After there is prepared a conductive paste which contains fine copper particles having an average particle diameter of 1 to 100 nm, each of the fine copper particles being coated with an azole compound, such as benzotriazole, coarse copper particles having an average particle diameter of 0.3 to 20 μm, at least one of a polyvinylpyrrolidone (PVP) resin and a polyvinyl butyral (PVB) resin, a chlorine compound, and a glycol solvent, such as ethylene glycol, the total amount of the fine copper particles and the coarse copper particles being 50 to 90% by weight, and the weight ratio of the fine copper particles to the coarse copper particles being in the range of from 1:9 to 5:5, the conductive paste thus prepared is applied on a substrate by screen printing to be preliminary-fired by vacuum drying, and then, fired with light irradiation by irradiating with light having a wavelength of 200 to 800 nm at a pulse period of 500 to 2000 μs and a pulse voltage of 1600 to 3800 V to form a conductive film on the substrate.

The invention is based on the novel use of Aluminum Trihydroxide (ATH or Al(OH).sub.3) as a filler for Thermal Interface Materials (TIM).

The invention is based on the novel use of Aluminum Trihydroxide (ATH or Al(OH).sub.3) as a filler for Thermal Interface Materials (TIM).

A composition comprising a mixture of fluoropolyether acids or salts having a number average value of about 800 to about 2500 g/mol. The amount of fluoropolyether acids or salt in the mixture having a molecular weight of not more than 500 g/mol is not more than 50 ppm by weight of the total amount of fluoropolyether acids or salts in the mixture. The amount of fluoropolyether acids or salts in the mixture having a molecular weight of 2500 g/mol or greater is not more than 40% by weight of the total amount of fluoropolyether acids or salts in the mixture. Preferably the fluoropolyether acids or salts comprise an anionic group selected from the group consisting of carboxylate, sulfonate, sulfonamide anion and phosphonate. Also disclosed is an aqueous dispersion polymerization process for fluoropolymer manufacture employing polymerization agent comprising the specified mixture of fluoropolyether acids or salts.

A composition comprising a mixture of fluoropolyether acids or salts having a number average value of about 800 to about 2500 g/mol. The amount of fluoropolyether acids or salt in the mixture having a molecular weight of not more than 500 g/mol is not more than 50 ppm by weight of the total amount of fluoropolyether acids or salts in the mixture. The amount of fluoropolyether acids or salts in the mixture having a molecular weight of 2500 g/mol or greater is not more than 40% by weight of the total amount of fluoropolyether acids or salts in the mixture. Preferably the fluoropolyether acids or salts comprise an anionic group selected from the group consisting of carboxylate, sulfonate, sulfonamide anion and phosphonate. Also disclosed is an aqueous dispersion polymerization process for fluoropolymer manufacture employing polymerization agent comprising the specified mixture of fluoropolyether acids or salts.

A composition comprising a mixture of fluoropolyether acids or salts having a number average value of about 800 to about 2500 g/mol. The amount of fluoropolyether acids or salt in the mixture having a molecular weight of not more than 500 g/mol is not more than 50 ppm by weight of the total amount of fluoropolyether acids or salts in the mixture. The amount of fluoropolyether acids or salts in the mixture having a molecular weight of 2500 g/mol or greater is not more than 40% by weight of the total amount of fluoropolyether acids or salts in the mixture. Preferably the fluoropolyether acids or salts comprise an anionic group selected from the group consisting of carboxylate, sulfonate, sulfonamide anion and phosphonate. Also disclosed is an aqueous dispersion polymerization process for fluoropolymer manufacture employing polymerization agent comprising the specified mixture of fluoropolyether acids or salts.

A random copolymer compound of (A) a polyphenylene ether resin having phenolic hydroxy groups at both ends, (B) an aliphatic polymer having alcoholic hydroxy groups at both ends, and (C) an acid dichloride compound that is a binder is disclosed, wherein the number of mol a of the (A) polyphenylene ether resin, the number of mol b of the (B) aliphatic polymer, and the number of mol c of the (C) acid dichloride compound that is a binder satisfies the relationship (a+b)>c.

A random copolymer compound of (A) a polyphenylene ether resin having phenolic hydroxy groups at both ends, (B) an aliphatic polymer having alcoholic hydroxy groups at both ends, and (C) an acid dichloride compound that is a binder is disclosed, wherein the number of mol a of the (A) polyphenylene ether resin, the number of mol b of the (B) aliphatic polymer, and the number of mol c of the (C) acid dichloride compound that is a binder satisfies the relationship (a+b)>c.

A method for producing a composition containing low molecular weight polytetrafluoroethylene, the method including: (I) irradiating a composition containing high molecular weight polytetrafluoroethylene with ionizing radiation to obtain a composition containing low molecular weight polytetrafluoroethylene having a melt viscosity at 380° C. in the range of 1.0×10.sup.2 to 7.0×10.sup.5 Pa.Math.s; and (II) carrying out fluorination treatment on the composition containing low molecular weight polytetrafluoroethylene obtained above.

A method for producing a composition containing low molecular weight polytetrafluoroethylene, the method including: (I) irradiating a composition containing high molecular weight polytetrafluoroethylene with ionizing radiation to obtain a composition containing low molecular weight polytetrafluoroethylene having a melt viscosity at 380° C. in the range of 1.0×10.sup.2 to 7.0×10.sup.5 Pa.Math.s; and (II) carrying out fluorination treatment on the composition containing low molecular weight polytetrafluoroethylene obtained above.