Patent classifications
C08K5/101
Thermoplastic resin composition for cleaning molding processing machine
To provide a thermoplastic resin composition having an enhanced cleaning performance for cleaning a molding processing machine. The thermoplastic resin composition for cleaning a molding processing machine contains (A) an olefin-based resin, and (B) (B1) a nonionic surfactant having an HLB of 13 to 20, wherein the composition contains component (B) in an amount of 0.5 to 10 parts by mass relative to 100 parts by mass of component (A).
Polyester Composition and Elastomer Coated Article Made Therewith
A polyester polymer composition is disclosed containing reinforcing fibers and having improved adhesion to elastomeric materials while also being formulated for medical applications and/or food service applications. The polyester polymer composition can contain a blend of different polyester polymers and can be free of hindered phenolic antioxidants. The polyester polymer composition can be used in overmolding applications in which the composition is initially molded into a polymer component and then overmolded with an elastomeric material. The elastomeric material can contain a copolyester elastomer and can serve as a sealing member.
Polyester Composition and Elastomer Coated Article Made Therewith
A polyester polymer composition is disclosed containing reinforcing fibers and having improved adhesion to elastomeric materials while also being formulated for medical applications and/or food service applications. The polyester polymer composition can contain a blend of different polyester polymers and can be free of hindered phenolic antioxidants. The polyester polymer composition can be used in overmolding applications in which the composition is initially molded into a polymer component and then overmolded with an elastomeric material. The elastomeric material can contain a copolyester elastomer and can serve as a sealing member.
Plasticizer composition, resin composition, and method of preparing the same
Provided herein are a plasticizer composition, a resin composition, and a method of preparing the plasticizer composition. A plasticizer composition capable of enhancing poor physical properties occurring due to structural limitations and enhancing physical properties such as tensile strength, migration resistance, volatile loss, and the like, which are required when used as a plasticizer of a resin composition, and a resin composition including the same may be provided.
Modified biodegradable and medical polymer devices and a method for preparing the same
A medical polymer device comprising a biodegradable polymer is provided, wherein the biodegradable polymer has a crystallinity of about 10% to about 80%, and preferably from about 20% to about 60%, wherein the medical polymer device comprises a small molecule organic compound which diffuses into the biodegradable polymer, the small molecule organic compound has a molecular weight of from about 100 to about 1000 Daltons, preferably from about 150 to about 500 Daltons, and more preferably from about 150 to about 250 Daltons, and the small molecule organic compound is non-evaporating or low-evaporating. The present invention also provides a method for preparing a medical polymer device according to the present invention as well as a method for modifying a medical polymer device made from a biodegradable polymer.
Modified biodegradable and medical polymer devices and a method for preparing the same
A medical polymer device comprising a biodegradable polymer is provided, wherein the biodegradable polymer has a crystallinity of about 10% to about 80%, and preferably from about 20% to about 60%, wherein the medical polymer device comprises a small molecule organic compound which diffuses into the biodegradable polymer, the small molecule organic compound has a molecular weight of from about 100 to about 1000 Daltons, preferably from about 150 to about 500 Daltons, and more preferably from about 150 to about 250 Daltons, and the small molecule organic compound is non-evaporating or low-evaporating. The present invention also provides a method for preparing a medical polymer device according to the present invention as well as a method for modifying a medical polymer device made from a biodegradable polymer.
Superabsorbent polymer and method for preparing the same
The present invention relates to a superabsorbent polymer that not only has excellent basic absorption performance, but also exhibits more improved absorption speed, permeability, etc., and a method for preparing the same. The superabsorbent polymer includes a base polymer powder including: a first crosslinked polymer of water soluble ethylenically unsaturated monomers having acid groups of which at least a part are neutralized; and a surface crosslink layer that is formed on the base polymer powder, and further includes a second crosslinked polymer in which the first crosslinked polymer is additionally crosslinked by a C2-5 alkylene carbonate, wherein an absorption degree, SFC, an absorption speed, and a porosity fulfill specific ranges.
Superabsorbent polymer and method for preparing the same
The present invention relates to a superabsorbent polymer that not only has excellent basic absorption performance, but also exhibits more improved absorption speed, permeability, etc., and a method for preparing the same. The superabsorbent polymer includes a base polymer powder including: a first crosslinked polymer of water soluble ethylenically unsaturated monomers having acid groups of which at least a part are neutralized; and a surface crosslink layer that is formed on the base polymer powder, and further includes a second crosslinked polymer in which the first crosslinked polymer is additionally crosslinked by a C2-5 alkylene carbonate, wherein an absorption degree, SFC, an absorption speed, and a porosity fulfill specific ranges.
RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
Provided is a resin composition which has good solubility and photocurability, further has good alkaline-developability when containing a photo initiator and a compound containing one or more carboxyl groups, and in addition, is capable of providing a resin sheet having suppressed tackiness; and a resin sheet, multilayer printed wiring board, and semiconductor device using the same. The resin composition of the present invention contains a particular bismaleimide compound (A), and at least two maleimide compounds (B) selected from the group consisting of six kinds of particular compounds which are different from this bismaleimide compound (A).
Plasticizer composition and resin composition including the same
Provided is a plasticizer composition including: a cyclohexane-1,2-diester-based substance of the following Chemical Formula 1; and a citrate-based substance of the following Chemical Formula 2: ##STR00001## wherein in Chemical Formula 1 and Chemical Formula 2: R.sub.1 and R.sub.2 each independently are a C8 to C10 alkyl group; and R.sub.3 to R.sub.5 each independently are a C5 to C10 alkyl group.