A protective film forming agent that, in dicing of a semiconductor wafer, is used to form a protective film on the surface of the semiconductor wafer, can form a protective film that has excellent laser processability, and has excellent solubility of a light-absorbing agent; and a method for producing a semiconductor chip using the protective film forming agent. The protective film forming agent includes a water-soluble resin, a light-absorbing agent, a basic compound, and a solvent. The basic compound is an alkylamine, an alkanolamine, an imidazole compound, ammonia, or an alkali metal hydroxide. The light-absorbing agent content of the protective film forming agent is 0.1-10 mass % (inclusive).

A protective film substance for laser processing includes a solution including a water-soluble resin, an organic solvent, and a light absorbent. The solution has an absorbance, i.e., an absorbance converted for a solution diluted 200 times, equal to 0.05 or more per an optical path length of 1 cm at a wavelength of 532 nm. Alternatively, the protective film substance for laser processing includes a solution including a water-soluble resin, an organic solvent, and a polyhydroxyanthraquinone derivative.

Provided is a molded product which exhibits an excellent jet black color in a case where a light source is turned off, can exhibit a specific color tone in a case where the light source is turned on, and has a high solar transmittance. The molded product of the present invention is a molded product comprising a transparent resin, in which an L* value of reflected light is 35 or less, in a wavelength range of 430 nm or more and 700 nm or less, a wavelength at which a maximum value of a light transmittance is shown is in a wavelength range of 430 nm or more and less than 680 nm, and a light transmittance at a wavelength of 770 nm is 0.5% or more.

Provided is a molded product which exhibits an excellent jet black color in a case where a light source is turned off, can exhibit a specific color tone in a case where the light source is turned on, and has a high solar transmittance. The molded product of the present invention is a molded product comprising a transparent resin, in which an L* value of reflected light is 35 or less, in a wavelength range of 430 nm or more and 700 nm or less, a wavelength at which a maximum value of a light transmittance is shown is in a wavelength range of 430 nm or more and less than 680 nm, and a light transmittance at a wavelength of 770 nm is 0.5% or more.

Embodiments of the disclosure relate to a series of PC resin additives for maintaining the color stability and blue-cut performance during injection molding. The additives may be used to adapt a PC resin customarily used for sun protection lenses for clear lens applications.

Provided is a polycarbonate-based resin composition including: a polycarbonate-polyorganosiloxane copolymer (A); and at least one kind of compound (B) selected from the group consisting of an antioxidant, a dye, a release agent, a light-diffusing agent, a flame retardant, a UV absorber, a silicone-based compound, an epoxy compound, and a polyether compound, wherein the polycarbonate-polyorganosiloxane copolymer (A) contains a polycarbonate block (A-1) and a polyorganosiloxane block (A-2), and satisfies the following requirements (1) to (3): (1) the content of the polyorganosiloxane block (A-2) is from more than 40 mass % to 70 mass % or less; (2) the copolymer has a viscosity-average molecular weight of from 10,000 to 23,000; and (3) the copolymer contains a specific polycarbonate block as the polycarbonate block (A-1).

Provided is a polycarbonate-based resin composition including: a polycarbonate-polyorganosiloxane copolymer (A); and at least one kind of compound (B) selected from the group consisting of an antioxidant, a dye, a release agent, a light-diffusing agent, a flame retardant, a UV absorber, a silicone-based compound, an epoxy compound, and a polyether compound, wherein the polycarbonate-polyorganosiloxane copolymer (A) contains a polycarbonate block (A-1) and a polyorganosiloxane block (A-2), and satisfies the following requirements (1) to (3): (1) the content of the polyorganosiloxane block (A-2) is from more than 40 mass % to 70 mass % or less; (2) the copolymer has a viscosity-average molecular weight of from 10,000 to 23,000; and (3) the copolymer contains a specific polycarbonate block as the polycarbonate block (A-1).

The invention relates to a coloured curable composition for use in an additive manufacturing process, the composition comprising a curable resin composition comprising radiation curable components, a photo initiator, a dye composition comprising a dye D1 and a dye D2, dye D1 having a light absorption maximum within a wave length range from 400 to 530 nm, dye D2 showing a light absorption maximum within a wave length range from 540 to 650 nm. The invention also relates to a 3-dim composite article obtained by processing the curable composition in an additive manufacturing process.

The invention relates to a coloured curable composition for use in an additive manufacturing process, the composition comprising a curable resin composition comprising radiation curable components, a photo initiator, a dye composition comprising a dye D1 and a dye D2, dye D1 having a light absorption maximum within a wave length range from 400 to 530 nm, dye D2 showing a light absorption maximum within a wave length range from 540 to 650 nm. The invention also relates to a 3-dim composite article obtained by processing the curable composition in an additive manufacturing process.

The invention relates to a coloured curable composition for use in an additive manufacturing process, the composition comprising a curable resin composition comprising radiation curable components, a photo initiator, a dye composition comprising a dye D1 and a dye D2, dye D1 having a light absorption maximum within a wave length range from 400 to 530 nm, dye D2 showing a light absorption maximum within a wave length range from 540 to 650 nm. The invention also relates to a 3-dim composite article obtained by processing the curable composition in an additive manufacturing process.