Provided is a resin particle that can be uniformly brought into contact with an adherend, can effectively enhance adhesion to a conductive portion and impact resistance when electrodes are electrically connected to each other using a conductive particle having the conductive portion formed on a surface thereof, and further can effectively reduce connection resistance. In the resin particle according to the present invention, an exothermic peak is observed when differential scanning calorimetry is performed by heating the resin particle at a temperature rising rate of 5° C./min from 100° C. to 350° C. in an air atmosphere.

The present invention relates to a sol-gel coating composition comprising conductive fillers, intended to make a culinary article compatible with induction.

The disclosure provides electrically conductive elastomers.

An antimicrobial coating composition is disclosed. The composition delivers several orders of magnitude improvement in the reduction of infectious materials (i.e., microbial substances, including bacteria, fungus, germs, and other pathogens). An advanced high performance antimicrobial coating composition that is able to eliminate and reduce the bacteria and germ count at a log reduction of greater than 5 within 10 minutes of exposure.

Compositions including a polyimide and one or more thermally conductive fillers, and compaction rollers for an automated fiber placement machine incorporating the compositions are provided. The polyimide may be a polymeric reaction product of a dianhydride and one or more diamines. The one or more diamines may include a fluorine-containing alkyl ether diamine. The one or more thermally conductive fillers may include one or more of a carbon-based filler, boron nitride, a metal, or combinations thereof. The compositions may have a thermal conductivity of from about 0.2 to about 50 Watts per meter Kelvin (Wm.sup.−1 K.sup.−1).

Provided herein are stretchable conductive inks consisting of a continuous polymer phase with dispersed silver flakes and a low melting metal or alloy, wherein initial resistivity is measured before elongation and the resistivity of the stretchable conductive ink composition is less than 10 times the initial resistivity at 50% elongation.

The present disclosure relates to a metal particle-containing composition contains at least one thermosetting resin (R), a hardening agent (H), and at least three types of metal particles (P) different from one another. The metal particles (P) contain a solder alloy particle (P1) containing a tin alloy containing at least one metal (A), wherein the metal (A) is a metal that forms a eutectic crystal with tin at a eutectic temperature of 200° C. or lower, at least one metal particle (P2) containing a metal (B) having a melting point exceeding 420° C. in a bulk, the metal particle (P2) having a melting point higher than a solidus temperature of the solder alloy particle (P1), and at least one metal particle (P3) containing a metal (C) that forms an intermetallic compound with a metal contained in the solder alloy particle (P1).

A polyamide resin composition includes 100 parts by weight of a polyamide resin (A), 0.1 to 50 parts by weight of a fire retardant (B), 0.001 to 1 part by weight of a metal and/or salt thereof (C), and 0.001 to 1 part by weight of a compound (D) as represented by formula [I]: QX [I] wherein in formula [I], Q represents an aromatic hydrocarbon group or an alicyclic hydrocarbon group and X represents a 5-membered heterocyclic ring group, Q and X forming a covalent bond or a fused ring.

Tunable thermoplastic polymer sealants and tunable conductive thermoplastic polymer sealants, and edge seals and fillet seals produced from such sealants; and substrates, components and objects comprising the tunable edge seals and fillet seals, and methods for making and applying such edge seals and fillet seals are disclosed.

Provided is an anisotropic conductive film manufacturing method capable of reducing manufacturing costs. Also provided is an anisotropic conductive film capable of suppressing the occurrence of conduction defects. The anisotropic conductive film manufacturing method includes: a holding step of supplying conductive particles having a plurality of particle diameters on a member having a plurality of opening parts, and holding the conductive particles in the opening parts; and a transfer step of transferring the conductive particles held in the opening parts to an adhesive film. In the particle diameter distribution graph (X-axis: particle diameter (μm), Y-axis: number of particles) of the conductive particles held in the opening parts, the shape of the graph is such that the slope is substantially infinite in a range at or above a maximum peak particle diameter.