Provided are a magnetic resin composition including magnetic particles and an epoxy resin having an epoxy equivalent of 400 g/eq or more, in which a filling rate of the magnetic particles is 70% or more on an area basis; a cured product obtained by curing the magnetic resin composition; and an electronic component including the cured product.

A compound includes a polysaccharide moiety and one or more chelating agents. The one or more chelating agents are covalently bonded to the polysaccharide moiety. The polysaccharide moiety can include a glycosaminoglycan moiety, such as a hyaluronic acid polymer or a sulfated glycosaminoglycan moiety. The compound can be used to treat or prevent a disease or disorder in a patient with a metal implant. The compound reduces a concentration of metal particulates or metal ions in the subject.

A method, a device, and a composition are disclosed. The method includes providing a polyol blend that includes a polyol resin and an electromagnetic (EMA) additive, providing an isocyanate resin selected such that blending the isocyanate resin with the polyol blend results in an EMA spray foam. The device includes a first compartment containing an isocyanate resin and a second compartment containing a polyol blend, which includes a polyol resin and an EMA additive. The composition includes a polyurethane spray foam and an EMA additive blended into the polyurethane spray foam.

A film contains a fluororesin, a chromatic pigment, and a black pigment, in which a visible light transmittance of the film is from 5 to 60% and a haze value of the film is 30% or less.

Disclosed are a method of uniformly dispersing nickel-plated conductive particles of a single layer within a polymer film by applying a magnetic field to the polymer film and a method of fabricating an anisotropic conductive film using the same. The method of fabricating a film may include forming a liquefied polymer layer by roll-to-roll coating a polymer solution in which a plurality of conductive particles has been mixed, dispersing the plurality of conductive particles included in the liquefied polymer layer by applying a magnetic field to the liquefied polymer layer, and fabricating a solid polymer layer limiting a movement of the plurality of dispersed conductive particles by drying the liquefied polymer layer in which the plurality of conductive particles has been dispersed.

An object of the present invention is to provide a composition that can form a magnetic particle-containing film having excellent magnetic isotropy and has excellent temporal stability. Another object of the present invention is to provide a magnetic particle-containing film that relates to the composition, and an electronic component that includes the magnetic particle-containing film.

The composition according to an embodiment of the present invention is a composition containing magnetic particles and a rheology control agent, in which a content of the magnetic particles having an aspect ratio less than 8 is 25% by mass or more with respect to a total mass of the magnetic particles, the magnetic particles contain metal atoms, the metal atoms contain one or more kinds of specific atoms selected from the group consisting of Ni atoms and Co atoms, and a content of the specific atoms is 50% by mass or more with respect to a total mass of the metal atoms.

An adhesive film including a first adhesive layer, wherein the first adhesive layer contains a first adhesive component and a plurality of conductive particles, wherein the plurality of conductive particles include first conductive particles that are dendritic conductive particles, and second conductive particles that are conductive particles other than the first conductive particles, each conductive particle containing a non-conductive core and a conductive layer provided on the core, and a part of the plurality of conductive particles is disposed to protrude from one surface of the first adhesive layer.

An electrically conductive bonding tape includes a conductive self-supporting first layer conductive in each of three mutually orthogonal directions and including conductive opposing first and second major surfaces, an conductive second layer coated on the first major surface of the self-supporting first layer and having at least 60% by weight of nickel, the second layer having an exposed major surface facing away from the first major surface of the self-supporting first layer and exposing at least some of the nickel in the second layer, and a conductive adhesive third layer bonded to the second major surface of the self-supporting first layer opposite the second layer. The adhesive third layer is conductive in at least one of the three mutually orthogonal directions and includes a plurality of conductive elements dispersed in an insulative material, at least some of the conductive elements physically contacting the self-supporting first layer.

The present disclosure relates to a metal particle-containing composition contains at least one thermosetting resin (R), a hardening agent (H), and at least three types of metal particles (P) different from one another. The metal particles (P) contain a solder alloy particle (P1) containing a tin alloy containing at least one metal (A), wherein the metal (A) is a metal that forms a eutectic crystal with tin at a eutectic temperature of 200° C. or lower, at least one metal particle (P2) containing a metal (B) having a melting point exceeding 420° C. in a bulk, the metal particle (P2) having a melting point higher than a solidus temperature of the solder alloy particle (P1), and at least one metal particle (P3) containing a metal (C) that forms an intermetallic compound with a metal contained in the solder alloy particle (P1).

The present invention aims to provide resin particles that have excellent heat resistance and that, when used as base particles of conductive particles, are applicable to mounting by thermocompression bonding at low pressure to produce a connection structure having excellent connection reliability. The present invention also aims to provide conductive particles, a conductive material, and a connection structure each including the resin particles. Provided are resin particles having a 5% weight loss temperature of 350° C. or higher, a 10% K value at 25° C. of 100 N/mm.sup.2 or more and 2,500 N/mm.sup.2 or less, and a 30% K value at 25° C. of 100 N/mm.sup.2 or more and 1,500 N/mm.sup.2 or less.