The present invention relates to a method of preparing an ASA graft copolymer, a method of preparing a thermoplastic resin composition including the ASA graft copolymer, and a method of manufacturing a molded article using the thermoplastic resin composition. More particularly, the present invention provides an ASA graft copolymer having improved thermal stability through addition of an emulsifier in a specific amount range in a seed preparation step and introduction of a multifunctional carboxylic acid having 20 or more carbon atoms or a salt thereof, as an emulsifier, in a shell preparation step and a high-quality thermoplastic resin composition exhibiting excellent impact resistance, such as impact strength and tensile strength, and excellent appearance, such as surface gloss, whiteness, and retention-associated heat discoloration, and causing considerable reduction in the amount of gas generated on a surface of a resin during a high-temperature thermoforming process due to inclusion of the ASA graft copolymer.

An adhesive for heat press molding contains a reaction product obtained by heat treatment on a mixture containing a polycarboxylic acid and a saccharide.

A glassy adhesive including a composition containing at least: a polysilazane compound having structures represented by the following formulae (A-1) and (A-2) and not containing a hydrosilyl group; and a curing catalyst, where a mole ratio of the component (A-1) to the component (A-2), which is (A-1):(A-2), is within a range of 3:7 to 7:3, the composition has a non-volatile content of 50 mass % or more, when the composition being heated at 105° C. for 3 hours, and the curing catalyst is at least one selected from the group consisting of an organic acid, a simple substance of a d block element belonging to the fourth period of the periodic table, a platinum group element, and an amphoteric element, and a compound containing the element. This provides an adhesive that is low-cost, has high UV resistance, and in which cracks and so forth do not occur even after a reflow process.

##STR00001##

A glassy adhesive including a composition containing at least: a polysilazane compound having structures represented by the following formulae (A-1) and (A-2) and not containing a hydrosilyl group; and a curing catalyst, where a mole ratio of the component (A-1) to the component (A-2), which is (A-1):(A-2), is within a range of 3:7 to 7:3, the composition has a non-volatile content of 50 mass % or more, when the composition being heated at 105° C. for 3 hours, and the curing catalyst is at least one selected from the group consisting of an organic acid, a simple substance of a d block element belonging to the fourth period of the periodic table, a platinum group element, and an amphoteric element, and a compound containing the element. This provides an adhesive that is low-cost, has high UV resistance, and in which cracks and so forth do not occur even after a reflow process.

##STR00001##

Methods and apparatus for etching a high aspect ratio feature in a stack on a substrate are provided. The feature may be formed in the process of forming a 3D NAND device. Typically, the stack includes alternating layers of material such as silicon oxide and silicon nitride or silicon oxide and polysilicon. WF.sub.6 is provided in the etch chemistry, which substantially reduces or eliminates problematic sidewall notching. Advantageously, this improvement in sidewall notching does not introduce other tradeoffs such as increased bowing, decreased selectivity, increased capping, or decreased etch rate.

Methods and apparatus for etching a high aspect ratio feature in a stack on a substrate are provided. The feature may be formed in the process of forming a 3D NAND device. Typically, the stack includes alternating layers of material such as silicon oxide and silicon nitride or silicon oxide and polysilicon. WF.sub.6 is provided in the etch chemistry, which substantially reduces or eliminates problematic sidewall notching. Advantageously, this improvement in sidewall notching does not introduce other tradeoffs such as increased bowing, decreased selectivity, increased capping, or decreased etch rate.

Although a composition for formation of a coating film is sometimes required to have satisfactory storage stability, it could not be said that a conventionally known composition has sufficient storage stability. It is an object of the present invention to provide a composition comprising an organosilicon compound which is excellent in storage stability. The present invention provides a composition comprising an organosilicon compound (A) represented by the following formula (a1), a metal compound (B) represented by the following formula (b1), a carboxylic acid compound (C), and an acid catalyst. ##STR00001##

Although a composition for formation of a coating film is sometimes required to have satisfactory storage stability, it could not be said that a conventionally known composition has sufficient storage stability. It is an object of the present invention to provide a composition comprising an organosilicon compound which is excellent in storage stability. The present invention provides a composition comprising an organosilicon compound (A) represented by the following formula (a1), a metal compound (B) represented by the following formula (b1), a carboxylic acid compound (C), and an acid catalyst. ##STR00001##

Although a composition for formation of a coating film is sometimes required to have satisfactory storage stability, it could not be said that a conventionally known composition has sufficient storage stability. It is an object of the present invention to provide a composition comprising an organosilicon compound which is excellent in storage stability. The present invention provides a composition comprising an organosilicon compound (A) represented by the following formula (a1), a metal compound (B) represented by the following formula (b1), a carboxylic acid compound (C), and an acid catalyst. ##STR00001##

Described herein is a melt flowable polyamide composition for shaped articles, which may include thin wall connectors such as electrical connectors.