILM
20210261743 · 2021-08-26 · ·

A filler-containing film that can be precisely pressed to an electronic component with lower thrust is a film having a filler distributed layer in which fillers are regularly disposed in a resin layer, wherein an area occupancy rate of the fillers in a plan view is 25% or less, a ratio La/D between a layer thickness La of the resin layer and a particle diameter D of the fillers is 0.3 or more and 1.3 or less, and a proportion by number of the fillers present in a non-contact state with each other is 95% or more with respect to the entire fillers. The proportion by number of the fillers present in a non-contact state with each other is preferably 99.5% or more with respect to the entire fillers.

Materials and methods for conductive thin films
11111399 · 2021-09-07 · ·

A material composition for manufacturing a translucent conductive film includes a fluid. The material composition further includes nanostructures disposed within the fluid. The material composition further includes a component that modifies a structure of a joint formed between at least two nanostructures of the plurality of nanostructures after the component is activated. The component may be activated by applying heath or optical radiation to the component.